TQF 13 Search Results

MPC860

Abstract: MPC860SAR components list of automatic transfer switch
Contextual Info: 4/17/98 Addendum to MPC860SAR Communication Controller Supplement MPC8x0SAR Port-to-Port Switching Microcode This document describes the implementation of an automatic port-to-port switching function for ATM cells in the 8x0SAR. This feature automatically transfers cells from the

220vac LED driver

Abstract: MAX16832 350mA 220vac driver max16821 LED max16814 max16838 MAX16805 offline switchmode -flyback MAX16819 MAX16822
Contextual Info: High-Brightness LED Drivers Interior Lighting Architectural Lighting Exterior Lighting Spot Lights, MR16, Emergency Lights HB LED Drivers Display Backlighting Street Lights, Solar Lights LCD TV and Desktop Backlighting Maxim’s high-brightness LED HB LED drivers are dedicated integrated circuits for white or

HX6409

Contextual Info: Aerospace Electronics FIFO—SOI HX6409 HX6218 HX6136 FEATURES • 1K x 36, 2K x 18, 4K x 9 Organizations OTHER • Fabricated with RICMOS IV Silicon on Insulator SOI 0.8 µm Process (Leff = 0.65µm) • Read/Write Cycle Times <35 ns (-55° to 125°C)

HX6409

Abstract: D1878
Contextual Info: Aerospace Electronics FIFO—SOI HX6409 HX6218 HX6136 FEATURES • 1K x 36, 2K x 18, 4K x 9 Organizations OTHER • Fabricated with RICMOS IV Silicon on Insulator SOI 0.8 µm Process (Leff = 0.65µm) • Read/Write Cycle Times <35 ns (-55° to 125°C)

x-ray cmos

Abstract: HX6409 6409D 6218 FIFO 065um capacitor enw
Contextual Info: FIFO – HX6409/HX6218/HX6136 First-In First-Out Memory HX6409/HX6218/HX6136 The HX6409, HX6218, and HX6136 are high speed, low power, first-in first-out memories with clocked read and write interfaces. The HX6409 is a 4096-word by 9bit memory array; the HX6218 is a 2048-word by 18-bit

065um

Contextual Info: FIFO – HX6409/HX6218/HX6136 First-In First-Out Memory HX6409/HX6218/HX6136 The HX6409, HX6218, and HX6136 are high speed, low power, first-in first-out memories with clocked read and write interfaces. The HX6409 is a 4096-word by 9bit memory array; the HX6218 is a 2048-word by 18-bit

Contextual Info: Honeywell Military & Space Products Preliminary FIFO—SOI HX6409 HX6218 HX6136 FEATURES • 1K x 36, 2K x 18, 4K x 9 Organizations OTHER • Fabricated with RICMOS IV Silicon on Insulator SOI 0.8 n.m Process (Lelf = 0.65}im) • Read/Write Cycle Times

9112C

Abstract: AM9112 91L12A AM91L12A P2112A maxim 2112
Contextual Info: Am9112 2 5 6 x 4 Static RAM ZL16UIV DISTINCTIVE CHARACTERISTICS Low operating power dissipation 125 mW typ.; 290 mW maximum — standard power 100 mW typ.; 175 mW maximum — low power High noise immunity — full 400 mV Uniform switching characteristics — access tim es insen­

Y1031

Abstract: equivalent transistor 2 SA 1469 tqfp 10x10 tray SO24 package m 4953 metal detector plans EM6503 EM6504 SO18 Package EM6517
Contextual Info: EM MICROELECTRONIC - MARIN SA EM65XX EM65XX Datasheet MFP versions of EM66XX Mask Rom EM Microelectronic-Marin SA Tel +41 32 755 51 11 Fax +41 32 755 54 03 http://www.emmicroelectronic.com Copyright 2005, EM Microelectronic-Marin SA 1 www.emmicroelectronic.com

EM6503

Abstract: EM6504 EM6505 EM6517 EM6520 EM6521 EM6522 EM65XX EM6523 SO18 Package
Contextual Info: EM MICROELECTRONIC - MARIN SA EM65XX EM65XX Datasheet MFP versions of EM66XX Mask Rom EM Microelectronic-Marin SA Tel +41 32 755 51 11 Fax +41 32 755 54 03 http://www.emmicroelectronic.com 03/02 REV. H/447 Copyright  2002, EM Microelectronic-Marin SA

Contextual Info: Honeywell Military & Space Products HX6409 HX6218 HX6136 FIFO— SOI FEATURES • 1K x 36, 2K x 18, 4K x 9 Organizations OTHER • Fabricated with RICMOS IV Silicon on Insulator SOI 0.8 jim Process (Leff = 0.65|am) • Read/Write Cycle Times <35 ns (-55° to 125°C)

Contextual Info: Honeywell Military & Space Products FIFO—SOI HX6409 HX6218 HX6136 FEATURES • 1K x 36, 2K x 18, 4K x 9 Organizations • Fabricated with RICMOS IV Silicon on Insulator SOI 0.8 jam Process (Leff = 0.65|im) OTHER • Read/Write Cycle Times <35 ns (-55° to 125°C)

2 way antenna splitter, circuit diagram

Abstract: gsm mobile sniffer audio video uhf transmitter circuit MAX2769 Single Chip zero IF L-band Tuner DVB Satellite circuit diagram wireless camera transmitter TV 2 way splitter circuit diagram PAL TUNER FOR TV audio video uhf tv transmitter Block Diagram of PAL TV receiver
Contextual Info: WIRELESS Data Sheets DESIGN GUIDE Application Notes • Free Samples • N DITIO E d r 23 Single-Chip RF Transceivers Enable Mobile WiMAX Worldwide NEW Small Solution Size and Low Power Consumption for Notebooks, PMPs, Cell Phones, CPEs, and Pico/Femto Base Stations

APC SERVICE MANUAL

Abstract: ATM25 MPC860 MPC860SAR MPC862
Contextual Info: Rev 1.0 June 2001 Technical Bulletin Design Considerations / Differences of MPC862SAR Nigel Dick / European FAE Team Netcomm Applications Motorola, East Kilbride, Scotland Section 1.0 Introduction The MPC860SAR and MPC862SAR are both members of the MPC8xx PowerQUICC family. In addition to the

Contextual Info: ADV MICRO MEMORY b4 E D • G2S7SSÖ 0G325QS 3 0 7 ■AM1>4 z \ Advanced Micro Devices Am27X2048 2 Megabit (131,072 x 16-Bit) CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS ■ As an OTP EPROM alternative: — Factory optimized programming — Fully tested and guaranteed

Contextual Info: Honeywell Military & Space Products FIFO— SOI HX6409 HX6218 HX6136 FEATURES • 1K x 36, 2K x 18, 4K x 9 Organizations OTHER • Fabricated with RICMOS IV Silicon on Insulator SOI 0.8 |a,m Process (Leff = 0.65|a,m) • Read/Write Cycle Times <35 ns (-55° to 125°C)

manual Bst Tiny 20

Abstract: all n type mosfet switch ic for notebook cpu core dc to dc conversion MAX17026 MAX15018 MAX15021 offline switcher MAX5945 MAX15039 MAX8566ETJ MAX8646
Contextual Info: Power Solutions for Enterprise Management 1st Edition January 2009 Power solutions for computing, datacom, and telecom PowerMind PMBus™ pages 2, 3 PowerMind DC-DC conversion pages 4–10 Isolated DC-DC converters page 15 SYSTEM AND POWER MANAGEMENT MOSFET

LCD 3.5-DIGIT

Abstract: max11040 panel-meter MAX1329 MAX1330 dual slope adc ic regulator 12B MAX1139
Contextual Info: BRIDGING THE GAP BETWEEN REAL-WORLD AND DIGITAL SIGNALS TEMP SOUND LIGHT VOLTAGE AND CURRENT PRESSURE With over 300 ADCs featuring industry-leading performance and features, Maxim has the largest product offering on the market and the ADC for your application. Here is a list of parts to get you started. If you do not see a part for your

Contextual Info: Aerospace Electronics FIFO— SOI HX6409 HX6218 HX6136 FEATURES • 1K x 36, 2K x 18, 4K x 9 Organizations OTHER • Fabricated with RICMOS IV Silicon on Insulator SOI 0.8 |a,m Process (Leff = 0.65|a,m) • Read/Write Cycle Times <35 ns (-55° to 125°C)

959T

Abstract: 3K20A apc isdn DDH 3E AN2348 ATM25 MPC859T MPC860 MPC860SAR MPC866
Contextual Info: Freescale Semiconductor, Inc. Application Note AN2348 Rev. 1.5 9/2003 Freescale Semiconductor, Inc. Migrating from the MPC860 to the MPC866 PowerQUICC This application note lists some of the design considerations that a customer must make when migrating from the MPC860/855T 'CDR2' family to the MPC866/859T 'HiP6W' family.

Contextual Info: Advance information •■ I l AS4LC2M8S0 AS4LC1M1ÓS0 A 3.3V 2 M x 8 /lM x 16 CMOS synchronous DRAM Features Automatic and direct precharge Burst read, single write Can assert random column address in every cycle LVl'l'L compatible V O 3.3Vpower supply JEDEC standard package, pinout and function

74LS347

Contextual Info: TYPES SN54LS347, SN74LS347 BCD-TO-SEVEN-SEGMENT DECODERS/DRIVERS D 2 4 2 6 , N O V E M B E R 1 9 7 7 -R E V IS E P D E C E M B E R 1983 SN54LS347 . . J OR W PACKAGE SN74LS347 . 0 , J OR N PACKAGE Low-Vottage Version of SNB4LS47/SN74LS47 TOP VIEWS Open-Collector Outputs

TIP29A

Abstract: TIP30B
Contextual Info: TYPIS TIP29, TIP29A, TIP29B, TIP29C N-P-N SINGLE-DIFFUSED MESA SILICON POWER TRANSISTORS 3J CO H mC < FOR POWER-AMPLIFIER AND HIGH-SPEED-SWITCHING APPLICATIONS DESIGNED FOR COMPLEMENTARY USE WITH TIP30, TIP30A, TIP30B, TIP30C -0 r "v r rin > m tf l r> H h

rdram clock generator

Abstract: Direct RDRAM clock generator
Contextual Info: ü 16-M egabit RD R A M 2M x 9 Description System Benefits The 16-M egabit Rambus DRAM (RDRAM™) is an extrem ely-high-speed CMOS DRAM organized as 2M w o rd s by 8 or 9 bits an d capable of b u rstin g u p to 256