THIN PROFILE CHIP Search Results

Contextual Info: THIN PROFILE CAPACITORS Popular EIA size chips are offered in very thin profile configuration with COG, X7R, Z5U and Y5V dielectric characteristics rated at 5 Vdc to 50 Vdc, for use as decoupling capacitors under other circuit elements, or for low profile RFID and

thin profile capacitors

Abstract: 333 Z capacitor z 683 0805 Y5V 104 j 182 transistor code 274 y 683 Z5U 472 Z5U diode
Contextual Info: THIN PROFILE CAPACITORS Popular EIA size chips are offered in very thin profile configuration with COG, X7R, Z5U and Y5V dielectric characteristics rated at 5 Vdc to 50 Vdc, for use as decoupling capacitors under other circuit elements, or for low profile RFID and

Contextual Info: THIN PROFILE CAPACITORS Popular EIA size chips are offered in very thin profile configuration with COG, X7R, Z5U and Y5V dielectric characteristics rated at 5 Vdc to 50 Vdc, for use as decoupling capacitors under other circuit elements, or for low profile RFID and “Smart Card” circuitry.

Contextual Info: THIN PROFILE CAPACITORS Popular EIA size chips are offered in very thin profile configuration with COG, X7R, Z5U and Y5V dielectric characteristics rated at 5 Vdc to 50 Vdc, for use as decoupling capacitors under other circuit elements, or for low profile RFID and “Smart Card” circuitry.

Contextual Info: THIN PROFILE Z5U DECOUPLING CAPACITORS EIA sizes 1206 and 1210 chips are offered in thin profile configuration for use as decoupling capacitors under other circuit elements. Other sizes and dielectrics (COG, X7R) are also available with maximum thickness designs

Contextual Info: Thin Profile Chip Ultra thin profile chips available in C0G, X7R, Z5U and Y5V dielectrics, and three maximum thicknesses of 0.015”, 0.018” and 0.020”. These devices find application as decoupling capacitors mounted underneath other circuit elements where

Thin Profile Chip

Abstract: Thin Profile
Contextual Info: Thin Profile Chip Ultra thin profile chips available in C0G, X7R, Z5U and Y5V dielectrics, and three maximum thicknesses of 0.015”, 0.018” and 0.020”. These devices find application as decoupling capacitors mounted underneath other circuit elements where

Contextual Info: Multilayer Ceramic Capacitors Low Profile Type Multilayer Ceramic Chip Capacitors (Low Profile Type) Series:ECJ n Features n Recommended Applications l For slim type HDD, DVDCD-RW For LCDs drive circuit l Thin in size with large capacitance l For small and thin size electronic applications

Contextual Info: THIN PROFILE CAPACITORS Popular EIA size chips are offered in very thin profile configuration with COG, X7R, Z5U and Y5V dielectric characteristics rated at 25V and 50V for use as decoupling capacitors under other circuit elements, or for low profile RFID and “Smart Card” circuitry. Refer to pages 5 through 11 of the catalog for details on characteristics

Contextual Info: Multilayer Ceramic Capacitors Low Profile Type Multilayer Ceramic Chip Capacitors (Low Profile Type) Series:ECJ n Features n Recommended Applications l For slim type HDD, DVDCD-RW For LCDs drive circuit l Thin in size with large capacitance l For small and thin size electronic applications

1206 fuse FD

Abstract: 1206 fuse FK 204D AN 429
Contextual Info: SURFACE MOUNT FUSES THIN-FILM SURFACE MOUNT 1206 SMF Very Fast-Acting Thin-Film Type 429 Series • The 1206 SMF is an extremely small, low profile design 1206 chip size utilizing thin-film technology to achieve precise control of electrical characteristics.

Contextual Info: SURFACE MOUNT FUSES THIN-FILM SURFACE MOUNT SlimLine 1206 Very Fast-Acting Thin-Film Type 433 Series ® • The SlimLine 1206 is an extremely small, low profile design 1206 chip size utilizing thin-film technology to achieve precise control of electrical characteristics.

Contextual Info: SURFACE MOUNT FUSES THIN-FILM SURFACE MOUNT Slim 1206 Very Fast-Acting Thin-Film Type 433 Series ® • The Slim 1206 is an extremely small, low profile design 1206 chip size utilizing thin-film technology to achieve precise control of electrical characteristics.

Contextual Info: SURFACE MOUNT FUSES THIN-FILM SURFACE MOUNT SlimLine 1206 Very Fast-Acting Thin-Film Type 433 Series ® • The SlimLine 1206 is an extremely small, low profile design 1206 chip size utilizing thin-film technology to achieve precise control of electrical characteristics.

429002

Abstract: EIA-KS481
Contextual Info: THIN-FILM SURFACE MOUNT ALF” II SMF @ Very Fast-Acting Thin-Film Type am The ALF II SMF IS an extremely small, low profile design 1206 chip size utlllzlng thin-ftlm technology to achieve precise control of electrlcal characteristics. New one-piece elementltermlnatlon design assures extra

Contextual Info: Multilayer Ceramic Capacitors Low Profile Type Multilayer Ceramic Chip Capacitors (Low Profile Type) Series:ECJ • Features ■ Recommended Applications ● Low profile/height with large capacitance values ● For small and thin electronic equipment ● For slim type HDD, DVD, CD-RW

10uf 0805 Capacitor dimension

Abstract: 475 16V X5R 0805
Contextual Info: VAC Series [ Low Profile X5R,Y5V Capacitors ] Supporting low profile application sets with varieties of low profile MLCCs ‹ Features. ‹ Application ‰ For thin profile circuit. ‰ Suitable FPD device, HDD, CD-RW, LCD device, cellular phone modules and portable

100L

Abstract: JESD51-2 JESD51-7 32 QFP PACKAGE thermal resistance tqfp 7x7 1.4 tray tqfp 7x7 tray tqfp 64 thermal resistance Techpoint
Contextual Info: TQFP Thin Profile Quad Flat Pack • 7 x 7mm to 14 x 14mm • 32 to 128 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 14 x 14mm The Thin Profile Quad Flat Pack TQFP belongs to STATS ChipPAC’s QFP family. At 1.0mm body thickness, the TQFP

Capacitor MLCC 1210 10uF 25V

Abstract: capacitor 22uf 16v 1206 x5r 70 M 20 B MLCC 16V 10uF 10uf 0805 Capacitor dimension capacitor 106 16v 10uF 25V X7R Size lcd tic 226 22uf 16v 1206 MLCC X7R 16V 22uF
Contextual Info: VAC Series-Low Profile Capacitors Holy Stone Multilayer Ceramic Chip Capacitors [ Low Profile Capacitor – Thin Type X7R, X5R,Y5V ] VAC Series Low profile high capacitance MLCC’s ideally suited for height restricted needs ‹ Features. ‹ Application ‰ High capacitance & rated voltage with

Contextual Info: A COMPANY OF VTOP - Very Thin Outline Package Z5U DIELECTRIC Ceramic Capacitors, Monolithic Chips FEATURES T Max. • VTOP very thin outline packages available in thickness .018“ [0.46mm], .022" [0.56mm] and .026“ [0.66mm] • For low profile applications; PCMCIA cards and

Contextual Info: New Product Guideline: Features, Applications, Cross-Reference, Sales Tips NIC PRODUCT PROFILE NTL Series Ultra-small SMT Chip Inductors DESCRIPTION: Ultra miniature 0201 ~ 0603 surface mount thin film chip inductors with high Q-factor over a wide frequency range. Thin film construction features

NCP1522

Abstract: NCP1521 NUF2030 transistor 669A SOT-23-5 PWM NUF2030XV6 ncp1400asn50 NCP5005 NCP1500 NCP1501
Contextual Info: Low Profile, Small Footprint Packaging ON Semiconductor offers the latest in low-profile, small-outline packaging. We enable the design and production of ultra-thin end-user products for the consumer market, by manufacturing some of the lowest profile packaging

Contextual Info: Surface Mount Fuses Thin-Film Surface Mount SlimLine 0603 Very Fast-Acting Fuse 434 Series ® • The SlimLine 0603 fuse is an extremely small, low profile design 0603 chip size utilizing thin-film technology to achieve precise control of electrical characteristics.

Contextual Info: Surface Mount Fuses Thin-Film Surface Mount SlimLine 1206 Very Fast-Acting Fuse 433 Series ® • The SlimLine 1206 fuse is an extremely small, low profile design 1206 chip size utilizing thin-film technology to achieve precise control of electrical characteristics.