TQFP100 PACKAGE Search Results

9536XL

Abstract: 9572XL xc9572xl vqfp64 XC9500XL XC9500XL csp48 xc95144xl tq144 b12108 95144XL
Contextual Info: XILINX PROGRAMMER QUALIFICATION SPECIFICATION XC9500XL FAMILY 1. Introduction This document pertains to the following devices and packages: 9536XL - PLCC44, CSP48, and VQFP64 9572XL - PLCC44, CSP48, VQFP64, and TQFP100 95144XL - TQFP100, TQFP144, and CSP144

ADSTB xilinx

Abstract: Add.dat XILINX/TSOP 137
Contextual Info: XILINX PROGRAMMER QUALIFICATION SPECIFICATION XC9500XL FAMILY 1. Introduction This document pertains to the following devices and packages: 9536XL - PLCC44, CSP48, and VQFP64 9572XL - PLCC44, CSP48, VQFP64, and TQFP100 95144XL - TQFP100, TQFP144, and CSP144

tQFP100 package

Abstract: Atmel STK600 schematic STK600 SC03 New products 1
Contextual Info: Products: 0 Home / Starter kits Subtotal: $0 Shopping List Search / Atmel STK600 -TQFP100 Starter kits Home Store Search Starter kits Select Device Select Category Enter Keywords: Debuggers Starter kits Programmers Atmel STK600 -TQFP100 ATSTK600 -SC03 Touch kits

TQFP100

Abstract: TQFP-100
Contextual Info: Philips Semiconductors Package outlines TQFP100: plastic thin quad flat package; 100 leads; body 14 x 14 x 1.0 mm 1997 Aug 04 639 SOT386-1

Contextual Info: TQFP100-P-1414-0.50-K 0.125t Mirror finish 5 Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.55 TYP. 1/Mar. 30, 2000

TQFP100-P-1414-0

Abstract: TQFP100-P
Contextual Info: TQFP100-P-1414-0.50-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.55 TYP. 4/Oct. 28, 1996

P-TQFP100-12x12-0

Abstract: TQFP100 100GV
Contextual Info: JEITA Package Code P-TQFP100-12x12-0.40 RENESAS Code PTQP0100LC-A Previous Code TFP-100G/TFP-100GV MASS[Typ.] 0.4g HD *1 NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. D 75 51 76 50 HE b1 26 Terminal cross section

Contextual Info: MN101C56A , MN101C56C Type ROM x× 8-bit MN101C56A (under planning) MN101C56C 32 K 48 K 1.5 K 1.79 K External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package TQFP100-P-1414E *Pb free (under planning) Minimum Instruction Execution Time

MN101C56A

Abstract: MN101C56C
Contextual Info: MN101C56A , MN101C56C Type ROM x× 8-bit MN101C56A (under planning) MN101C56C (under development) 32 K 48 K 1.79 K 1.79 K External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package TQFP100-P-1414E Minimum Instruction Execution Time

TQFP100

Abstract: tQFP100 package TQFP100-P-1414-0
Contextual Info: TQFP100-P-1414-0.50-K Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

tQFP pitch

Abstract: TQFP100
Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE 100 PIN PLASTIC FPT-100P-M09 EIAJ code : TQFP100-P-1414-1 100-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 14x14 mm Lead shape Gullwing Sealing method Plastic mold FPT-100P-M09 100-pin plastic TQFP (FPT-100P-M09)

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TQFP100 package SOT386-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land

MN101C56A

Abstract: MN101C56C
Contextual Info: MN101C56A , MN101C56C Type ROM x× 8-bit MN101C56A (under planning) MN101C56C 32 K 48 K 1.5 K 1.79 K External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package TQFP100-P-1414E *Pb free Minimum Instruction Execution Time 0.1 µs (at 4.5 V to 5.5 V, 20 MHz)

PTQP0100KA-A

Abstract: TQFP100
Contextual Info: JEITA Package Code P-TQFP100-14x14-0.50 RENESAS Code PTQP0100KA-A Previous Code TFP-100B/TFP-100BV MASS[Typ.] 0.5g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 75 51 76 50 bp c c1 HE Reference

Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC To Top / Package Lineup / Package Index FPT-100P-M09 EIAJ code : TQFP100-P-1414-1 100-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 14 × 14 mm Lead shape

Contextual Info: MN101C56A , MN101C56C Type ROM x× 8-bit MN101C56A (under planning) MN101C56C 32 K 48 K 1.5 K 1.79 K External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package TQFP100-P-1414E *Pb free (under planning) Minimum Instruction Execution Time

TQFP100

Contextual Info: JEITA Package Code P-TQFP100-12x12-0.40 RENESAS Code PTQP0100LB-A Previous Code 100PFB-A MASS[Typ.] 0.4g HD *1 D 75 51 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. *2 HE 50 E 76 26 1 25 ZD Reference

TQFP100

Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC FPT-100P-M09 EIAJ code : TQFP100-P-1414-1 100-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 14 × 14 mm Lead shape Gullwing Sealing method Plastic mold FPT-100P-M09

TQFP100

Contextual Info: JEITA Package Code P-TQFP100-14x14-0.50 RENESAS Code PTQP0100KB-D Previous Code TFP-100JV MASS[Typ.] 0.5g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 75 51 76 50 HE c Reference Symbol *2 E

Contextual Info: JEITA Package Code P-TQFP100-14x14-0.50 RENESAS Code PTQP0100KA-A Previous Code TFP-100B/TFP-100BV MASS[Typ.] 0.5g HD *1 D 75 51 76 NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. 50 bp c c1 HE *2 E b1

TQFP100-P-1212-0

Abstract: 100PFB-A
Contextual Info: 100PFB-A Plastic 100pin 12✕12mm body TQFP EIAJ Package Code TQFP100-P-1212-0.40 Weight g Lead Material Cu Alloy MD e JEDEC Code – HD Under Development 76 b2 100 ME D 1 75 l2 25 HE E Recommended Mount Pad Symbol 51 26 50 A L1 e b y A1 c A2 F L Detail F

TQFP100

Contextual Info: 100P6V-A Plastic 100pin 12✕12mm body TQFP EIAJ Package Code TQFP100-P-1212-0.40 Weight g JEDEC Code – Lead Material Alloy 42 HD D 100 76 1 HE E 75 Symbol 25 51 26 50 A L1 F y A1 b c A2 e L Detail F A A1 A2 b c D E e HD HE L L1 y Dimension in Millimeters

MS-026

Abstract: 137e20 TQFP100 MS-026 tqfp100
Contextual Info: PDF: 2003 Mar 28 Philips Semiconductors Package outline TQFP100: plastic thin quad flat package; 100 leads; body 14 x 14 x 1 mm SOT386-1 c y X A 51 75 50 76 ZE e E HE A A2 w M A 3 A1 θ bp Lp pin 1 index L 100 detail X 26 1 25 ZD e v M A w M bp D B HD v M B

Contextual Info: 100PFD-B Plastic 100pin 14 ✕20mm body TQFP Weight g JEDEC Code – Lead Material Cu Alloy MD e EIAJ Package Code TQFP100-P-1420-0.65 HD 100 ME D 1 b2 76 75 l2 Symbol HE E Recommended Mount Pad A A1 A2 b c D E e HD HE L L1 y 51 25 26 A 50 L1 F b y A1 c A2