TFA9981UK Search Results
TFA9981UK Datasheets (1)
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| TFA9981UK |
|
Wafer level chip-size package; 9 bumps; 1.3 x 1.3 x 0.6 mm | Original | 215.23KB | 1 |
TFA9981UK Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
|
Contextual Info: Package outline WLCSP9: wafer level chip-size package; 9 bumps; 1.3 x 1.3 x 0.6 mm A B D TFA9981UK bump A1 index area A2 E A A1 detail X e1 e ∅v ∅w b C C A B C y C e e2 B A bump A1 index area 1 2 3 X 0.5 Dimensions Unit mm max nom min 1 mm scale A 0.6 |
Original |
TFA9981UK tfa9981uk |