TOP 223N Search Results

ES1H

Abstract: 2j 103k ES1J-G 177 221g ES1V 103K- 2G Panasonic TS-NH top 223n ECES1CG153N capacitor 152j
Contextual Info: Aluminum Electrolytic Capacitors Large Can Type TS-NH Series TS-NH Series Features •Long life 105‘C 2000 hours & high ripple current ■Wide CV value range 47 ~ 33000nF/10 ~ 400V ■Various case size & top vent constructions Specifications Item Performance Characteristics

8016 90 pins connector

Abstract: 347N SZ 7023 229N SMPS MALE CONNECTOR rectangular smt Tantalum Capacitor GH01-GH06 SM91-SM96 243N connector male 6 pin 1.27mm
Contextual Info: FAX Service Product Information available through your FAX. Call 1-800-879-1613 and request the document number of your choice. CAPACITORS Leaded Multilayer Ceramic Capacitors Cont. Document Description Part No. Type Number CERAMICS Surface Mount Multilayer Ceramic Capacitors

Contextual Info: MODEL LPE-6855 Inductors S u rfa c e M o u n t, G a p p e d a n d U n g a p p e d FEATURES • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled Tape packaging per EIA-481 Low cost Qualification data available

CA08102001E

Abstract: rk 49 diode E34KFB
Contextual Info: Pushbuttons & Indicating Lights 47-1 Pushbuttons & Indicating Lights March 2008 Contents Description Page Toggle Switches — E10 Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Toggle Switches — E10E Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SN7441

Abstract: 74L78 Sw 7441Aj SN7401 SN7449 7475n itt u6a9601 N8490 National Semiconductor Linear Data Book c2003p
Contextual Info: TTL Integrated Circuits Catalog from Texas Instruments 1 August 1969 T e x a s In s t r u m e n t s IN C O R P O R A T E D P O S T O F F IC E B O X 5 0 1 2 • D ALLAS. TEXAS 75222 GENERAL INFORMATION INDEXES Numerical • Functional • Cross-Reference TTL APPLICATION REPORTS

Contextual Info: M ODEL LPE-5047 Inductors Surface Mount, Gapped and Ungapped j m i O FEATURES • • • • • • • • • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost

102MB

Contextual Info: M ODEL LPE-4841 Inductors Surface Mount, Gapped and Ungapped FEATURES • • • • • • • • • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled Tape packaging per EIA-481 Low cost

Contextual Info: M ODEL LPE-6562 Inductors Surface Mount, Gapped and Ungapped FEATURES • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled Tape packaging per EIA-481 Low cost Qualification data available

Contextual Info: MODEL LPE-6855 Inductors Surface Mount, Gapped and Ungapped FEATURES • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost • Qualification data available • Short lead times

Contextual Info: M ODEL LPE-4841 Inductors Surface Mount, Gapped and Ungapped FEATURES • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost • Qualification data available • Short lead times

o 103na

Contextual Info: M ODEL LPE-5047 Inductors Surface Mount, Gapped and Ungapped FEATURES • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints UL Class B materials + 130°C

Contextual Info: MODEL LPE-5047 Inductors S u rfa c e M o u n t, G a p p e d an d U n g a p p e d FEATURES • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost • Qualification data available

sd 4841 p

Abstract: sd 4841
Contextual Info: A COMPANY OF M O DEL LPE-4841 In d u c to rs S u rfa c e M o u n t, G a p p e d a n d U n g a p p e d F E A TU R ES • • • • • • • • • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled

o 103na

Contextual Info: A COMPANY OF M O D EL L P E -5 047 In d u c to rs Surface Mount, Gapped and Ungapped FEATURES • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints UL Class B materials + 130°C

Contextual Info: MODEL LPE-4841 Inductors Surface Mount, Gapped and Ungapped FEATURES • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost • Qualification data available • Short lead times

Contextual Info: M O DEL L P E -6562 In d u c to rs S u rfa c e M o u n t, G a p p e d an d U n g a p p e d FEATURES • • • • • • • • • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled

Contextual Info: A COMPANY OF M O DEL L P E -5047 In d u c to rs S u rfa c e M o u n t, G a p p e d a n d U n g a p p e d F E A TU R ES • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints

tc106-10

Abstract: TC-106-10 2J26D MOTOROLA DSP563XX architecture
Contextual Info: Advance Information DSP56366/D Rev. 1.5, 11/2003 24-Bit Audio Digital Signal Processor Topic Page Overview . i Signal/Connection Descriptions .1-1 Specifications .2-1 Packaging .3-1

edb10

Abstract: 5377 9245e Nippon capacitors power factor correction using PIC XCB56362PV100
Contextual Info: Order this document by: DSP56362/D Rev 2.1, 11/00 MOTOROLA SEMICONDUCTOR ADVANCE INFORMATION DSP56362 Advance Information 24-Bit Audio DIgital Signal Processor Motorola designed the DSP56362 to support digital audio applications requiring digital audio compression and decompression, sound field processing, acoustic equalization, and other digital

2J21D

Abstract: 3503e 1J21D XCB56362 56300 scheme 9937e AA0456 1993e 1992E DSPF56362PV120
Contextual Info: Order this document by: DSP56362/D Rev 2.1, 11/00 MOTOROLA SEMICONDUCTOR ADVANCE INFORMATION DSP56362 Advance Information 24-Bit Audio DIgital Signal Processor Motorola designed the DSP56362 to support digital audio applications requiring digital audio compression and decompression, sound field processing, acoustic equalization, and other digital

fst 172

Abstract: FST 460 TRANSISTOR Transistor FST 460 DSP DTS DSP56364 VCCS protocol WS7107 FST 460 AC97 DSP56300
Contextual Info: Order this document by: DSP56364/D MOTOROLA SEMICONDUCTOR TECHNICAL DATA REV 1 Advance Information DSP56364 24-Bit Audio Digital Signal Processor The DSP56364 supports digital audio applications requiring sound field processing, acoustic equalization, and other digital audio algorithms. The DSP56364 uses the high performance,

fst 172

Abstract: FST 460 TRANSISTOR TRANSISTOR BC 187 Transistor FST 460 AC97 DSP56300 DSP56300FM DSP56367 IEC958 SDI31
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: DSP56367 Rev. 2.1, 1/2007 DSP56367 24-Bit Audio Digital Signal Processor 1 Overview This document briefly describes the DSP56367 24-bit digital signal processor DSP . The DSP56367 is a member of the DSP56300 family of programmable

Contextual Info: Document Number: DSP56367 Rev. 2.1, 1/2007 Freescale Semiconductor Data Sheet: Technical Data DSP56367 24-Bit Audio Digital Signal Processor 1 Overview This document briefly describes the DSP56367 24-bit digital signal processor DSP . The DSP56367 is a member of the DSP56300 family of programmable

AC97

Abstract: DSP56000 DSP56300 DSP56362 144pc10 AA128 Nippon capacitors AA0456 XCB56362
Contextual Info: Order this document by: DSP56362/D Rev 0.3, 7/98 MOTOROLA SEMICONDUCTOR TECHNICAL DATA DSP56362 Advance Information 24-BIT AUDIO DIGITAL SIGNAL PROCESSOR Motorola designed the DSP56362 to support digital audio applications requiring digital audio compression and decompression, sound field processing, acoustic equalization, and other digital