TIN APE Search Results

smema

Abstract: STR22 smema wiring smema control technical of tamura solder paste Cu6Sn5 telcon Schloetter NASA Group TND311
Contextual Info: TND311 Tin Whisker Info “Brief” http://onsemi.com APPLICATION NOTE Tin whiskers are a potential concern with high-tin Sn content lead finishes (this includes alloys such as SnBi, and SnCu). SnPb alloys introduced in the 1950's have been the most successful in controlling whiskers. It is widely

3299D

Abstract: 299D 299D687X
Contextual Info: 299D Vishay Sprague Solid-Electrolyte TANTALEX Capacitors, Tripole Triple-Lead, Resin-Coated FEATURES • Terminations: Tin/lead SnPb , 100 % tin (Sn) • Easy installation, economical, high performance • Triple-lead design allows reverse installations

299D

Abstract: RS-327A
Contextual Info: 299D Vishay Sprague Solid-Electrolyte TANTALEX Capacitors, Tripole Triple-Lead, Resin-Coated FEATURES • Terminations: Tin/lead SnPb , 100 % tin (Sn) • Easy installation, economical, high performance • Triple-lead design allows reverse installations

Cu6Sn5

Abstract: FeNi42 Infineon diffusion solder smema smema specifications transistor k81 leadframe materials olin 7025
Contextual Info: Tin Whisker Formation – Results, Test Methods and Countermeasures Dittes, M*.; Oberndorff, P*.; Petit, L.* *Infineon Technologies, * Philips CFT, * STMicroelectronics Abstract Electroplated tin layers as used as lead-free solderable finish on the terminations of semiconductor devices are

Contextual Info: 1 2 3 4 5 15.48 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: LCP FLAMABILITY RATING: UL94-V0 COLOR: BLUE CONTACT MATERIAL: PHOSPHORE BRONZE CONTACT TYPE: STAMPED CONTACT PLATING: UNDERPLATE Nickel CONTACT AREA Pd-Ni + Gold SOLDER TAIL AREA Matt Tin SHIELDING: BRASS MATT TIN PLATED

Lead-Free

Abstract: SZZA037A smema wiring smema specifications DAY20 1600X
Contextual Info: Application Report SZZA037A - February 2003 Whisker Evaluation of Tin-Plated Logic Component Leads Douglas W. Romm, Donald C. Abbott, Stu Grenney, and Muhammad Khan Logic Packaging ABSTRACT Integrated circuits ICs with matte tin (Sn) finished leads for logic products were tested for

6D 50

Abstract: EIA481A
Contextual Info: SMT TG series Surface mount tiny slide switches Distinctive features and specifications ❑ Entirely designed for surface mount ❑ Tape and reel packaging ❑ Reflow solderable • High temperature plastic materials • Tin plated ground plate • Terminal coating : tin-lead alloy over nickel plating

EIA481A

Abstract: 6D 50 Schaffner catalog TL37WS84000
Contextual Info: SMT TL series Surface mount tiny washable toggle switches Distinctive features and specifications ❑ Entirely designed for surface mount ❑ Tape and reel packaging ❑ Reflow solderable • High temperature plastic materials • Tin plated ground plate • Terminal coating : tin alloy over nickel plating

Contextual Info: SMT TL series Surface mount tiny toggle switches Distinctive features and specifications ❑ Entirely designed for surface mount ❑ Tape and reel packaging ❑ Reflow solderable • High temperature plastic materials • Tin plated ground plate • Terminal coating : tin alloy over nickel plating

TR38WS80000

Abstract: U4700
Contextual Info: SMT TR series New! Surface mount tiny rocker switches Distinctive features and specifications ❑ Entirely designed for surface mount ❑ Tape and reel packaging ❑ Reflow solderable • High temperature plastic materials • Tin plated ground plate • Terminal coating : tin alloy over nickel plating

TP33WS83565

Abstract: TP32WS83565 TP33WS83500 EIA481A Schaffner catalog TP33WS83500 datasheet TP32WS83500
Contextual Info: SMT TP series Surface mount tiny pushbutton switches Distinctive features and specifications ❑ Entirely designed for surface mount ❑ Tape and reel packaging ❑ Reflow solderable • High temperature plastic materials • Tin plated ground plate • Terminal coating : tin alloy over nickel plating

Schaffner catalog

Abstract: EIA481A
Contextual Info: SMT TR series Surface mount tiny washable rocker switches Distinctive features and specifications ❑ Entirely designed for surface mount ❑ Tape and reel packaging ❑ Reflow solderable • High temperature plastic materials • Tin plated ground plate • Terminal coating : tin alloy over nickel plating

PK-75003-002

Abstract: 8+pin+smd+ic+4486
Contextual Info: 10 4 NOTES: 1 MATERIALS: HOUSING - LIQUID CRYSTAL POLYMER, UL94 V-0, NATURAL CHICKLET - LIQUID CRYSTAL POLYMER. UL94 V-0, BLACK CONTACT - TIN BRASS 2) CONTACT PLATING FINISH: 0.76 MICRON MIN. SELECT GOLD AND 3.81 MICRON MIN. SELECT PURE TIN OVER 1.27 MICRON MIN. NICKEL OVERALL

TG39WS80050

Contextual Info: SMT TG series Surface mount tiny washable slide switches Distinctive features and specifications ❑ Entirely designed for surface mount ❑ Tape and reel packaging ❑ Reflow solderable • High temperature plastic materials • Tin plated ground plate • Terminal coating : tin-lead alloy over nickel plating

PSC4052

Contextual Info: PACKAGE DIAGRAM OUTLINES TQ FP C o n tin u ed PACKAGE DIAGRAM OUTLINES TQ FP (C o n tin u ed ) REVISIONS DWG § DCN REV DESCRIPTION DATE 28215 00 INITIAL RELEASE 10/1 5 /9 5 APPROVED LV\ND PATTERN DIMENSIONS PR32-1 JEDEC VARIATION □ BBA MIN NOM MAX -

B37871-K5221-J623

Contextual Info: Multilayer Ceramic Capacitors SM O Chip capacitors COG Silver-nickel-tin terminations >ape packaging in acc with if:C .iBH :< ^-'nm blister t«pr; Ceramic material Rated voltage VB EC climatic category Temperature coefficient (tolerance: Dissipation factor tan 8

C18070

Abstract: C1807 smema C70250 FeNi42 Cu6Sn5 CuCrSiTi Infineon diffusion solder C19400 C1441
Contextual Info: Tin Whisker Formation – Results, Test Methods and Countermeasures Dittes, M*.; Oberndorff, P*.; Petit, L.* *Infineon Technologies, * Philips CFT, * STMicroelectronics marc.dittes@infineon.com pascal.oberndorff@philips.com luc.petit@st.com Abstract

AN5522

Abstract: AN5523 vertical AN5522 AN5522 en DIAGRAM IC AN5275 AN5891 an-5523
Contextual Info: an en ue on tin isc ce /D Part No. Publication date: June 2006 MN82832 Package Code No. di p Pl lan nclu ea e se pla m d m des ne ain ain foll htt visit d te t o p:/ fo /w llo dis disc nan enan wing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro

Contextual Info: i DESIGNATION 9frZ8£0r$ » 'âp-% '/k ‘ ON ON IM V f c ia Is - iM k-n b Sc REV. DATE IDR.I WI K ? DE S CRI PTI ON DON NO. m üá CHK. 1 1 APPD. * U APPD. Md 0 2 - 1 0 0 R M T - 1 E E ‘(LEAD FREE)TIN/TIN ALLOY S E R IE S î/iJ-X Z 3 . □=□ NUMBER OF CONTACTS

RT 8209

Abstract: P8205 JIS P8115 800 8506
Contextual Info: ¥mhüHpM\ HEWLETT PACKARD T-13/4 Super Ultra-Bright LED Lamps Technical Data Features • V ery H igh In te n sity • N arro w a n d M edium V iew ing A ngles • U n tin te d , N o ndiffused L ens • C hoice o f F ive C olors • S tu rd y L ead s w ith S ea tin g

MN82860

Contextual Info: an en ue on tin isc ce /D Part No. Publication date: June 2006 MN82860 Package Code No. di p Pl lan nclu ea e se pla m d m des ne ain ain foll htt visit d te t o p:/ fo /w llo dis disc nan enan wing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro

AN5307K

Contextual Info: ICs for TV AN5337K NTSC Video Signal Processor IC • Overview Unit : mm 1.778 47.7±0.3 ■ Features • Video : Wide bandwidth filter, adjustable preshoot and 1.0±0.25 overshoot, adjustable aperture control, ABL input 0.5±0.1 M Di ain sc te on na tin nc

4074308P

Abstract: 404304P 404304 dmo32 HD404304A 404302S HD404304
Contextual Info: ADE-202-024C 0 Sep. 1990 Prelim inary HD404302,HD404304,HD4074308 4 -B it Single-C hip Microcomputer U n it H ITA C H I D irect or in d ire ct a d d re ssin g of all RAM a re a s S u b ro u tin e n e s tin g a llo w e d u p to 16 levels, in c lu d in g in te rru p ts

Contextual Info: _ % u » ! _ MD2 SERIES PUSHBUTTON SWITCHES SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE. MATERIALS Base: Phenolic, UL94V-0 Frame: Zinc plated steel panel mtg. models Tin plated steel (p.c. mtg. models)