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54112-111262300LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch. |
PDF
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10131318-02111G0LF
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Amphenol Communications Solutions
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Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 2 Positions, GW Compatible Nylon66, Tray Packing. |
PDF
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10131319-2211100LF
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Amphenol Communications Solutions
|
Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 22 Positions, Non GW Compatible Nylon66, Tray Packing. |
PDF
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10131318-0211100LF
|
|
Amphenol Communications Solutions
|
Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 2 Positions, Non GW Compatible Nylon66, Tray Packing. |
PDF
|
|
|
10131319-22111G0LF
|
|
Amphenol Communications Solutions
|
Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 22 Positions, GW Compatible Nylon66, Tray Packing. |
PDF
|
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