THIN QUAD FLAT L-LEADED PACKAGE PLASTIC Search Results

Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC FPT-100P-M18 100-pin plastic TQFP Lead pitch 0.40 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold Length of flat portion of pins

TQFP120

Abstract: THIN QUAD FLAT L-LEADED PACKAGE PLASTIC
Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE 120 PIN PLASTIC FPT-120P-M17 EIAJ code : ∗TQFP120-P-1414-1 120-pin plastic TQFP Lead pitch 0.40 mm Package width x package length 14 × 14 mm Lead shape Gullwing Sealing method Plastic mold Length of flat portion of pins

TQFP064-P-1010-1

Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN PLASTIC To Top / Package Lineup / Package Index FPT-64P-M04 EIAJ code :∗TQFP064-P-1010-1 64-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 10 × 10 mm Lead shape

TQFP 80 PACKAGE

Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 80 PIN PLASTIC To Top / Package Lineup / Package Index FPT-80P-M15 80-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold

Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC To Top / Package Lineup / Package Index FPT-100P-M09 EIAJ code : TQFP100-P-1414-1 100-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 14 × 14 mm Lead shape

TQFP120

Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M17 EIAJ code :∗TQFP120-P-1414-1 120-pin plastic TQFP Lead pitch 0.40 mm Package width x package length 14 × 14 mm Lead shape

Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC To Top / Package Lineup / Package Index FPT-100P-M18 100-pin plastic TQFP Lead pitch 0.40 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold

Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC To Top / Package Lineup / Package Index FPT-100P-M19 100-pin plastic TQFP Lead pitch 0.65 mm Package width x package length 14 × 20 mm Lead shape Gullwing Sealing method Plastic mold

9811

Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 144 PIN PLASTIC FPT-144P-M10 EIAJ code :∗P-TQFP-0144-2020-0.50 144-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 20.0 × 20.0 mm Lead shape Gullwing Sealing method Plastic mold

Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC FPT-120P-M17 EIAJ code :∗TQFP120-P-1414-1 120-pin plastic TQFP Lead pitch 0.40 mm Package width x package length 14 × 14 mm Lead shape Gullwing Sealing method Plastic mold

176 TQFP pins

Abstract: TQFP 132 PACKAGE 176pin
Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 176 PIN PLASTIC FPT-176P-M06 EIAJ code :∗P-TQFP-0176-2020-0.40 176-pin plastic TQFP Lead pitch 0.40 mm Package width x package length 20.0 × 20.0 mm Lead shape Gullwing Sealing method Plastic mold

TQFP100

Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC FPT-100P-M09 EIAJ code : TQFP100-P-1414-1 100-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 14 × 14 mm Lead shape Gullwing Sealing method Plastic mold FPT-100P-M09

Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 80 PIN PLASTIC FPT-80P-M15 80-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.20 mm MAX FPT-80P-M15

FPT-64P-M04

Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN PLASTIC FPT-64P-M04 EIAJ code :∗TQFP064-P-1010-1 64-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 10 × 10 mm Lead shape Gullwing Sealing method Plastic mold FPT-64P-M04

tQFP pitch

Abstract: TQFP100
Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE 100 PIN PLASTIC FPT-100P-M09 EIAJ code : TQFP100-P-1414-1 100-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 14x14 mm Lead shape Gullwing Sealing method Plastic mold FPT-100P-M09 100-pin plastic TQFP (FPT-100P-M09)

Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE 64 PIN PLASTIC FPT-64P-M04 EIAJ code : ∗TQFP064-P-1010-1 64-pin plastic TQFP Lead pitch 0.50mm Package width x package length 10 × 10mm Lead shape Gullwing Sealing method Plastic mold FPT-64P-M04 64-pin plastic TQFP (FPT-64P-M04)

CY7C024-55AC DATASHEET

Abstract: A12L CY7C024 CY7C0241 CY7C025 CY7C0251
Contextual Info: CY7C024/0241 CY7C025/0251 4K x 16/18 and 8K x 16/18 Dual-Port Static RAM with SEM, INT, BUSY Features Functional Description • True Dual-Ported memory cells which allow simultaneous reads of the same memory location • 4K x 16 organization CY7C024 • 4K x 18 organization (CY7C0241)

ZHX1000

Abstract: ZHX1010 ZHX1200 ZHX1201 ZHX1403 ZHX1810 ZHX1820 ZHX2010 ZHX3403 MKT71C1176-00
Contextual Info: Packaging Product Specification PS007208-0502 ZiLOG Worldwide Headquarters • 532 Race Street • San Jose, CA 95126-3432 Telephone: 408.558.8500 • Fax: 408.558.8300 • www.ZiLOG.com This publication is subject to replacement by a later edition. To determine whether a later edition

CY7C025

Abstract: CY7C0251 A12L CY7C024 CY7C0241 cy7c02435axc
Contextual Info: CY7C024/0241 CY7C025/0251 4K x 16/18 and 8K x 16/18 Dual-Port Static RAM with SEM, INT, BUSY Features Functional Description • True Dual-Ported memory cells which allow simultaneous reads of the same memory location • 4K x 16 organization CY7C024 • 4K x 18 organization (CY7C0241)

CY7C025-15AXI

Abstract: 0241 CY7C024 CY7C0241 CY7C025 CY7C0251 CY7C024A-25JXC
Contextual Info: CY7C024/024A/0241 CY7C025/0251 4K x 16/18 and 8K x 16/18 Dual-Port Static RAM with SEM, INT, BUSY Features Functional Description • True dual-ported memory cells, which allow simultaneous reads of the same memory location ■ 4K x 16 organization CY7C024/024A[1]

P80C32

Abstract: P80C52 80C51 SC80C51 P51XA-G3
Contextual Info: Philips Semiconductors Ordering Information MICROCONTROLLER PRODUCTS Example: P8 X CX X X E B P N Philips North America Package Code A = Plastic Leaded Chip Carrier PLCC B = Quad Flat Pack (QFP) FA = Hermetic Cerdip (window) KA = CerQuad (window) N = Plastic Dual In-Line

sqfp 14x20

Abstract: 74ALSXX P51XA-G3 OTP-e PC 74 HCT 32 P sQFP 14X14 TDA1308 equivalent SG 2368 tqfp 14x14 tray TDA1308 application notes
Contextual Info: Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308 FEATURES GENERAL DESCRIPTION • Wide temperature range The TDA1308 is an integrated class AB stereo headphone driver contained in an SO8 or a DIP8 plastic package. The device is fabricated in a 1 mm CMOS process and has

P80C32

Abstract: P80C52 ROMless P80C31 80C51 P-80C31 p80c32 16 p80c32 philips
Contextual Info: Philips Semiconductors Ordering Information MICROCONTROLLER PRODUCTS Example: P8 X CX X X E B P N Philips North America Package Code A = Plastic Leaded Chip Carrier PLCC B = Quad Flat Pack (QFP) FA = Hermetic Cerdip (window) KA = CerQuad (window) N = Plastic Dual In-Line

Contextual Info: Philips Semiconductors Ordering Information MICROCONTROLLER PRODUCTS Example: 5 3 7 9 = = = = = P8 X C X X X E B P N Philips North America Package Code A = Plastic Leaded Chip Carrier PLCC B = Quad Flat Pack (QFP) FA = Hermetic Cerdip (window) KA = CerQuad (window)