THERMAL CONDUCTIVE TEFLON Search Results

Ablebond

Abstract: Ablecube ablebond 2815a 2815A ablestik ablebond 2815a ATM-0018 ablebond ablestik ablebond technical Ablestik Ablestik 2815
Contextual Info: DEVELOPMENTAL TECHNICAL DATASHEET ABLEBOND 2815A THERMALLY CONDUCTIVE DIE ATTACH ADHESIVE DESCRIPTION ABLEBOND® 2815A die attach adhesive offers high thermal conductivity to minimize thermal resistance between the chip and substrate. This adhesive is designed to provide improved workability for applications requiring high heat extraction from die.

concord ca 2100

Abstract: fagor 2201 HS01U 104 csk 3554M TFT250-18 FAGOR f 948 Concord Electronics MS04/CAGE
Contextual Info: HEATSINKS, MATING SOCKETS, WASHERS, VENDORS ACCESSORIES INFORMATION M I C R O T E C H N O L O G Y HTTP://WWW.APEXMICROTECH.COM RECOMMENDATIONS FOR THERMALLY CONDUCTIVE WASHERS Apex thermal washers are also available from Power Devices. “Thermstrate” is the material trade name for these

Contextual Info: Thermal Stress Relief In Beam Lead Diode Assembly Application Note 993-1 Introduction Unless specific precautions are taken in the mounting of beam lead diodes on soft substrates e.g., Teflon/glass , a strong potential exists for lead failure during exposure to elevated

E6 DIODE

Abstract: diode assembly
Contextual Info: Thermal Stress Relief In Beam Lead Diode Assembly Application Note 993-1 Introduction Unless specific precautions are taken in the mounting of beam lead diodes on soft substrates e.g., Teflon/ glass , a strong potential exists for lead failure during exposure to elevated temperatures. Soft substrate materials have a high thermal coefficient of expansion and

thermal conductive teflon

Contextual Info: Hola1 H A H Insulating caps and insolater sleeves Insulating caps different transistor flange levels will be compensated by the impressed sleeves B art. no. C IK 341 3 art. no. D IK 3 material pressed-in sleeves flammability polyamide, GF reinforced caps

ultrasonic bond

Abstract: schematic WELDER Gunn Diode schematic WELDER capacitor M541 varactor beam lead thermal conductive teflon mesa similar
Contextual Info: Application Note M an A M P com pany Bonding and Handling Procedures for Chip Diode Devices M541 V 2.00 Discussion Microstrip Packages and Chip Carriers Chip diode devices for use in integrated circuit and hybrid integrated circuits have proliferated in the last

schematic WELDER

Abstract: gold melting furnace ultrasonic bond
Contextual Info: Bonding and Handling Procedures for Chip Devices DISCUSSION Chip diode devices for use in integrated circuit and hybrid integrated circuits have proliferated in the last few years. Today's circuit designer is faced with a multiplicity of alter­ natives in the selection of diodes and packaging with each

MIL-G-83528

Contextual Info: Field Replaceable SMA Jack 142 1701-501 142 1701-551 142 1701-601 142 1701-506 142 1701-556 142 1701-606 - - - - - - • Mechanically Captivated • Low RF Leakage • Mates with .012” Diameter Pin Part Number Flange Style Item 1 Body Item 3 Insulator 142-1701-501

FR4 dielectric constant vs temperature

Abstract: FR4 substrate with dielectric constant 4
Contextual Info: THERMAL MANAGEMENT OF SURFACE MOUNT POWER DEVICES Prepared by Herb Fick Bergquist Reprinted with permission of POWERCONVERSION & INTELLIGENT MOTION August 1987 issue. 1987 Intertech Communications, Inc. All Rights Reserved. MOTOROLA Semiconductor Products Inc.

Contextual Info: 142 1701-511 142 1701-561 142 1701-611 Field Replaceable SMA Jack 142 1701-516 142 1701-566 142 1701-616 - - - - - - • Mechanically Captivated • Low RF Leakage • Mates with .015" Diameter Pin Part Number Flange Style Item 1 Body Item 2 Contact 142-1701-511

Contextual Info: Field Replaceable SMA Jack 142 1701-521 142 1701-571 142 1701-621 142 1701-526 142 1701-576 142 1701-626 - - - - - - i : • Mechanically Captivated • Low RF Leakage • Mates with .018" Diameter Pin Ite m 3 In s u la to r Ite m 4 EMI G A S K E T P a rt

Contextual Info: 142 1801-501 142 1801-551 142 1801-601 - Field Replaceable SMA Plug 142 1801-506 142 1801-556 142 1801-606 - • Mechanically Captivated • Low RF Leakage • Mates with .012" Diameter Pin Part Number Flange Style Item 1 Body Item 2 Contact Item 3 Insulator

Contextual Info: Field Replaceable SMA Plug 142 1801-516 142 1801-566 142 1801-616 142 1801-511 142 1801-561 142 1801-611 - - - - - - • Mechanically Captivated • Low RF Leakage • Mates with .015" Diameter Pin Part R a nge Ite m l Item 2 Item 3 Item 4 Item 5 Ite m s Num ber

AL-155-10C

Abstract: belleville washer teflon OPA2541 midland 0804MC AB-037 MC76 MIL-A-8625 OPA512 OPA541
Contextual Info: APPLICATION BULLETIN Mailing Address: PO Box 11400 • Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd. • Tucson, AZ 85706 Tel: 602 746-1111 • Twx: 910-952-111 • Telex: 066-6491 • FAX (602) 889-1510 • Immediate Product Info: (800) 548-6132

TO3 SILICONE MICA SHEET

Abstract: AL-155-10C belleville washer teflon 0804MC OPA2541 90-HS-11 midland Tubing Sleeving Non-shrink AB-037 SBOA020
Contextual Info: APPLICATION BULLETIN Mailing Address: PO Box 11400 • Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd. • Tucson, AZ 85706 Tel: 602 746-1111 • Twx: 910-952-111 • Telex: 066-6491 • FAX (602) 889-1510 • Immediate Product Info: (800) 548-6132

ML-1 94V-0

Abstract: E-36952 TSE397C-333ML MIL-A-46106 str 6709 MIL-A-46146 str 6708 Mil-S-46163A semiconductors cross index semiconductors cross reference
Contextual Info: Why MG Chemicals? At MG Chemicals, we realize that our number one asset is you, our customer. ISO Quality Standards. Since 1955, M.G. Chemicals has provided the North American electronics industry with a full line of high performance chemicals and accessories. The M.G. Chemicals manufacturing facility operates

JEDEC JESD22-B116 free

Abstract: SUMIKON EME-G700 EME-G700 ablebond 3230 SUMItomo EME-G700 Sumitomo EME-G700 material Ablebond 84-1*SR4 Ablebond 8390 sumitomo G700 Tg ablebond 8390 cure time
Contextual Info: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: SR-0212-02 DATE: 12/20/2002 Product Affected: TSOP package family (see attachment for affected part #s). Date Effective: 3/20/2003 Contact: George Snell

10K3A1-25

Abstract: 10K3A1IA Betatherm 10K3A1B Betatherm 10K3A1IB betatherm 3k3a1a 30K6A1B 36K53D1-RS1030 Betatherm 30K5A1B 36K53A1
Contextual Info: BetaTHERM Sensors BetaTHERM Sensors Products and Data Ireland 353-91-753238 U.S.A. 508-842-0516 BetaTHERM 51 Web: http://www.betatherm.com BetaTHERM Sensors BetaCurve Interchangeable Thermistor Series I BetaCurve Interchangeable Thermistor Series I Applications

HUGHES mcw 550

Abstract: hughes welder welder hughes mcw 550 ECCOBOND 56c SN62PRMAB3 relative permittivity beryllium copper ferrite welder ECCOBOND 300 kester Re SOLDER PASTE mcw-550
Contextual Info: Ferrodisc and Drop-In* Devices Overview Ferrodisc and Drop-In circulators and isolators manufactured by M/A-COM are ex­ tremely well suited for all types of microwave integrated circuits MIC’s . The rapidly growing awareness and utilization of these devices in microwave systems of all

Sony ACF

Abstract: ANISOLM upilex S 40 hitachi ACF upilex AC-7144 AC-7104 Hitachi 15 inch LCD HD66712TA0 acf film
Contextual Info: The Information of TCP Features of TCP TAB Technology Flexible Design The structure and materials used by Tape Carrier Package (TCP) give it the following features as compared with conventional packages: The following can be tailored to the design of the

Contextual Info: REVISIONS P/N CAPTIVATION METHOD BASIC CC NONE EPOXY ONLY SF NONE CCSF EPOXY ONLY CCCE EPOXY WITH CONDUCTIVE CCCESF EPOXY WITH CONDUCTIVE ZONE REV. - A DESCRIPTION S DATE ECO 19541 BY 09.01.06 DKN (.550) (.325) — (.312 HEX) — MATERIAL(S): ELECTRICAL(S):

ASTM-F-150-72

Abstract: MIL-B-117 ASTM-D-991 FED-STD-101 ASTM-D991 Bipolar Static Induction Transistor cmos esd sensitivity MIL-M-55565 ASTM-D-257 SOAR-1
Contextual Info: R-FLOW ESD PROTECTION PROGRAM Linear Technology Corporation R-Flow Reliability has been a key focal point at Linear Technology Corporation LTC since its inception in 1981. Our standard product reliability is monitored closely and we have generated an extensive reliability database for both hermetic and plastic devices. This data is published on a

Contextual Info: Series 811 Mighty Mouse High Density HD Connectors The Ultraminiature Ruggedized Connector with High-Performance Micro TwistPin Contacts United States  United Kingdom  Germany  France  Nordic  Italy  Spain  Japan Series 811 High DENSITY

MIL-B-81705

Abstract: ASTM-D-257 ASTM-D991 ASTM-D-991 SOAR-1 ASTMF-150 ASTM-F-150 VZAP-90 20AWG MIL-B-117
Contextual Info: R-FLOW ESD PROTECTION PROGRAM Linear Technology Corporation R-Flow Reliability has been a key focal point at Linear Technology Corporation LTC since its inception in 1981. Our standard product reliability is monitored closely and we have generated an extensive reliability database for both hermetic and plastic devices. This data is published on a