THERMAL CONDUCTIVE PRESSURE SENSITIVE ADHESIVE Search Results

9707K

Contextual Info: Technical Data May 2014 3M Electrically Conductive Adhesive Transfer Tape 9707 Product Description 3M™ Electrically Conductive Adhesive Transfer Tape ECATT 9707 is a pressure sensitive adhesive (PSA) transfer tape with isotropic electrical conductivity. The PSA matrix is filled with conductive fillers that allow interconnection

R200

Abstract: WLFT 404 Al2O3 aluminium foil 200X200 100X100
Contextual Info: Hola1 H A H Thermally conductive foil both sides adhesive – – – – B good thermal charactaristics double-sided adhesive layers replaces mechanical fastenings cuttings and cut-outs upon request C D WLFT WLFT WLFT WLFT E F art. no. 404 R25 404 R50 404 R100

WLFT 404

Abstract: L203 WLFT 405
Contextual Info: Thermally conductive foil both sides adhesive - good thermal charactaristics double-sided adhesive layers replaces mechanical fastenings cuttings and cut-outs upon request art. WLFT 404 WLFT 404 WLFT 404 WLFT 404 WLFT 414 WLFT 414 no. R25 R50 R100 R200 R25

8810

Abstract: Tape UL746A MH17478 UL746C UL-746A UL-746C UL-746C silicone rubber E213134 adhesive rubber based msds
Contextual Info: Technical Data April, 2008 3M Thermally Conductive Adhesive Transfer Tapes 8805 • 8810 • 8815 • 8820 Product Description 3M™ Thermally Conductive Adhesive Transfer Tapes 8805, 8810, 8815 and 8820 are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices e.g., fans, heat spreaders

Contextual Info: Technical Data June 2011 3M Electrically Conductive Adhesive Transfer Tape 9705 Product Description 3M™ Electrically Conductive Adhesive Transfer Tape ECATT 9705 is a pressure sensitive adhesive (PSA) transfer tape with anisotropic electrical conductivity. The PSA matrix is filled with conductive particles which allow interconnection

TRANSISTOR REPLACEMENT GUIDE d882

Abstract: transistor D1876 TRANSISTOR D412 7403-09FR d1876 transistor SIL-PAD 2000 density transistors D1876 SIL-PAD 3223 Sil Pad A2000 0.015 TR-NWT-000930
Contextual Info: Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES,

Contextual Info: Technical Data May 2011 3M Electrically Conductive Adhesive Transfer Tape 9704 Product Description 3M™ Electrically Conductive Adhesive Transfer Tape ECATT 9704 is a pressure sensitive adhesive (PSA) transfer tape with anisotropic electrical conductivity. The PSA matrix is filled with conductive particles which allow interconnection

Contextual Info: Technical Data June 2011 3M Electrically Conductive Adhesive Transfer Tape 9706 Product Description 3M™ Electrically Conductive Adhesive Transfer Tape ECATT 9706 is a pressure sensitive adhesive (PSA) transfer tape with anisotropic electrical conductivity. The PSA matrix is filled with conductive particles which allow interconnection

Contextual Info: Technical Data October, 2009 3M XYZ / Isotropic Electrically Conductive Adhesive Transfer Tape 9709S / 9709 SL Product Description 3M™ Electrically Conductive Adhesive Transfer Tape 9709S is a pressure sensitive adhesive PSA transfer tape with isotropic electrical conductivity. The PSA matrix is filled with conductive fillers which allow interconnection between

L425

Abstract: lanskroun
Contextual Info: Ta CAPACITORS WITH CONDUCTIVE POLYMER ROBUST TO LEAD FREE PROCESS A B S T R A C T : Tantalum capacitors with conductive polymer cathodes have found a place in the market as a low ESR component with reduced ignition. Conductive polymer cathodes however, suffer from instability

optically clear adhesive

Abstract: ecg master replacement guide 1115b silver conductive ink resins QTM-500 MGC 7805 CONDUCTIVE INK FOR FLEX CIRCUITS 3m 7815 8880-S7 UL-746
Contextual Info: 3M Electronics Assembly Solutions Product Selection Guide Smart Solutions for Building In Value 3M Company, operating in more than 60 countries, has over 60,000 products. These products, based on 40 technology platforms, have been developed by 6,500 3M Product Developers Worldwide.

Contextual Info: Poly-Pad K-10 Polyester-Based,Thermally Conductive Insulation Material Features and Benefits T YPICAL PROPERT IES OF POLY-PAD K-10 PROPERTY IMPERIAL VALUE Color Yellow Reinforcement Carrier Kapton Thickness inch / (mm) 0.006 Hardness (Shore A) 90 Breaking Strength (lbs/inch) / (kN/m)

ASTM D5470

Abstract: Tgon 800 D5470 Tgon tgon 805 D412 E595 D2240 D257 ASTM D2240
Contextual Info: TgonTM 800 Series Electrically and Thermally Conductive Interface Pad Innovative Technology for a Connected World High-PERFORMANCE, cost effective thermal interface material Used where electrical isolation is not required, Tgon 800 is ideal for where electrical

KS-886H

Abstract: Kostat tray
Contextual Info: Thermal Management and Mechanical Handling for Altera TCFCBGA Devices AN-657-1.1 Application Note This application note describes the thermal composite flip chip ball-grid array TCFCBGA package for the Arria V device family. TCFCBGA improves board real-estate use by allowing closer spacing between passive

K52-2

Abstract: K521 k523 D257 D149 D374 D412 ASTM D374 K52-3 ASTMD149
Contextual Info: TgardTM K52 Thermally Conductive Insulators Innovative Technology for a Connected World High Thermal and Dielectric Performance Insulator Pad TgardTM K52 is a high thermal and dielectric performance insulator pad consisting of a ceramic filled phase change compound coated on MT Kapton film.

a13514

Abstract: D149 D150 D2240 D257 D412 E595
Contextual Info: TgardTM 200 Series Thermally Conductive Insulators Innovative Technology for a Connected World High Performance Thermal Interface Products The Tgard 200 is a high performance interface pad. Consisting of a silicone/boron nitride composite, these fiberglass-reinforced pads are used when the lowest thermal resistance and highest dielectric

bergquist

Abstract: SIL-PAD 1000 TO 247 ASTM D2240, D412 ASTM D374 SIL-PAD 900S D149 D150 D2240 D257 D374
Contextual Info: Sil-Pad 900S High Performance Insulator for Low-Pressure Applications Features and Benefits TYPICAL PROPERTIES OF SIL-PAD 900S PROPERTY Color • Thermal impedance: 0.61°C-in2/W @50 psi • Electrically isolating • Low mounting pressures • Smooth and highly compliant surface

bergquist

Abstract: SIL-PAD density conductivity ASTM D575 bergquist ultra soft
Contextual Info: Gap Pad VO Ultra Soft Ultra Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO ULTRA SOFT PROPERTY Color • Thermal conductivity: 1.0 W/m-K • Highly conformable, low hardness • “Gel-like” modulus

CD Laser pickup focus tracking

Contextual Info: Panasonic Hologram Unit HUL7001 Hologram Unit Index mark for No.l U nit : mm For optical inform ation processing • Features il" T¡gi r • Smaller package size achieved through micro-mirror integration 4.8 X 8.2 X 4.3 mm • Focus error signal detection : SSD method

CBVK741B019

Abstract: F63TNR FDD6530A FDD6630A FDD6680
Contextual Info: FDD6530A 20V N-Channel PowerTrench MOSFET General Description Features This N-Channel MOSFET has been designed specifically to improve the overall efficiency of DC/DC converters using either synchronous or conventional switching PWM controllers. It has been optimized for

tic 246

Contextual Info: FDD2612 200V N-Channel PowerTrench MOSFET General Description Features This N-Channel MOSFET has been designed specifically to improve the overall efficiency of DC/DC converters using either synchronous or conventional switching PWM controllers. It has been optimized for

Mosfet FDD

Contextual Info: FDD2512 150V N-Channel PowerTrench MOSFET General Description Features This N-Channel MOSFET has been designed specifically to improve the overall efficiency of DC/DC converters using either synchronous or conventional switching PWM controllers. These MOSFETs feature

Altera Flip Chip BGA warpage

Abstract: ansys graphite thermal spreader graphite thermal 1998 ansys cfd
Contextual Info: Thermal Interface Material TIM Design Guidance For Flip Chip BGA Package Thermal Performance T.D. Yuan, Hsin-yu Pan Taiwan Semiconductor Manufacturing Company, Ltd. No. 6, Creation Rd. 2, Science-Based Industrial Park Hsin-Chu, Taiwan, 300-77, R.O.C. tdyuan@tsmc.com, hypanb@tsmc.com

ASTM-D-4935

Abstract: ASTM-D4935 UL-510 for 3m 1181 80-6109-4173-6B
Contextual Info: EMI Shielding Tapes 3 A wide variety of tapes for EMI shielding and grounding • Copper, aluminum, and tin-plated copper foil backings • Conformable copper-plated fabric backing • Smooth and embossed foil surfaces • Conductive and nonconductive acrylic