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    TIW-7039 Search Results

    TIW-7039 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    75970-393-05LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row,5 Positions, 2.54 mm (0.100in) Pitch. PDF
    75970-393-03LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row,3 Positions, 2.54 mm (0.100in) Pitch. PDF
    75970-393-02LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row,2 Positions, 2.54 mm (0.100in) Pitch. PDF
    75970-393-11LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row,11 Positions, 2.54 mm (0.100in) Pitch. PDF
    75970-393R04LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row,4 Positions, 2.54 mm (0.100in) Pitch. PDF