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Contextual Info: 256MB 168PIN PC133 CL3 ECC SDRAM DIMM With 32M X 8 3.3VOLT TS32MLS72V6F TO: 研華股份有限公司 APPROVED SHEET ¾TS32MLS72V6F½ SAMSUNG Transcend 創見資訊股份有限公司 Your Supplier, Your Partner, Your Friend. Transcend Information Inc. 地址：台北市內湖區行忠路70號

usb flash drive circuit diagram

Abstract: Transcend circuit pcb transcend flash memory 4gb Transcend circuit diagram TS512MUFM-H Transcend transcend circuits TS4GUFM-H Transcend Flash Drive usb male pcb
Contextual Info: TS128M~4GUFM-H 128MB~4GB USB Flash Module Horizontal Description Features TS128M~4GUFM-H are 128MB~4GB USB Flash • RoHS compliant products Modules (Horizontal) with 1 or 2 pcs of Flash Memory • High-speed USB 2.0 interface assembled on a printed circuit board.

Contextual Info: 144PIN PC133 Unbuffered SO-DIMM 128MB With 16M X 16 CL3 TS16MMS64V6G Description Pin Identification The TS16MMS64V6G is a 16M bit x 64 Synchronous Dynamic RAM high-density memory module. The TS16MMS64V6G Symbol Function A0~A12 Address inputs BA0~BA1 Select Bank

Contextual Info: 144PIN PC133 Unbuffered SO-DIMM 256MB With 16MX16 CL3 TS32MSS64V6G Pin Identification Description The TS32MSS64V6G Dynamic RAM TS32MSS64V6G is a high-density consists 32Mx64 memory of 8 Synchronous module. pieces of Symbol The CMOS Function A0~A12 Address inputs

Contextual Info: 16MB 72 PIN FAST PAGE DRAM SIMM With 4Mx4 5VOLT TS4M3260 Description Features The TS4M3260 is a 4M by 32-bit dynamic RAM module • Fast Page Mode Operation. with 8 pcs of 4Mx4 DRAMs assembled on the printed • Single +5.0V ± 10% power supply. circuit board.

Contextual Info: 168PIN PC133 Unbuffered DIMM 128MB with 16Mx16 CL3 TS16MLS64V6G Placement Description The TS16MLS64V6G is a 16M bit x 64 Synchronous Dynamic RAM high-density memory module. The TS16MLS64V6G consists of 4 piece of CMOS 16Mx16bits Synchronous DRAMs in TSOP-II 400mil packages and a

Contextual Info: 128MB 168PIN PC100 CL2 SDRAM DIMM With 8M X 16 3.3VOLT TS16MLS64V8C2 Dimensions Description The TS16MLS64V8C2 is a 16M bit x 64 Synchronous Side Millimeters Inches Dynamic RAM high-density for PC-100 CL2. The A 133.35±0.40 5.250±0.016 TS16MLS64V8C2 consists of 8pcs CMOS 8Mx16 bits

4MX16

Contextual Info: 64MB 144 PIN SO-DIMM With 4Mx16 EDO DRAM 3.3VOLT TS8MES64V6EZ Pin Identification Description The TS8MES64V6EZ is an 8M x 64-bit dynamic Symbol Function RAM high-density memory module. It consists of A0~A11 Address inputs 8pcs of 4Mx16 DRAMs assembled on the printed

Contextual Info: 128MB 168Pin PC133 CL3 SDRAM DIMM With 16Mx8 3.3VOLT JM317S643A-75
Description Placement
The JM317S643A-75 is a 16M bit x 64 Synchronous Dynamic RAM high density for PC-133. The JM317S643A-75 consists of 8pcs CMOS 16Mx8 bits Synchronous DRAMs in TSOP-II 400mil packages and

Contextual Info: 32MB 168 PIN PC100 SDRAM DIMM With 4M X16 3.3VOLT TS4MLS64V8Z Description the system clock. Placement The TS4MLS64V8Z is a 4M x 64 bits Synchronous Dynamic RAM high density for PC-100. The TS4MLS64V8Z consists of 4pcs CMOS 4Mx16 bits Synchronous DRAMs in TSOP-II 400mil packages and

Contextual Info: 128MB 168Pin PC100 CL3 ECC SDRAM DIMM With 16Mx8 3.3VOLT TS16MLS72V8D
Description Placement
The TS16MLS72V8D is a 16M bit x 64 Synchronous Dynamic RAM high density for PC-133. The TS16MLS72V8D consists of 8pcs CMOS 16Mx8 bits Synchronous DRAMs in TSOP-II 400mil packages and

Contextual Info: 168PIN PC133 Unbuffered DIMM 256MB With 32M X 8 CL3 TS32MLS64V6F Description Placement The TS32MLS64V6F is a 32M x 64bits Synchronous Dynamic RAM high-density for PC-133. The TS32MLS64V6F consists of 8pcs CMOS 32Mx8 bits Synchronous DRAMs in TSOP-II 400mil packages and

Contextual Info: 144PIN PC133 Unbuffered SO-DIMM 256MB With 16M X 8 CL3 TS32MSS64V6L Pin Identification Description The TS32MSS64V6L is a 32M bit x 64 Synchronous Dynamic RAM high-density memory modules. Symbol The Function A0~A11 Address inputs BA0, BA1 Select Bank serial EEPROM on a 144-pin printed circuit board. The

Contextual Info: 64MB 168PIN PC100 CL3 SDRAM DIMM With 8M X 8 3.3VOLT
TS8MLS72V8W

Description Placement The TS8MLS72V8W is a 8M x 72bits Synchronous Dynamic RAM high density for PC-100. The TS8MLS72V8W consists of 9pcs CMOS 8Mx8 bits Synchronous DRAMs in TSOP-II 400mil packages and

Contextual Info: 168PIN PC133 Unbuffered DIMM 64MB With 8Mx16 CL3 TS8MLS64V6C Description Placement The TS8MLS64V6C is a 8M bit x 64 Synchronous Dynamic RAM high density for PC-133. The TS8MLS64V6C consists of 4pcs CMOS 8Mx16 bits Synchronous DRAMs in TSOP-II 400mil packages and a

Contextual Info: 168PIN PC100 Unbuffered DIMM 512MB With 32MX8 CL2 TS64MLS64V8F2 Description Placement The TS64MLS64V8F2 is a 64M bit x 64 Synchronous Dynamic RAM high-density for PC-100. The TS64MLS64V8F2 consists of 16pcs CMOS 32Mx8 bits Synchronous DRAMs in TSOP-II 400mil packages and a

Contextual Info: 168PIN PC133 Unbuffered DIMM 256MB With 32M X 8 CL3 TS32MLS64V6F Description Placement The TS32MLS64V6F is a 32M x 64bits Synchronous Dynamic RAM high-density for PC-133. The TS32MLS64V6F consists of 8pcs CMOS 32Mx8 bits Synchronous DRAMs in TSOP-II 400mil packages and

Contextual Info: 168PIN PC133 Unbuffered DIMM 128MB with 8MX8 CL3 TS16MLS64V6W Description Placement The TS16MLS64V6W is a 16M bit x 64 Synchronous Dynamic RAM high-density for PC-133. The TS16MLS64V6W consists of 16pcs CMOS 8Mx8 bits Synchronous DRAMs in TSOP-II 400mil packages and

Contextual Info: 168PIN PC133 Unbuffered DIMM 256MB With 32MX 8 CL3 TS32MLS64V6L Placement Description The TS32MLS64V6L is a 32M bit x 64 Synchronous Dynamic RAM high-density memory module. The TS32MLS64V6L consists of 8 piece of CMOS 32Mx8bits Synchronous DRAMs in TSOP-II 400mil packages and a

Contextual Info: 168PIN PC133 Unbuffered DIMM 256MB With 16Mx16 CL3 TS32MLS64V6G Description Placement The TS32MLS64V6G is a 32M bit x 64 Synchronous Dynamic RAM high-density memory modules. The TS32MLS64V6G consists of 8 piece of CMOS 16Mx16bits Synchronous DRAMs in TFBGA 400mil packages and a

Contextual Info: 168Pin PC133 ECC Unbuffered DIMM 128MB With 16Mx8 CL3 TS16MLS72V6D Description Placement The TS16MLS72V6D is a 16M x 72bits Synchronous Dynamic RAM high density for PC-133. The TS16MLS72V6D consists of 9pcs CMOS 16Mx8 bits Synchronous DRAMs in TSOP-II 400mil packages and

Contextual Info: 168PIN PC133 Unbuffered DIMM 512MB With 32Mx8 CL2 TS64MLS64V6F2 Placement Description The TS64MLS64V6F2 is a 64M bit x 64 Synchronous Dynamic RAM high-density for PC-133. The TS64MLS64V6F2 consists of 16pcs CMOS 32Mx8 bits Synchronous DRAMs in TSOP-II 400mil packages and

Contextual Info: 256MB 168 PIN PC133 CL3 SDRAM DIMM With 16Mx8 3.3VOLT JM333S643A-75
Placement

Description The JM333S643A-75 is a 32M bit x 64 Synchronous Dynamic RAM high density for PC-133. The JM333S643A-75 consists of 16pcs CMOS 16Mx8 bits Synchronous DRAMs in TSOP-II 400mil packages and a

Contextual Info: 16MB 72 PIN FAST PAGE DRAM SIMM With 4Mx4 5VOLT
TS4M3660Q

Description Features The TS4M3660Q is a 4M by 36-bit dynamic RAM module • 4,194,304-word by 36-bit organization. with 8pcs of 4Mx4 DRAMs and one 4Mx4 QuadCAS • Fast Page Mode operation. DRAM assembled on the printed circuit board.