TQFP 100 PACKAGE FOOTPRINT Search Results

qfn 44 PACKAGE footprint

Abstract: qfn 76 PACKAGE footprint ML6652CM qfn 48 PACKAGE footprint QFN 36 footprint qfn 64 pcb layout ML6652CH ML6652 LPCC44 eco solder paste
Contextual Info: AN-002 - ML6652 TQFP-LPCC DUAL FOOTPRINT TECHNIQUE AN-002 ML6652 TQFP-LPCC DUAL FOOTPRINT TECHNIQUE Introduction In November 2003, the ML6652CM/EM package version of the ML6652 10/100 Mb/s Ethernet Media Converter was introduced. The ML6652CM/EM is the QFN/LPCC44 package version of the ML6652. The

Contextual Info: A Advance information •■ I l AS7C3256K36Z AS7C3256K32Z 3.3V 256Kx32/36 synchronous burst SRAM with NTD Features • • • • • • • • • Multiple packaging options - Economical 100-pin TQFP package - Chip-scale fBGA package for smallest footprint

Contextual Info: Advance information •■ Il AS7C3256K36Z AS7C3256K32Z II 3.3V 256Kx32/36 synchronous burst SRAM with ZBT1 Features • • • • • • • • • • M ultiple packaging options - Economical 100-pin TQFP package - Chip-scale fBGA package for smallest footprint

sd3-75

Abstract: FDC37C67X FDC37C93X cross PD6 GP20 GP25 SA10 SMSC Corporation cross reference
Contextual Info: APPLICATION NOTE 6.13 FDC37C67x/FDC37C93x Dual Footprint By Nizar Azzam This document describes a dual footprint layout for the FDC37C67x and the FDC37C93x. The FDC37C67x is a 100 pin QFP/TQFP package and the FDC37C93x is a 160 pin QFP package. Refer to FDC37C67x and

ADA17

Contextual Info: Advance information •■ I l AS7C3256K36Z AS7C3256K32Z A 3.3V 2 5 6 K x 32/36 synchronous burst SRAM with ZBT1 Features Multiple packaging options - Economical 100-pin TQFP package - Chip-scale fBGA package for smallest footprint Byte write enables Qock enable for operation hold

SERIRQ

Abstract: cross PD6
Contextual Info: APPLICATION NOTE 6.13 FDC37C67x/FDC37C93x Dual Footprint By Nizar Azzam This document describes a dual footprint layout for the FDC37C67x and the FDC37C93x. The FDC37C67x is a 100 pin QFP/TQFP package and the FDC37C93x is a 160 pin QFP package. Refer to FDC37C67x and FDC37C93x data sheets for more information.

351N

Abstract: FBGA-F
Contextual Info: Advance information •■ I l A S7C3256K36Z A S7C3256K32Z I 3.3V 2 5 6 K x 3 2 /3 6 synchronous burst SRAM with ZB T1 Features • • • • • • • • • M ultiple p ackagin g op tion s - Econom ical 100-pin TQFP package - C hip-scale fBGA package for sm allest footprint

A301D

Abstract: A211D 4bc 82
Contextual Info: $GYDQFHLQIRUPDWLRQ $6&.3 $6&.3 9.ðSLSHOLQHEXUVWV\QFKURQRXV65$0  HDWXUHV • Multiple packaging options - Economical 100-pin TQFP package - Chip-scale fBGA package for smallest footprint • Byte write enables • Clock enable for operation hold

seven segment 10-pa5

Abstract: 1480B 4480B
Contextual Info: Data Sheet LANCAM B Family APPLICATION BENEFITS DISTINCTIVE CHARACTERISTICS • New low-cost LANCAM family in a space-saving TQFP package • • Fast speed allows processing of both DA and SA within 450 ns, equivalent to 138 ports of 10 Base-T or 13 ports of 100 Base-T Ethernet

Contextual Info: $GYDQFHLQIRUPDWLRQ $6&.= $6&.= 9.ðV\QFKURQRXVEXUVW65$0ZLWK17'Œ  HDWXUHV • Multiple packaging options - Economical 100-pin TQFP package - Chip-scale fBGA package for smallest footprint • Byte write enables • Clock enable for operation hold

seven segment 10-pa5

Abstract: seven segment data sheet 10-pa5 10-pa5 1480B 4480B
Contextual Info: Data Sheet Draft LANCAM B Family APPLICATION BENEFITS DISTINCTIVE CHARACTERISTICS • New low-cost LANCAM family in a space-saving TQFP package • • Fast speed allows processing of both DA and SA within 450 ns, equivalent to 138 ports of 10 Base-T or 13 ports of 100 Base-T Ethernet

XC95144XL-10TQG100C

Abstract: XC95144XL-10TQ100I XC95144XL-10CSG144C XC95144XL-10TQ144I XC95144XL-5-TQ100 XC95144XL-10TQG144C xc95144xl XC95144XL-10TQG100I XC95144XL-7TQ100C TQFP 100 PACKAGE footprint
Contextual Info: XC95144XL High Performance CPLD R DS056 v2.0 April 3, 2007 Features • • • • • • • • • • • 5 ns pin-to-pin logic delays System frequency up to 178 MHz 144 macrocells with 3,200 usable gates Available in small footprint packages - 100-pin TQFP (81 user I/O pins)

xc9572xl pin configuration

Abstract: XC9572XL XC9572XL-10PCG44C XC9572XL-10CS48I XC9572XL-10VQG44C XC9572XL-7TQ100C XC9572XL-10PC44C xc9572xl-10PCG44C pin XC9572XL-7PCG44C XC9572XL-5TQG100C
Contextual Info: XC9572XL High Performance CPLD R DS057 v2.0 April 3, 2007 Features • • • • • • • • • • • 5 ns pin-to-pin logic delays System frequency up to 178 MHz 72 macrocells with 1,600 usable gates Available in small footprint packages - 44-pin PLCC (34 user I/O pins)

12 ohm register

Abstract: 0 OHM RESISTOR FDC37C669FR FDC37N769
Contextual Info: APPLICATION NOTE 7.0 FDC37C669FR and FDC37N769 Dual Layout By Nizar Azzam This application note describes a dual footprint layout for the SMSC FDC37C669FR and the SMSC FDC37N769. This is a TQFP package design since the SMSC FDC37N769 comes in a TQFP package only. There are two parts

Contextual Info: XC95144XV High-Performance CPLD DS051 v2.5 September 13, 2002 1 Features • • • • • • • • 144 macrocells with 3,200 usable gates Available in small footprint packages - 100-pin TQFP (81 user I/O pins) - 144-pin TQFP (117 user I/O pins) - 144-pin CSP (117 user I/O pins)

XC95144

Contextual Info: XC95144XV High-Performance CPLD DS051 v2.8 April 15, 2005 1 Features • • • • • • • • 144 macrocells with 3,200 usable gates Available in small footprint packages - 100-pin TQFP (81 user I/O pins) - 144-pin TQFP (117 user I/O pins) - 144-pin CSP (117 user I/O pins)

xc95144xl tq144

Contextual Info: XC95144XL High Performance CPLD DS056 v1.3 October 13, 2000 5 Features • • • • • • • • • • • 5 ns pin-to-pin logic delays System frequency up to 222 MHz 144 macrocells with 3,200 usable gates Available in small footprint packages - 100-pin TQFP (81 user I/O pins)

k3402

Abstract: 131C-6 XC95144XV-7TQ144I CS144 TQ100 TQ144 XAPP361 XC9500XV XC95144XV
Contextual Info: XC95144XV High-Performance CPLD DS051 v2.7 August 21, 2003 1 Features • • • • • • • • 144 macrocells with 3,200 usable gates Available in small footprint packages - 100-pin TQFP (81 user I/O pins) - 144-pin TQFP (117 user I/O pins) - 144-pin CSP (117 user I/O pins)

Contextual Info: XC95144XV High-Performance CPLD DS051 v2.6 June 18, 2003 1 Features • • • • • • • • 144 macrocells with 3,200 usable gates Available in small footprint packages - 100-pin TQFP (81 user I/O pins) - 144-pin TQFP (117 user I/O pins) - 144-pin CSP (117 user I/O pins)

in400x

Abstract: P0640EA70 bd 625 QFN 64 8x8 footprint 32-PIN 44-PIN MUR120 le79555-3vc TQFP044 795552QC
Contextual Info: SLIC Subscriber Line Interface Circuit Le79555 Device APPLICATIONS DESCRIPTION • Ideal for high-density, low-power linecard applications The Le79555 device was designed for high-density POTS applications requiring a power saving, small footprint SLIC device. The new SLIC device fulfills today's requirements for

smsc

Abstract: FDC37C669FR FDC37N769
Contextual Info: APPLICATION NOTE 7.0 FDC37C669FR and FDC37N769 Dual Layout By Nizar Azzam This application note describes a dual footprint layout for the SMSC FDC37C669FR and the SMSC FDC37N769. This is a TQFP package design since the SMSC FDC37N769 comes in a TQFP package only.

Contextual Info: XC9572XV High-performance CPLD R DS052 v2.3 May 31, 2002 5 Features • • • • • • • • 72 macrocells with 1,600 usable gates Available in small footprint packages - 44-pin PLCC (34 user I/O pins) - 44-pin VQFP (34 user I/O pins) - 48-pin CSP (38 user I/O pins)

Contextual Info: XC95144XV High-Performance CPLD R DS051 v2.0 January 25, 2001 1 Advance Product Specification Features Power Estimation • 144 macrocells with 3,200 usable gates • Available in small footprint packages - 100-pin TQFP (81 user I/O pins) - 144-pin TQFP (117 user I/O pins)

a6252

Abstract: CS144 TQ100 TQ144 XC9500XV XC95144XV
Contextual Info: XC95144XV High-Performance CPLD R DS051 v2.2 August 27, 2001 1 Advance Product Specification Features Power Estimation • 144 macrocells with 3,200 usable gates • Available in small footprint packages - 100-pin TQFP (81 user I/O pins) - 144-pin TQFP (117 user I/O pins)