THERMAL FUSE L20 TF 115 C Search Results

DM1265R

Abstract: THERMAL Fuse l20 tf 115 c
Contextual Info: www.fairchildsemi.com FSDM 1 2 6 5 RB Gre e n M ode Fa irc hild Pow e r Sw it c h FPS T M Features • Internal Avalanche Rugged Sense FET • Advanced Burst-Mode operation that consumes less than 1 W at 240VAC and 0.5W load • Precision Fixed Operating Frequency (66kHz)

CM0765R

Abstract: cm0765 65W ac adapter schematic 0765R Led driver 50W schematic top q 0765r 12v 50w smps LED fairchild 0765r FSCM0765R FSCM0765RC
Contextual Info: www.fairchildsemi.com FSCM0765R Green Mode Fairchild Power Switch FPSTM Features • Internal Avalanche Rugged SenseFET • Low Start-up Current (max 40uA) • Low Power Consumption under 1 W at 240VAC and 0.4W Load • Precise Fixed Operating Frequency (66kHz)

CM0565R

Abstract: CM*0565r cm0565 0565R Led driver 50W schematic top 65W ac adapter schematic M 0565R SCHEMATIC DIAGRAM SMPS 12v 5A EER3016 transformer 12v 50w smps
Contextual Info: www.fairchildsemi.com FSCM0565R Green Mode Fairchild Power Switch FPSTM Features • Internal Avalanche Rugged SenseFET • Low Start-up Current (max 40uA) • Low Power Consumption under 1 W at 240VAC and 0.4W Load • Precise Fixed Operating Frequency (66kHz)

THERMAL Fuse m20 tf 115 c

Abstract: 54SX16A actel fpga 54sx32 54SX32
Contextual Info: ^ c te l v 2 .0 54SX Family FPGAs L ea d in g Edge Pe rform an ce • 100% Resource Utilization with 100%Pin Locking • 320 MHz Internal Performance • 3.3V Operation with 5.0V Input Tolerance • 3.7 ns Clock-to-Out Pm-to-Pin • Very Low Power Consumption

SAA7144HL

Abstract: 337 BGA footprint PAL to ITU-R BT.601/656 Decoder SMD A7H LQFP128 SAA7113H a31 ac hf nv
Contextual Info: SAA7144HL Quadruple video input processor Rev. 01 — 21 April 2005 Product data sheet 1. General description The SAA7144HL is a combination of four stand alone multistandard video decoders. The SAA7144HL is a pure 3.3 V 5 V tolerant inputs and I/Os CMOS circuit and a highly

HMI 14 PIN CONNECTOR CONFIGURATION

Abstract: emmc jedec mechanical standard emmc bga 162 "thermal switch" t175
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53AEC Rev. 2, 5/2011 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information

Samsung eMMC 4.41

Abstract: LPDDR2 SDRAM samsung i.MX53 USB_OTG emmc spec samsung samsung EMMC user guide samsung lpddr2 eMMC 4.4 Jedec lpddr2 sahara lcd monitor circuit diagram free
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53AEC Rev. 3, 7/2011 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information

sony cmos sensor imx 179

Abstract: sony cmos sensor imx 174 sony cmos sensor imx 117 sony cmos sensor imx 175 IMX* Sony sony IMX 117 sony IMX 136 sony IMX 179 emmc 4.41 spec sony IMX cmos
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SLCEC Rev. 2.1, 05/2013 MCIMX6LxDVN10xx MCIMX6LxEVN10xx i.MX 6SoloLite Applications Processors for Consumer Products Package Information Plastic Package 13 x 13 mm, 0.5 mm pitch Ordering Information

samsung EMMC user guide

Abstract: Jedec lpddr2 samsung lpddr2 Mobile RAM samsung eMMC 4.5 MX53UG n78c AMBA AXI dma controller designer user guide lpddr2 layout SONY VTR M15 DIAGRAM DDR3 jedec
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53AEC Rev. 4, 11/2011 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information

Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53AEC Rev. 4, 11/2011 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information

sony cmos sensor imx 174

Abstract: sony cmos sensor imx 179
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SLCEC Rev. 2.2, 08/2013 MCIMX6LxDVN10xx MCIMX6LxEVN10xx i.MX 6SoloLite Applications Processors for Consumer Products Package Information Plastic Package 13 x 13 mm, 0.5 mm pitch Ordering Information

b h21

Contextual Info: Revision 18 Axcelerator Family FPGAs Leading-Edge Performance • • • • 350+ MHz System Performance 500+ MHz Internal Performance High-Performance Embedded FIFOs 700 Mb/s LVDS Capable I/Os Specifications • • • • • Up to 2 Million Equivalent System Gates

emmc 5.0

Abstract: iMX536 IC_USB voltage class "ARM Cortex A8" samsung ddr2 nand ESDHC MCIMX THERMAL Fuse m20 tf 115 c lpddr2 layout 15 TFT 20 pin lvds
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX53AEC Rev. 6, 03/2013 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Silicon Version 2.1

sony cmos sensor imx 174

Abstract: Sony imx 174 Sony IMX 145 CMOS
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SLCEC Rev. 3, 04/2014 MCIMX6LxDVN10xx MCIMX6LxEVN10xx i.MX 6SoloLite Applications Processors for Consumer Products Package Information Plastic Package 13 x 13 mm, 0.5 mm pitch Ordering Information

ARM Cortex A8 Neon SIMD

Abstract: IMX51 sd card MCIMX515DVK8C IMX51CEC ARM cortex A9 neon SIMD IMX51 ARM Cortex A9 samsung IMX51AEC bt.656 CSI free ba 4918
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information IMX51 Package Information Plastic Package Case 2058 13 x 13 mm, 0.5 mm pitch Case 2017 19 x 19 mm, 0.8 mm pitch i.MX51 Applications Processors for Consumer and Industrial Products Ordering Information

SCIMX

Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4.1, 2/2012 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch

pin vga CRT pinout

Abstract: samsung* lpddr2 LPDDR2-800 i.MX53 PCIMX535DVV1C emmc DDR pcb layout Samsung eMMC 4.41 LPDDR2 PoP JESD209-2 flexcan2
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 3, 7/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA PoP 12 x 12 mm

DDR3 phy 100 pin diagram

Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 1, 3/2011 MCIMX53xD This document contains information on a new product. Specifications and information herein are subject to change without notice. i.MX53xD Applications

SCIMX538DZK1C

Abstract: samsung eMMC 4.5 MCIMX535 emmc pcb layout lpddr2 pcb layout LPDDR2 PoP samsung* lpddr2* pop package N7U2 Freescale i.MX53 Quick Start Board AMBA AXI
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4.1, 2/2012 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch

MCIMX535

Abstract: MCIMX535DVV1C MCIMX535DVV IMX53CEC mc33902 tepbga-2 MCIMX538DZK1C H.263 *IMX53 emmc pcb layout
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4, 11/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch

eMMC "thermal impedance"

Abstract: PCIMX535DVV1C emmc Card connector 062N n78c 4.712 eMMC PoP emmc pcb layout 100KPD diode 4.7-16
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 2, 5/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA PoP 12 x 12 mm

b23n20

Contextual Info: ^ c te -m v 2. 0 l 54SX Family FPGAs • • • • • 100%Resource Utilization with 100%Pin Locking 3.3VOperation with 5.0VInput Tolerance Very Low Power Consumption Deterministic, User-ControlIableTiming Unique, In-System Diagnostic and Debug capability with

54sx08

Abstract: THERMAL Fuse m20 tf 115 c
Contextual Info: v 3 .0 54SX Family FPGAs Leading Edge Performance • 100%Resource Utilization with 100%Pin Locking • 320 MHz Internal Performance • 3.3VOperation with 5.0VInput Tolerance • 3.7 nsClock-to-Out Pi n-to-Pi n • Very Low Power Consumption • 0.1 ns Input Set-Up

Contextual Info: Revision 16 RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs Radiation Performance Specifications • SEU-Hardened Registers Eliminate the Need for Triple-Module Redundancy TMR – Immune to Single-Event Upsets (SEU) to LETTH > 37 MeVcm2/mg – SEU Rate < 10-10 Errors/Bit-Day (worst case GEO)