TQFP 44 THERMAL RESISTANCE DATASHEET Search Results

EP4CE6 package

Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
Contextual Info: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

EP4CE15

Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
Contextual Info: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

GS816019T-250

Abstract: GSI errata
Contextual Info: Revision: 5/17/02 GS816019/33/37T Datasheet Errata Base datasheet: GS816019/33/37T, Rev.1.00, 3/2002 Product s covered in this supplement: GS816019/33/37T-250/225/200/166/150/133 Product specification(s) addressed by this supplement: Pin 14 Note: The specifications cited in the base datasheet for the products addressed by this errata remain in force except where

Contextual Info: Revision: 5/17/02 GS816019/33/37AT Datasheet Errata Base datasheet: GS816019/33/37AT, Rev.1.00, 3/2002 Product s covered in this supplement: GS816019/33/37AT-300/275/250/225/200 Product specification(s) addressed by this supplement: Pin 14 Note: The specifications cited in the base datasheet for the products addressed by this errata remain in force except where

ATSAMD21G18

Contextual Info: Atmel SAM D21E / SAM D21G / SAM D21J SMART ARM-Based Microcontroller DATASHEET SUMMARY Description The Atmel | SMART SAM D21 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®-M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and

ATMEL Tape and Reel drawing

Abstract: ATMEL Tape and Reel code JEDEC Drawing MO-220 qfn48 Atmel Moisture sensitivity level Moisture/ATMEL Tape and Reel QFN-64 ATSAMD21G18
Contextual Info: Atmel SAM D21E / SAM D21G / SAM D21J SMART ARM-Based Microcontroller DATASHEET SUMMARY Description The Atmel | SMART SAM D21 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®-M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and

ATSAMD21G18

Contextual Info: Atmel SAM D21E / SAM D21G / SAM D21J ARM-Based Microcontroller PRELIMINARY DATASHEET SUMMARY Description The Atmel SAM D21 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and 32KB of SRAM. The

ATSAMd21g18

Abstract: JEDEC Drawing MO-220 qfn48
Contextual Info: Atmel SAM D21E / SAM D21G / SAM D21J ARM-Based Microcontroller PRELIMINARY DATASHEET SUMMARY Description The Atmel SAM D21 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and 32KB of SRAM. The

GSI errata

Abstract: GS88019A GS88033A GS88037A 37at
Contextual Info: Revision: 5/17/02 GS88019/33/37AT Datasheet Errata Base datasheet: GS88019/33/37AT, Rev.1.00, 3/2002 Product s covered in this supplement: GS88019/33/37AT-250/225/200/166/150/133 Product specification(s) addressed by this supplement: Pin 14 Note: The specifications cited in the base datasheet for the products addressed by this errata remain in force except where

Contextual Info: Atmel SAM D20J / SAM D20G / SAM D20E ARM-Based Microcontroller DATASHEET SUMMARY Description The Atmel SAM D20 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®-M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and

ATSAMD21G18

Contextual Info: Atmel SAM D21E / SAM D21G / SAM D21J SMART ARM-Based Microcontroller DATASHEET SUMMARY Description The Atmel | SMART SAM D21 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®-M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and

Contextual Info: VSC7124 Datasheet FEATURES ● ● ● ● ● ● ● ANSI X3T11 Fibre Channel-compliant at 1.0625 Gbps IEEE 802.3z GbE-compliant at 1.25 Gbps Five-port bypass circuits PBCs On-chip transmit termination 3.3 V, 0.25 W typical power 0.35 micron CMOS, a velocity family member

Contextual Info: VSC7124 Datasheet FEATURES ● ● ● ● ● ● ● ANSI X3T11 Fibre Channel-compliant at 1.0625 Gbps IEEE 802.3z GbE-compliant at 1.25 Gbps Five-port bypass circuits PBCs On-chip transmit termination 3.3 V, 0.25 W typical power 0.35 micron CMOS, a velocity family member

SiI168

Abstract: SII168 Panel link receiver SiI-AN-0030 DVI RECEIVER PCB design guidelines Sii161 Silicon Image SiI-AN-0045 PanelLink Transmitter tqfp 64 pcb land pattern dvi dual link D 24 5
Contextual Info: SiI 161A PanelLink Receiver Datasheet March 2001 Features The SiI 161A receiver uses PanelLink Digital technology to support high resolution displays up to UXGA. The SiI 161A receiver supports up to true color panels 24 bit/pixel, 16.7M colors in 1 or 2 pixels/clock mode. In

GS881E18A

Abstract: GS881E18AD-166 GS881E18AD-200 GS881E18AD-225 GS881E18AD-250
Contextual Info: Revision: 4/26/02 GS881E18/32/36AD Supplemental Datasheet Information This supplemental information applies to the GS881E18/36AT datasheet, which you will find attached to this document. This supplement includes a new package offering the 165-bump BGA—Package D , as well as an additional organization (x32, which is only

GS88118A

Abstract: GS88118AD-166 GS88118AD-200 GS88118AD-225 GS88118AD-250
Contextual Info: Revision: 4/26/02 GS88118/32/36AD Supplemental Datasheet Information This supplemental information applies to the GS88118/36AT datasheet, which you will find attached to this document. This supplement includes a new package offering the 165-bump BGA—Package D , as well as an additional organization (x32, which is only

ep330

Abstract: CLASSIC EPLD FAMILY altera EP1810
Contextual Info: Operating Requirements for Altera Devices March 1995, ver. 6 Datasheet A ltera devices com bine unique program m able logic architectures w ith advanced C M O S processes to p rovid e exceptional perform ance and re lia b ility. To m aintain the highest possible perform ance and re lia b ility of

Contextual Info: Preliminary GS8150F18/32/36T-7/8/8.5/10/11 1M x 18, 512K x 32, 512K x 36 16Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • Flow Through mode operation; Pin 14 = No Connect • 3.3 V +10%/–5% core power supply • 2.5 V or 3.3 V I/O supply

GS840F18A

Abstract: GS840F32A GS840F36A
Contextual Info: Preliminary GS840F18/32/36AT-7.5/8/8.5/10/12 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs TQFP, BGA Commercial Temp Industrial Temp Features Designing For Compatibility • Flow Through mode operation • 3.3 V +10%/–5% core power supply • 2.5 V or 3.3 V I/O supply

Contextual Info: GS840FH18/32/36AT-8/8.5/10/12 TQFP Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • Flow Through mode operation • 3.3 V +10%/–5% core power supply • 2.5 V or 3.3 V I/O supply • LBO pin for Linear or Interleaved Burst mode

GS840FH18AT-8

Contextual Info: GS840FH18/32/36AT-8/8.5/10/12 TQFP Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • Flow Through mode operation • 3.3 V +10%/–5% core power supply • 2.5 V or 3.3 V I/O supply • LBO pin for Linear or Interleaved Burst mode

GS880F18A

Abstract: GS880F32A GS880F36A
Contextual Info: Preliminary GS880F18/32/36AT-5.5/6/6.5/7/7.5/8.5 100-Pin TQFP Commercial Temp Industrial Temp 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • Flow Through mode operation; Pin 14 = No Connect • 2.5 V or 3.3 V +10%/–10% core power supply

GS88019A

Abstract: GS88033A GS88037A
Contextual Info: Preliminary GS88019/33/37AT-250/225/200/166/150/133 100-Pin TQFP Commercial Temp Industrial Temp 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features SCD Pipelined Reads • Single Cycle Deselect SCD operation • 2.5 V or 3.3 V +10%/–10% core power supply

Contextual Info: Preliminary GS816019/33/37T-250/225/200/166/150/133 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features Byte Write and Global Write • Single Cycle Deselect SCD operation • 2.5 V or 3.3 V +10%/–10% core power supply