TO-68 PACKAGE Search Results

CRD-68P-M05

Contextual Info: PC CARD FUJITSU SEMICONDUCTOR DATA SHEET 68 PIN PLASTIC To Top / Package Lineup / Package Index CRD-68P-M05 68-pin PC card Number of pins 68 Lead pitch 50 mil CRD-68P-M05 68-pin PC card (CRD-68P-M05) Note: Dimensions confirm with “PC Card Standard” 2-R1.00(.039)

r047

Contextual Info: PC CARD FUJITSU SEMICONDUCTOR DATA SHEET 68 PIN PLASTIC To Top / Package Lineup / Package Index CRD-68P-M24 68-pin PC card Number of pins 68 Lead pitch 50 mil CRD-68P-M24 68-pin PC card (CRD-68P-M24) Note: Dimensions confirm with “PC Card Standard” 85.60±0.20(3.370±.008)

Contextual Info: 80C196KB10/83C196KB10/80C196KB12/83C196KB12 PACKAGING The 80C196KB is available in a 68-pin PLCC package, an 80-pin QFP package and a 68-pin PGA package. Contact your local sales office to determine the exact ordering code for the part desired. Package Designators: N = 68-pin PLCC, S = 80-pin QFP and A = 68-pin PGA.

81901

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 68 PIN CERAMIC To Top / Package Lineup / Package Index FPT-68C-A02 68-pin ceramic QFP Lead pitch 1.00 mm Lead shape Gullwing Sealing method Metal seal FPT-68C-A02 68-pin ceramic QFP (FPT-68C-A02)

PGA-68C-A01

Abstract: PGA068-C-S11D-1
Contextual Info: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 68 PIN CERAMIC To Top / Package Lineup / Package Index PGA-68C-A01 EIAJ code :∗PGA068-C-S11D-1 68-pin ceramic PGA Lead pitch 100 mil Pin matrix 11 Sealing method Metal seal PGA-68C-A01 68-pin ceramic PGA

cuzn

Abstract: 0384 60130
Contextual Info: Rundsteckverbinder mit Schraubverschluss nach IEC 60130-9 und AISG-Spezifikation, IP 40/IP 68 Circular connectors with threaded joint acc. to IEC 60130-9 and AISG specification, IP 40/IP 68 Connecteurs circulaires avec verrouillage à vis suivant CEI 60130-9 et spécification AISG, IP 40/IP 68

Contextual Info: WE256K32-XG2TXE HI-RELIABILITY PRODUCT 256Kx32 EEPROM MODULE PRELIMINARY* FEATURES • Access Times of 150, 200, 250, 300ns ■ Packaging: • 68 lead, Hermetic CQFP G2T , 22.4mm (0.880") square, 4.57mm (0.180") high (Package 509). Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (Fig. 1)

acs150

Contextual Info: WE128K32-XG2TXE HI-RELIABILITY PRODUCT 128Kx32 EEPROM MODULE ADVANCED* FEATURES • Access Times of 150, 200, 250, 300ns ■ Packaging: • 68 lead, Hermetic CQFP G2T , 22.4mm (0.880") square, 4.57mm (0.180") high (Package 509). Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (Fig. 1)

QFJ068-P-S953-2

Abstract: 800REF LCC68
Contextual Info: PLASTIC LEADED CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 68 PIN PLASTIC To Top / Package Lineup / Package Index LCC-68P-M02 EIAJ code :∗QFJ068-P-S953-2 68-pin plastic QFJ PLCC Lead pitch 50 mil Package width x package length 953 × 953 mil Lead shape

STW60NM50

Contextual Info: STW60NM50N N-channel 500 V, 0.035 Ω, 68 A, MDmesh II Power MOSFET in a TO-247 package Datasheet - production data Features Order code VDSS @Tjmax RDS(on) max STW60NM50N 550 V <0.043 Ω ID 68 A • 100% avalanche tested 2 • Low input capacitance and gate charge

eel 19 2005

Contextual Info: SFC2280-68 ChipClampΤΜ Headset Microphone EMI and ESD Protection PRELIMINARY PROTECTION PRODUCTS Description Features The SFC2280-68 is a low pass filter array with integrated TVS diodes. It is designed to provide bidirectional filtering of EMI/RFI signals and electrostatic

Contextual Info: STW70N60M2 N-channel 600 V, 0.03 Ω typ., 68 A MDmesh II Plus low Qg Power MOSFET in a TO-247 package Datasheet − production data Features Order code VDS @ TJmax RDS on max ID STW70N60M2 650 V 0.040 Ω 68 A • Extremely low gate charge • Lower RDS(on) x area vs previous generation

RA07H0608M-01

Abstract: RA07H0608M
Contextual Info: MITSUBISHI RF MOSFET MODULE ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS RA07H0608M 68-88MHz 7W 12.5V, 2 Stage Amp. For PORTABLE RADIO DESCRIPTION The RA07H0608M is a 7-watt RF MOSFET Amplifier Module for 12.5-volt portable radios that operate in the 68- to 88-MHz

Contextual Info: VCO Product Specification Model: VCO190-70T Rev: A Date: 4/22/2003 Customer: SIRENZA MICRODEVICES, INC. Operating Temperature Range: Parameter Frequency Range - Min Typ Max Units X 68 70 72 MHz X 1 1.5 -35 ° to 85 ° C Remarks Tuning Voltage: 68 MHz 72 MHz

Contextual Info: □IXYS High Current MegaMOS FET IXTK 74 N20 IXTH 68 N20 V DSS ^D25 200 V 200 V 74 A 68 A D DS on 35 mQ 35 mQ N-Channel Enhancement Mode Preliminary data Symbol Maximum ratings Test conditions V DSS Td = 25°C to 150°C 200 V v DGR Td = 25°C to 150°C; RGS=1.0 M£2

lpc1769

Abstract: ARM LPC1769 instruction set LPC1768 bootloader lpc1768 gpio lpc1768fbd LPC236 LPC17XX LPC1766 NXP bootloader LPC1768 spi Crystal oscillator 12 MHz
Contextual Info: LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller; up to 512 kB flash and 64 kB SRAM with Ethernet, USB 2.0 Host/Device/OTG, CAN Rev. 9 — 10 August 2012 Product data sheet 1. General description The LPC1769/68/67/66/65/64/63 are ARM Cortex-M3 based microcontrollers for

ARM LPC1769 instruction set

Abstract: lpc1769 LPC1769FBD100 LPC17XX bootloader from I2C lpc1769 gpio LPC1768 LPC1769 I2C ARM microcontroller LPC1769 pwm LPC1768 spi
Contextual Info: LPC1769/68/67/66/65/64 32-bit ARM Cortex-M3 microcontroller; up to 512 kB flash and 64 kB SRAM with Ethernet, USB 2.0 Host/Device/OTG, CAN Rev. 04 — 1 February 2010 Product data sheet 1. General description The LPC1769/68/67/66/65/64 are ARM Cortex-M3 based microcontrollers for embedded

lpc1769

Abstract: lpc1768fbd100 LPC1769FBD100 lpc1769 gpio ARM Cortex A8 NXP LPC1768 arm cortex a9 LPC1768 mobile cpu cortex I2S bus specification
Contextual Info: LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller; up to 512 kB flash and 64 kB SRAM with Ethernet, USB 2.0 Host/Device/OTG, CAN Rev. 6 — 25 August 2010 Product data sheet 1. General description The LPC1769/68/67/66/65/64/63 are ARM Cortex-M3 based microcontrollers for

ARM LPC1769 instruction set

Abstract: LPC1769 register map
Contextual Info: LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller; up to 512 kB flash and 64 kB SRAM with Ethernet, USB 2.0 Host/Device/OTG, CAN Rev. 9.4 — 4 April 2014 Product data sheet 1. General description The LPC1769/68/67/66/65/64/63 are ARM Cortex-M3 based microcontrollers for

LPC1768 ADC code example

Abstract: LPC1769 NXP LPC1768 DMA LPC17xx USER MANUAL LPC1768 LPC1766FBD100 LPC1767FBD100 LPC1768FBD100 LPC1768FET100 LPC1769FBD100
Contextual Info: LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller; up to 512 kB flash and 64 kB SRAM with Ethernet, USB 2.0 Host/Device/OTG, CAN Rev. 7 — 5 April 2011 Product data sheet 1. General description The LPC1769/68/67/66/65/64/63 are ARM Cortex-M3 based microcontrollers for

ELMA TYPE 07

Abstract: bcd 74 SMD code 59 smd code book DIL SMD 22 04 elma 04 C07 smd
Contextual Info: Coded Switches Overview Type C07A Type C07 Concentric • rugged design • lead free reflowable • packaged for modern manufacturing methods • easy to modify • sealable up to IP 68 (5bar) Our ability to adapt existing components to your application, makes Elma your

P130-69

Abstract: P130-68 PLL130-68 PLL130-68QC PLL130-68QC-R PLL130-69QC PLL130-69QC-R
Contextual Info: PLL130-68/-69 High Speed Translator Buffers: Single ended to PECL or LVDS FEATURES 3 NC 4 VDD NC 15 14 13 PLL130-6x 12 NC 11 Q 10 Q_bar 9 5 6 7 8 NC 2 NC REFIN 16 GND 1 Q NC NC • • • • • • Q_bar • TOP VIEW Differential PECL (PLL130-68) or LVDS

49 65NG

Abstract: 4965ng 65NG 4965n NTD4965N-35G NTD4965NT4G mosfet 126 NTD4965N 369D-01 369D
Contextual Info: NTD4965N Power MOSFET 30 V, 68 A, Single N−Channel, DPAK/IPAK Features • • • • • Low RDS on to Minimize Conduction Losses Low Capacitance to Minimize Driver Losses Optimized Gate Charge to Minimize Switching Losses Three Package Variations for Design Flexibility

220O

Abstract: XE5690G xecom modem "40 pin" DWEMM00BXE5690G M0000
Contextual Info: XE5690G November 2004 World’st Smallest Complete V.90 Modem Description Features The Xecom XE5690G provides a complete, global modem in a PLCC-68 compatible package. Xecom designed the XE5690G to supply embedded applications with an easy to integrate dial-up communications