TI ROHS LIST Search Results

MT29C2G24m

Abstract: MT29C2G48 MT29C4G48M SMD MARKING CODE h23 MT29F4G16ABC JW256 MT29F4G16AB MT29C2G24MAKLAJG-6 MCP LPDDR 1Gb 512Mb marking k22 SMD
Contextual Info: Preliminary‡ 168-Ball NAND Flash and LP-DRAM PoP TI-OMAP MCP Features NAND Flash and LP-DRAM 168-Ball Package-on-a-Package (PoP) Combination Memory (TI OMAP ) Features • • • • • • Figure 1: Micron NAND Flash and LP-DRAM components RoHS-compliant, “green” package

MT29C1G12

Abstract: mt29c1g12ma MT29C1G12M MT29C1G smd code AA5 SMD MARKING CODE b21 MT29C2G24MAKLACG-6 smd code U21 marking aa5 mt29c1g1
Contextual Info: Preliminary‡ 152-Ball NAND Flash and LP-DRAM PoP TI OMAP MCP Features NAND Flash and LP-DRAM 152-Ball Package-on-a-Package (PoP) Combination Memory (TI OMAP ) Features • • • • • • Figure 1: Micron NAND Flash and LP-DRAM components RoHS-compliant, “green” package

RTR24DW

Abstract: MIL-PRF-27208
Contextual Info: AV DI TH AIL ST RO AB RI U LE BU GH TI ON Features • Multiturn/ ■ ■ ■ Wirewound / Industrial / Sealed Listed on the QPL per MIL-R-27208 and High-Rel MIL-R-39015 Panel mount option available RoHS compliant † RT24/RTR24 - 3/8 ” Square Trimming Potentiometer

3266P

Abstract: 3266X 3266Y 3266Z H-90
Contextual Info: AV DI TH AIL ST RO AB RI U LE BU GH TI ON Features • Multiturn / Cermet / Industrial / Sealed Standoffs allow thorough PC board washing ■ Tape and reel packaging available ■ Patent #4427966 drive mechanism ■ RoHS compliant † version available ■

H-90

Abstract: mil-r-39015
Contextual Info: AV DI TH AIL ST RO AB RI U LE BU GH TI ON Features • Multiturn/ Wirewound / Industrial / Sealed ■ Listed on the QPL for style RT24 per MIL-R-27208 and RTR24 per High-Rel MIL-R-39015 ■ Panel mount option available ■ RoHS compliant1 3290 - 3/8 ” Square Trimming Potentiometer

4214AP

Abstract: 4214BP
Contextual Info: SBOS176 PACKAGE OPTION ADDENDUM www.ti.com 4-Oct-2005 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty 4214AP NRND CDIP SB JD 14 27 Green (RoHS & no Sb/Br) Call TI Level-NC-NC-NC 4214BP NRND CDIP SB

trimmer 3386 cw

Abstract: trimmer 3386 trimmer 3386 h 502
Contextual Info: AV DI TH AIL ST RO AB RI U LE BU GH TI ON 3386 3/8 ˝ Square Trimming Potentiometer Features • Single Turn / Cermet / ■ ■ ■ ■ see page 88 ■ RoHS compliant† version available Product Dimensions Common Dimensions Side Adjust 3386W 1 ADJ. SLOT

TPS59611

Contextual Info: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION

40spq

Contextual Info: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION

65132B0

Contextual Info: To request a full data sheet, please send an email to: display_contact@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp

Contextual Info: To request a full data sheet, please send an email to: display_contact@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 26-Mar-2011 PACKAGING INFORMATION Orderable Device TPS65196RHDR Status 1 ACTIVE Package Type Package Drawing VQFN RHD Pins Package Qty

Contextual Info: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel Corporation. The end user must have a current CNDA Agreement in place with Intel Corporation. For a detailed data sheet and other design support tools, please contact IMVP@list.ti.com.

Contextual Info: To request a full data sheet, please send an email to: tps6126x_datasheet@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2011 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish

Contextual Info: To request a full data sheet, please send an email to: display_contact@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 20-Jan-2011 PACKAGING INFORMATION Orderable Device TPS65194RGER Status 1 ACTIVE Package Type Package Drawing VQFN RGE Pins Package Qty

Contextual Info: To request a full data sheet, please send an email to: display_contact@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 31-Mar-2012 PACKAGING INFORMATION Orderable Device TPS65177RHAR Status 1 ACTIVE Package Type Package Drawing VQFN RHA Pins Package Qty

Contextual Info: To request a full data sheet, please send an email to: display_contact@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 20-Jan-2011 PACKAGING INFORMATION Orderable Device TPS65168RSBR Status 1 ACTIVE Package Type Package Drawing WQFN RSB Pins Package Qty

Contextual Info: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION

TPS51622RSMR

Contextual Info: For a detailed datasheet and other design support tools please contact IMVP@list.ti.com PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish

Contextual Info: To request a full data sheet, please send an email to: display_contact@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2013 PACKAGING INFORMATION Orderable Device Status 1 TPS65154RSLR ACTIVE Package Type Package Pins Package Drawing Qty VQFN RSL 48

Contextual Info: To request a full data sheet, please send an email to: display_contact@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 21-Jun-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2)

Contextual Info: User's Guide SLOU272A – September 2009 – Revised June 2010 TPA3112D1EVM Audio Amplifier Evaluation Board This user's guide provides the specifications, quick-start list for stand-alone operation, the schematic, bill of materials, and the board layout for the TPA3112D1EVM evaluation module.

tps65640

Contextual Info: To request a full datasheet, please send an email to: display_contact@list.ti.com PACKAGE OPTION ADDENDUM www.ti.com 21-Nov-2013 PACKAGING INFORMATION Orderable Device Status 1 TPS65640RHRR ACTIVE Package Type Package Pins Package

Contextual Info: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel Corporation. The end user must have a current CNDA Agreement in place with Intel Corporation. For a detailed data sheet and other design support tools, please contact IMVP@list.ti.com.

Contextual Info: User's Guide SLOU308 – January 2011 TPA6139A2 EVM This section provides an overview of the Texas Instruments TI TPA6139A2 DirectPath stereo headphone amplifier evaluation module (EVM). It includes a brief description of the module and a list of EVM specifications.