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    THERMAL RESISTANCE CALCULATION TO Search Results

    THERMAL RESISTANCE CALCULATION TO Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    PQU650M-F-COVER
    Murata Manufacturing Co Ltd PQU650M Series - 3x5 Fan Cover Kit, RoHs Medical PDF
    TCTH022AE
    Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function Datasheet
    TCTH011AE
    Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type Datasheet
    TCTH011BE
    Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Open-drain type Datasheet
    TCTH012AE
    Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type / FLAG signal latch function Datasheet

    THERMAL RESISTANCE CALCULATION TO Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Thermalloy 6177

    Abstract: v5805 Aavid Thermalloy 60885 alutronic austerlitz v5805 austerlitz PR159 SK48 LZ50 screw
    Contextual Info: APPLICATION NOTE HEATSINK CALCULATION AND EXAMPLES In many cases, GS-Rx and GSxTy-z modules don’t require any additional cooling methods because the dimensions and the shape of the metal boxes were studied to offer the minimum possible thermal resistance case to ambient for a given module.


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    V5805

    Abstract: Aavid Thermalloy 60885 austerlitz v5805 LZ50 alutronic PR159 alutronic KS1003 V5382 V5280 PR159
    Contextual Info: APPLICATION NOTE HEATSINK CALCULATION AND EXAMPLES In many cases, GS-Rx and GSxTy-z modules don’t require any additional cooling methods because the dimensions and the shape of the metal boxes were studied to offer the minimum possible thermal resistance case to ambient for a given module.


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    12X30

    Abstract: 2SD2673 2SD2675 TUMT3 vmt3 20x12x0 Thermal Resistance Calculation TO
    Contextual Info: iTi mirffgsHQi p g ïriQ teG l I b e fo fê ïg a lcdl a t ir n ^ n€ ili [Rica iëlife m p e ràitiri§\ Normally, a transistors gets heated when in use. We can not ignore its heat. Therefore, it is required to carefully calculate the heat of TR before use, in order to drive it safely and stably.


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    20x12x0 20x15x0 15x20x0 30x15x0 20x20x0 12X30 2SD2673 2SD2675 TUMT3 vmt3 Thermal Resistance Calculation TO PDF

    ANIP9931E

    Abstract: Calculation of major IGBT operating parameters the calculation of the power dissipation for the IGBT IGBT JUNCTION TEMPERATURE CALCULATION calculation of the major IGBT operating calculation of IGBT parameter diode b2 SGP20N60
    Contextual Info: ANIP9931E Calculation of major IGBT operating parameters CALCULATION OF MAJOR IGBT OPERATING PARAMETERS This application note covers how to calculate major IGBT operating parameters - power dissipation; - continuous collector current; - total power losses;


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    ANIP9931E SGP20N60. SGP20N60 August-99 ANIP9931E Calculation of major IGBT operating parameters the calculation of the power dissipation for the IGBT IGBT JUNCTION TEMPERATURE CALCULATION calculation of the major IGBT operating calculation of IGBT parameter diode b2 PDF

    Contextual Info: FlowSIM – new innovative electrical and thermal simulation method for power modules in inverter applications. Temesi Ernő, Michael Frisch, Lénárt Attila, Vincotech, Hungary, Germany Abstract The goal of the flowSIM simulation project is to run electrical and thermal simulations of power modules simultaneously. An electrical simulation part yields excitation current and voltage time waveforms


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    EPF10K50GC403-4

    Abstract: EPM9560RC304-15
    Contextual Info: Evaluating Power June 1996, ver. 1 Introduction for Altera Devices Application Note 74 A critical element of system reliability is the capacity of electronic devices to safely dissipate the heat generated during operation. The thermal characteristics of a circuit depend on the device and package used, the


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    800-EPLD. EPF10K50GC403-4 EPM9560RC304-15 PDF

    Contextual Info: Evaluating Power June 1996, ver. 1 Introduction for Altera Devices Application Note 74 A critical element of system reliability is the capacity of electronic devices to safely dissipate the heat generated during operation. The thermal characteristics of a circuit depend on the device and package used, the


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    800-EPLD. PDF

    AN-1033

    Contextual Info: Application Note AN-1033 CALCULATING TEMPERATURE GRADIENTS IN POWER MOSFETS WITH THE “HEXRISE  ” PROGRAM by Doug Butchers, International Rectifier GB Ltd. HEXRISE may be downloaded from: www.irgb.co.uk INTRODUCTION This note is intended to assist with the application of the Program “HEXRISE” in practical real life cases.


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    AN-1033 AN-1033 PDF

    Evaluating Power

    Abstract: EPF10K50VBC356-2 epm9560arc304
    Contextual Info: Evaluating Power for Altera Devices August 1999, ver. 3.01 Introduction Application Note 74 A critical element of system reliability is the capacity of electronic devices to safely dissipate the heat generated during operation. The thermal characteristics of a circuit depend on the device and package used, the


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    800-EPLD. Evaluating Power EPF10K50VBC356-2 epm9560arc304 PDF

    Contextual Info: Evaluating Power January 1998, ver. 2 Introduction for Altera Devices Application Note 74 A critical element of system reliability is the capacity of electronic devices to safely dissipate the heat generated during operation. The thermal characteristics of a circuit depend on the device and package used, the


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    800-EPLD. PDF

    EPF10K50VBC356-2

    Contextual Info: Evaluating Power for Altera Devices July 2001, ver. 3.1 Introduction Application Note 74 A critical element of system reliability is the capacity of electronic devices to safely dissipate the heat generated during operation. The thermal characteristics of a circuit depend on the device and package used, the


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    Contextual Info: Evaluating Power for Altera Devices A p p lic a tio n N o te 74 J a n u a r y 1998. ver. 2 Introduction A critical element of system reliability is the capacity of electronic devices to safely dissipate the heat generated during operation. The thermal characteristics of a circuit depend on the device and package used, the


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    800-EPLD. PDF

    capacitor value calculation for AC

    Abstract: RS20 data sheet RS70
    Contextual Info: Thermal design of capacitors for power electronics 1 Criteria for use In order to scale a capacitor correctly for a particular application, the permisible ambient temperature has to be determined. This can be taken from the diagram “Permissible ambient temperature


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    RS20

    Abstract: capacitor Matsushita RS capacitor Matsua RS RS70 capacitor value calculation for AC siemens mkv capacitor
    Contextual Info: Thermal Design of Capacitors for Power Electronics 14 Criteria for use In order to scale a capacitor correctly for a particular application, the permisible ambient temperature has to be determined. This can be taken from the diagram “Permissible ambient temperature


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    ACT4532

    Abstract: ACT3225 PCA82C252 tja1054 Ex 43 B82790-S0513-N201 BZG04-27 TJA1053 Dual Supply From Single Battery Source
    Contextual Info: Philips Semiconductors Systems Laboratory Hamburg, Germany APPLICATION HINTS Fault-tolerant CAN transceiver Application Hints Fault-tolerant CAN transceiver V2.0 th Date : 24 of January 2000 Application Hints FTCAN 2_0.PDF Philips Semiconductors Philips Semiconductors


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    PCA82C252 TJA1053 TJA1054. PCA82C252/ TJA1053/ TJA1054 ACT3225 ACT4532 ACT4532 tja1054 Ex 43 B82790-S0513-N201 BZG04-27 Dual Supply From Single Battery Source PDF

    Contextual Info: Evaluating Power for Altera Devices May 1999, ver. 3 Introduction Application Note 74 A critical element of system reliability is the capacity of electronic devices to safely dissipate the heat generated during operation. The thermal characteristics of a circuit depend on the device and package used, the


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    800-EPLD. PDF

    ATA5279

    Abstract: A6p DIODE TRANSISTOR A1p atmel 708 QFN44 QFN48 Atmel 710 Atmel ATmega 32 64 pin 9168B transistor a6n
    Contextual Info: LF Antenna Driver ATA5279P Thermal Considerations and PCB Design Hints 1. General To minimize EMC radiation, the ATA5279P is designed to drive antennas with a sinusoidal waveform. For the same reason the switching edges of the integrated boost transistor are decoupled. This, however, also leads to higher power dissipation and


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    ATA5279P ATA5279P 9168B ATA5279 A6p DIODE TRANSISTOR A1p atmel 708 QFN44 QFN48 Atmel 710 Atmel ATmega 32 64 pin transistor a6n PDF

    IXAN0056

    Abstract: IEC60747-2 IEC60747-9 rc snubber calculation calculation of IGBT snubber D-68623 IEC60747-1
    Contextual Info: Technical Information Choosing the Appropriate Component from IXAN0056 Data Sheet Ratings and Characteristics IXAN0056 Choosing the Appropriate Component from Data Sheet Ratings and Characteristics This application note is intended to show how to choose the


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    IXAN0056 D-68623 IXAN0056 IEC60747-2 IEC60747-9 rc snubber calculation calculation of IGBT snubber IEC60747-1 PDF

    calculation of IGBT snubber

    Abstract: rc snubber calculation IEC60747-1 IEC60747-9 D-68623 IEC60747-2 aegtelefunken
    Contextual Info: Technical Information Choosing the Appropriate Component from Data Sheet Ratings and Characteristics Choosing the Appropriate Component from Data Sheet Ratings and Characteristics This application note is intended to show how to choose the appropriate rating of a power semiconductor component for a


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    D-68623 calculation of IGBT snubber rc snubber calculation IEC60747-1 IEC60747-9 IEC60747-2 aegtelefunken PDF

    Contextual Info: VN770K Quad smart power solid state relay for complete H-bridge configurations Features Type RDS on IOUT VCC VN770K 220 mΩ(1) 9 A(2) 36 V 1. Total resistance of one side in bridge configuration 2. Typical current limitation value • Suited as low voltage bridge


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    VN770K SO-28 PDF

    Contextual Info: VN770K Quad smart power solid state relay for complete H-bridge configurations Features Type RDS on IOUT VCC VN770K 220 m(1) 9 A(2) 36 V 1. Total resistance of one side in bridge configuration 2. Typical current limitation value • Suited as low voltage bridge


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    VN770K SO-28 PDF

    PEC 648

    Abstract: how to calculate junction to ambient thermal resistance Pec 646 phototriac 633 optocoupler
    Contextual Info: Application Note Vishay Semiconductors Thermal Characteristics of Optocouplers INTRODUCTION Behavior of any semiconductor device depends on the temperature of its die. Hence, electrical parameters are given at a specified temperature. To sustain the performance of a component and to avoid


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    25-Apr-08 PEC 648 how to calculate junction to ambient thermal resistance Pec 646 phototriac 633 optocoupler PDF

    VN771K

    Abstract: VN771K13TR
    Contextual Info: VN771K Quad smart power solid state relay for complete H-bridge configurations Features Type RDS on IOUT VCC VN771K 95 mΩ(1) 9 A(2) 36 V 1. Total resistance of one side in bridge configuration 2. Typical current limitation value • Suited as low voltage bridge


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    VN771K SO-28 VN771K VN771K13TR PDF

    Contextual Info: VN771K Quad smart power solid state relay for complete H-bridge configurations Features Type RDS on IOUT VCC VN771K 95 mΩ(1) 9 A(2) 36 V 1. Total resistance of one side in bridge configuration 2. Typical current limitation value • Suited as low voltage bridge


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    VN771K SO-28 PDF