TQFP 14X20 Search Results

cel-9200

Abstract: 140C 8361H A112-A CEL9200 JESD22
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97302 VERSION 1.0 October, 1997 100 Pins TQFP Package 14x20x1.4mm ASE, Taiwan Assembly Cypress Semiconductor Assembly: ASE, Taiwan Package: TQFP QTP# 97302, V. 1.0 Page 2 of 4 June, 1997 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION

TQFP JEDEC tray

Contextual Info: HEAT PROOF 105.0 7 135°C MAX PPE 17.5 A' 15.45 21.00 A TQFP 14x20×1.0 6×12=72 135.9 UNIT : mm 23.5 25.40 17.80 279.4 315.0 322.6 SECTION A – A' Applied Package 100-pin Plastic TQFP (1.0mm thick) 5.62 6.35 7.62 23.5 Quantity (pcs) MAX. 72 Tray Material

Contextual Info: September 2001 Preliminary Information AS7C33512PFS16A AS7C33512PFS18A 3.3V 512K x 16/18 pipeline burst synchronous SRAM Features • Pentium®* compatible architecture and timing • Asynchronous output enable control • Economical 100-pin TQFP package

Contextual Info: September 2001 Preliminary Information AS7C33512PFD16A AS7C33512PFD18A 3.3V 512K x 16/18 pipeline burst synchronous SRAM Features • Pentium®* compatible architecture and timing • Asynchronous output enable control • Economical 100-pin TQFP package

Contextual Info: October 2001 Preliminary Information AS7C33512PFS16A AS7C33512PFS18A 3.3V 512K x 16/18 pipeline burst synchronous SRAM Features • Pentium®* compatible architecture and timing • Asynchronous output enable control • Economical 100-pin TQFP package

Contextual Info: September 2001 Preliminary Information AS7C33512PFD16A AS7C33512PFD18A 3.3V 512K x 16/18 pipeline burst synchronous SRAM Features • Pentium®* compatible architecture and timing • Asynchronous output enable control • Economical 100-pin TQFP package

Contextual Info: Advance Information August 2001 AS7C33512PFD16A AS7C33512PFD18A 3.3V 512K x 16/18 pipeline burst synchronous SRAM Features • Pentium®* compatible architecture and timing • Asynchronous output enable control • Economical 100-pin TQFP package • Byte write enables

Contextual Info: Advance Information August 2001 AS7C33512PFS16A AS7C33512PFS18A 3.3V 512K x 16/18 pipeline burst synchronous SRAM Features • Pentium®* compatible architecture and timing • Asynchronous output enable control • Economical 100-pin TQFP package • Byte write enables

Contextual Info: A Advance information •■ I l AS7C3256K36Z AS7C3256K32Z 3.3V 256Kx32/36 synchronous burst SRAM with NTD Features • • • • • • • • • Multiple packaging options - Economical 100-pin TQFP package - Chip-scale fBGA package for smallest footprint

Contextual Info: December 2002 AS7C33128PFS16A AS7C33128PFS18A 3.3V 128K x 16/18 pipeline burst synchronous SRAM Features • Asynchronous output enable control • Economical 100-pin TQFP package • Byte write enables • Multiple chip enables for easy expansion • 3.3V core power supply

Contextual Info: April 2002 Preliminary AS7C33512PFS16A AS7C33512PFS18A 3.3V 512K x 16/18 pipeline burst synchronous SRAM Features • • • • • • • • Asynchronous output enable control • Available in 100-pin TQFP and 119-ball BGA package • Byte write enables

Contextual Info: September 2002 AS7C33128PFS16A AS7C33128PFS18A 3.3V 128K x 16/18 pipeline burst synchronous SRAM Features • Asynchronous output enable control • Economical 100-pin TQFP package • Byte write enables • Multiple chip enables for easy expansion • 3.3V core power supply

Contextual Info: ASIC # Standard Cells Package List Numerical value in the list means pin count. QFP, QFH, TQFP, LQFP Type Dimension (unit) Package \ Pin pitch (mm) (mm Xm m ) 7d 40,44 1.51,2.0t 0.8 Q FP'2 10D 0.65 12° 14a 14X20 18° QFH*2 64 2.0t 84 2.5t 64 2.0t 80 2.0t

SOP48

Abstract: CF RM sot89 SOP38 14X14X2 epson QFP 216 14X14X1 45x45 mm bga 14X20X2 14x14x2.7 QFP13
Contextual Info: Plastic QFP Pin Count 44 46 48 52 60 64 80 100 120 128 144 160 176 184 208 216 232 240 256 304 Package code QFP 13 QFP4 QFP2 QFP6 QFP5 QFP12 QFP5 QFP6 QFP2 QFP6 QFP5 QFP13 QFP15 QFP6 QFP5 Plastic TQFP Body size mm 10X10X1.4 10X10X1.45 14X14X2 14X14X2.7 14X20X2.7

Contextual Info: Advance information •■ Il AS7C3256K36Z AS7C3256K32Z II 3.3V 256Kx32/36 synchronous burst SRAM with ZBT1 Features • • • • • • • • • • M ultiple packaging options - Economical 100-pin TQFP package - Chip-scale fBGA package for smallest footprint

Contextual Info: March 2002 AS7C33512PFD16A AS7C33512PFD18A 3.3V 512K x 16/18 pipeline burst synchronous SRAM Features • Asynchronous output enable control • Available in 100-pin TQFP and 119-pin BGA package • Byte write enables • Multiple chip enables for easy expansion

GR-253

Abstract: GR-499-CORE XRT73L02M XRT73L02MIV XRT75L03
Contextual Info: XRT73L02M xr TWO CHANNEL E3/DS3/STS-1 LINE INTERFACE UNIT MAY 2003 GENERAL DESCRIPTION The XRT73L02M is a two-channel fully integrated Line Interface Unit LIU for E3/DS3/STS-1 applications. It incorporates independent Receivers, Transmitters in a single 100 pin TQFP package.

IDT70V28L20PFGI

Abstract: IDT72V36110L7-5PFG idt5t93gl161pfi IDT7024L35PFI IDT7024L15PFGI IDT71321LA20PFG IDT71V321L55TFG IDT72V36110L15PFG IDT70V22L20PF IDT70V25L25PFGI
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A0603-04 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: DATE: 5/8/2006 TQFP and PQFP Products (See attached affected part # list)

Contextual Info: XRT73L02M xr TWO CHANNEL E3/DS3/STS-1 LINE INTERFACE UNIT MAY 2003 GENERAL DESCRIPTION The XRT73L02M is a two-channel fully integrated Line Interface Unit LIU for E3/DS3/STS-1 applications. It incorporates independent Receivers, Transmitters in a single 100 pin TQFP package.

Contextual Info: February 2004 AS7C33256NTD18B 3.3V 256Kx18 SRAM with NTDTM Features 1 NTD is a trademark of Alliance Semiconductor Corporation. • Economical 100-pin TQFP package • Byte write enables • Clock enable for operation hold • Multiple chip enables for easy expansion

ADA17

Contextual Info: Advance information •■ I l AS7C3256K36Z AS7C3256K32Z A 3.3V 2 5 6 K x 32/36 synchronous burst SRAM with ZBT1 Features Multiple packaging options - Economical 100-pin TQFP package - Chip-scale fBGA package for smallest footprint Byte write enables Qock enable for operation hold

Contextual Info: December 2002 AS7C33256NTD16B AS7C33256NTD18B 3.3V 256Kx16/18 SRAM with NTDTM Features 1 NTD is a trademark of Alliance Semiconductor Corporation. • Economical 100-pin TQFP package • Byte write enables • Clock enable for operation hold • Multiple chip enables for easy expansion

AS7C33512PFD16A

Abstract: AS7C33512PFD18A AS7C33512PFS16A AS7C33512PFS18A TMS320C6X PENTIUM 1
Contextual Info: March 2002 AS7C33512PFS16A AS7C33512PFS18A 3.3V 512K x 16/18 pipeline burst synchronous SRAM Features • • • • • • • • Asynchronous output enable control • Available in 100-pin TQFP and 119-ball BGA package • Byte write enables • Multiple chip enables for easy expansion

68 pin plcc socket view bottom

Abstract: 28 PIN plcc socket 32 pin plcc socket 84 Pin PLCC Socket plcc socket 68 PLCC bottom view 32 pin plcc socket view bottom plcc socket AK28PLCC-PGA 84 pin PGA socket AK52PLCC-PGA
Contextual Info: Accutek Microcircuit Corporation DESCRIPTION The Accutek family of PGA Adapter Modules are designed to permit the soldering of surface mount PLCC, QFP, TQFP, PQFP devices into a standard PGA through-hole PC board. These PGA Adapter Modules are a pin compatible drop in replacement for end-of-life