THERMAL CONDUCTIVITY Search Results

Power Semiconductor Applications Philips Semiconductors

Abstract: "Power Semiconductor Applications" Philips "CHAPTER 1 Introduction to Power Semiconductors" CHAPTER 1 Introduction to Power Semiconductors "static induction thyristor" varistor 503 static induction Thyristor TELEVISION EHT TRANSFORMERS 201 Static Induction Thyristor varistor 10c 471
Contextual Info: Thermal Management Power Semiconductor Applications Philips Semiconductors CHAPTER 7 Thermal Management 7.1 Thermal Considerations 553 Thermal Management Power Semiconductor Applications Philips Semiconductors Thermal Considerations 555 Thermal Management

AN628

Abstract: APP628 MAX1298 MAX1299
Contextual Info: Maxim > App Notes > Temperature sensors and thermal management Keywords: analog-to-digital converter, ADC, temperature sensor, temp sensor, thermally lumped system, thermal conductivity, thermal model, thermal resistance Oct 03, 2001 APPLICATION NOTE 628 Achieving high accuracy using MAX1298/MAX1299 temperature sensors

D2240

Abstract: D257 E595
Contextual Info: TflexTM 700 Series Thermal Gap Filler Innovative Technology for a Connected World HIGH THERMAL CONDUCTIVITY COMPLIANT GAP FILLER Tflex 700 is a 5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. The soft interface pad conforms to component

Contextual Info: AN11113 LFPAK MOSFET thermal design guide - Part 2 Rev. 2 — 16 November 2011 Application note Document information Info Content Keywords LFPAK, MOSFET, thermal analysis, design and performance, thermal considerations, thermal resistance, thermal vias, SMD, surface-mount,

Contextual Info: GT15 Thermal Conductivity Glassfiber Reinforcement Features Smooth surface & low thermal contact resistance Exceptional thermal performance at lower application pressures 20psi~400psi Usable over a wide temperture range Electrically isolating Complies with UL standards

Contextual Info: GT20 High Thermal Conductivity Glassfiber Reinforcement Features Smooth surface & low thermal contact resistance Exceptional thermal performance at lower application pressures 20psi~400psi Usable over a wide temperture range Simplified processing and reduced operating costs

JESD51-2

Abstract: JESD-51 JESD51-9 JESD51-6 G30-88 JESD51-3 JESD51 thermal resistance jesd51 6 SAMSUNG TSOP
Contextual Info: Thermal Characteristics Information 1 Samsung Proprietary • Definition of Thermal Resistance ○ In general, thermal performance of electronic package is represented by two kinds of thermal resistance,θja and θjc. ○ Heat dissipation path in a package and the equivalent thermal resistance

Contextual Info: GT30 High Thermal Conductivity Glassfiber Reinforcement Features Natural tack Smooth surface & low thermal contact resistance Exceptional thermal performance at lower application pressures 20psi~400psi Usable over a wide temperture range Simplified processing and reduced operating costs

GaAs FET operating junction temperature

Abstract: 5257 transistor chip die hp transistor HP transistor cross reference mtt2
Contextual Info: High Frequency Transistor Primer Part III Thermal Properties Table of Contents I. I. Thermal Resistance Thermal Resistance . 1 A. Definition .

Contextual Info: PC93 Non-Silicone Thermal Conductive Pad Features Low contact thermal impedance Good thermal conductivity Silicone free Long term stability Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /

Contextual Info: PC94 Non-Silicone Thermal Conductive Pad Features Low contact thermal impedance Good thermal conductivity Silicone free Long term stability Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /

TGREASE-980

Contextual Info: TgreaseTM 980 Thermal Grease Innovative Technology for a Connected World ENVIRONMENTALLY FRIENDLY THERMALLY CONDUCTIVE GREASE Tgrease 980 is a silicone-based thermal grease for use in high performance CPUs and GPUs. Tgrease 980 has a high thermal conductivity of 3.8 W/mK and superior wetting characteristics, resulting in a very low thermal resistance and excellent long term reliability.

Contextual Info: PC93 Non-Silicone Thermal Conductive Pad Features Low contact thermal impedance Good thermal conductivity Silicone free Long term stability Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /

EMC for PCB Layout

Abstract: AN10874 thermal analysis on pcb JESD51-2
Contextual Info: AN10874 LFPAK MOSFET thermal design guide Rev. 02 — 27 January 2011 Application note Document information Info Content Keywords LFPAK, MOSFET, thermal analysis, design and performance, thermal considerations, thermal resistance, junction to ambient, junction to

Contextual Info: Li-2000 Thermal Tape on rolls Features Good adhesion Low contact thermal impedance High thermal conductivity High bond strength High temp-long term stability Electrically insulating Applications Electronic components: IC / CPU / MOS / LED / M/B / P/S / Heat Sink

Contextual Info: PC94 Non-Silicone Thermal Conductive Pad Features Low contact thermal impedance Good thermal conductivity Silicone free Long term stability Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /

EMC for PCB Layout

Abstract: thermal analysis on pcb AN10874 LFPAK package pcb thermal Design guide JESD51-2
Contextual Info: AN10874 LFPAK MOSFET thermal design guide Rev. 01 — 19 November 2009 Application note Document information Info Content Keywords LFPAK, MOSFET, thermal analysis, design and performance, thermal considerations, thermal resistance, junction to ambient, junction to

SO20-300

Abstract: QFP PACKAGE thermal resistance SO14-150 MBK360 SOT411 QFP-80-14 die bond diode handbook MBK368 QFP120
Contextual Info: CHAPTER 6 THERMAL DESIGN CONSIDERATIONS page Introduction 6-2 Thermal resistance 6-2 Junction temperature 6-2 Factors affecting Rth j-a 6-2 Thermal resistance test methods 6-3 Test procedure 6-3 Forced air factors for thermal resistance 6-4 Thermal resistance data - assumptions and precautions

Contextual Info: Bergquist Thermal Clad Technical Data HT-04503 HIGH TEMPERATURE DIELECTRIC Benefits • Very low thermal resistance of 0.05°Cin2/W (0.32°Ccm2/W) • High thermal conductivity of 2.2 W/m-K • High temperature applications • Lead-free solder compatible

comparative tracking index ceramic

Contextual Info: Bergquist Thermal Clad Technical Data HT-07006 HIGH TEMPERATURE DIELECTRIC Benefits • Very low thermal resistance of 0.11°Cin2/W (0.71°Ccm2/W) • High thermal conductivity of 2.2 W/m-K • High temperature applications • Lead-free solder compatible

UL796

Contextual Info: Bergquist Thermal Clad Technical Data HPL-03015 HIGH POWER LIGHTING DIELECTRIC Superior Dielectric Lowers Operating Temperatures Benefits • Very low thermal resistance of 0.02°Cin2/W (0.13°Ccm2/W) • High thermal conductivity of 3.0 W/m-K • High temperature applications

Contextual Info: TflexTM 200T V0 Series Thermal Gap Filler Innovative Technology for a Connected World THIN THERMALLY CONDUCTIVITY ELASTOMERIC INTERFACE MATERIAL Tflex 200T V0 is a specially formulated thin gap filler thermal interface material designed for thin interfaces that require a combination good thermal performance with great reliability. The elastomeric property of Tflex™ 200T V0 provides good thermal performance in

Contextual Info: Hi-Flow 565UT Tacky, High Performance, Un-Reinforced Phase Change Thermal Interface Material Features and Benefits TYPICAL PROPERTIES OF HI-FLOW 565UT PROPERTY Color • Thermal impedance: 0.05°C-in2/W @25 psi • High thermal conductivity: 3.0 W/m-k

Contextual Info: Bergquist Thermal Clad Technical Data MP-06503 MULTI-PURPOSE DIELECTRIC Benefits • Thermal resistance 0.09°Cin2/W (0.58°Ccm2/W) • Thermal conductivity of 1.3 W/m-K • Multi-Purpose applications • Lead-free solder compatible • Eutectic AuSn compatible