TEST CONDITIONS Search Results

JESD22-A102-B

Abstract: JESD22-A113
Contextual Info: RF 1C ENVIRONMENTAL QUALIFICATION TESTS Group A Group Step Name Conditions Control A A A1 A1 A2 A2 A2 A2 B Packaging Initial Test Control Group Screen IR Reflow simulation Functional test Temp.Cvcle Functional test Life test Interim Test Life Test cont. Functional test

5962-8513101XA

Abstract: 5962-85131073A 5962-85131083C 5962-85131013A 5962-85131032A HI5116 34371 5962-8513105XA hi4-546 5962-85131083A
Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Add case outlines, terminal connections and thermal resistance values for case outlines 2 and 3. For device type 01, 02, and 03, add subgroup 3 to IIH and IIL test, add RDS1 test, add VISO test, delete VCT test, change RL and CL test conditions for

107D

Contextual Info: CHIP LED LAMPS GENERAL INFORMATION QUALITY CONTROL AND ASSURANCE Classification Endurance Test Environmental Test Test Item Reference Standard Test Conditions Operation Life MIL-STD-750 : 1026 MIL-STD-883 : 1005 JIS C 7021 : B-1 High Temperature High Humidity

107D

Abstract: HX2040
Contextual Info: CHIP LED LAMPS GENERAL INFORMATION QUALITY CONTROL AND ASSURANCE Classification Endurance Test Environmental Test Test Item Reference Standard Test Conditions Result Operation Life MIL-STD-750 : 1026 MIL-STD-883 : 1005 JIS C 7021 : B-1 Connect with a power If = 20mA

Maruwa substrate

Abstract: H60A H63A C15010C
Contextual Info: MARUWA GENERAL CATALOG PERFORMANCE AND TEST METHOD Specifications CHIP VARISTORS Characteristics Test Method and Conditions 20ȗ5°C,65ȗ20% RH in principle. If results obtained are doubted, a further test should be carried out at 20ȗ15°C, 65ȗ20% RH. Standard Test Condition

Contextual Info: TeleLink Fuse Qualification Data The F1250T and F1251T meet the following test conditions per GR 1089 without any additional series resistance. However, in-circuit test verification is required. Note that considerable heating may occur during Test 4 of the Second Level AC Power Fault Test.

TELELINK

Contextual Info: Four-port TeleLink Fuse Qualification Data The F1250Z8 and F1251Z8 meet the following test conditions per GR 1089 without additional series resistance. However, in-circuit test verification is required. Note that considerable heating may occur during Test 4 of the Second Level AC Power Fault Test.

Teccor Electronics

Contextual Info: TeleLink Fuse Qualification Data The 0461 1.25 and 0461 002. meet the following test conditions per GR 1089 without additional series resistance. However, in-circuit test verification is required. Note that considerable heating may occur during Test 4 of the Second Level AC Power Fault Test.

EIAJ ED-4701 305

Contextual Info: Reliability Test Category Environmental Test No Test Category Related Standards Test Conditions Purpose MIL-STD-883G IEC 60749 IEC 60068-2 JESD22 EIAJ ED-4701 ― Part 5 ― A101-C Method 102 To evaluate the endurance of the devices when used in high temperature and high humidity

Contextual Info: TestStation LH In-Circuit Test System Quality In-Circuit Test at an Affordable Price ½ High fault coverage ½ Safe low voltage test ½ Fast test throughput ½ Exceptional diagnostic accuracy ½ Proven test reliability ½ Scalable test capabilities ½ Low cost of

Contextual Info: Test Conditions: - All test in room temp. Input board loss = ignored Output board loss = ignored Vcc = 9.00V

RF Connectors

Abstract: BGE885 BGX881 BGD885 BGX885N SC16
Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET SC16_TEST_JIGS CATV test jigs 1998 Mar 06 File under Discrete Semiconductors, SC16 Philips Semiconductors CATV test jigs SC16_TEST_JIGS STANDARD CATV TEST JIG PARAMETER CONDITIONS VALUE Frequency Suitability 5 to 1000 MHz

NSG1003

Abstract: TDS1002 TSP070-112 TSP090-124 TSP140-112 TSP180-124 TSP360-124 TSP600-124
Contextual Info: SEMI F-47 Test Compliance Test Report Standard: SEMI F47-0200 Specification for Semiconductor Processing Equipment Voltage Sag Immunity Test Procedure Standard: Semi F42 : Test method for Semiconductor Processing Equipment. Voltage Sag Immunity 1. Test Setup

Willamette

Abstract: project transistor tester
Contextual Info: Intel Technology Journal Q1’99 Defect-Based Test: A Key Enabler for Successful Migration to Structural Test Sanjay Sengupta, MPG Test Technology, Intel Corp. Sandip Kundu, MPG Test Technology, Intel Corp. Sreejit Chakravarty, MPG Test Technology, Intel Corp.

Contextual Info: AC TEST CIRCUITS AND WAVEFORMS The following test circuits and conditions represent SG S’s-THOM SON typical AC test procedures. The output loading for standard Low Power Schottky devices is a 15 pF capacitor. Experim ental evidence shows that test results using the additional dioderesistor load are within 0.2 ns of the capacitor only

philips hybrid amplifier modules

Abstract: hybrid for catv amplifier catv amplifier CATV amplifier module transistor jig and fixture ON5045 RF Connectors catv catv hybrid wideband hybrid
Contextual Info: DISCRETE SEMICONDUCTORS CATV Test fixture Wideband Hybrid Amplifier Modules for CATV Supersedes data of 1998 Mar 06 2000 Apr 21 Philips Semiconductors Wideband Hybrid Amplifier Modules for CATV CATV Test fixture STANDARD CATV TEST FIXTURE PARAMETER CONDITIONS

ELECTRO MAGNETIC INTERFERENCE CONTROL TECHNIQUES

Abstract: outgoing raw material inspection procedure RAW MATERIAL INSPECTION procedure
Contextual Info: VISHAY Vishay Semiconductors Reliability & Statistics Glossary Definitions Accelerated Life Test: A life test under conditions those are more severe than usual operating conditions. It is helpful, but not necessary, that a relationship between test severity and the probability

smd rnw

Abstract: ADG508A DG508A HI-508A HI-548 MAX358
Contextual Info: REVISIONS F V YR-M0-DA APPROVED 87-01-30 Change to military drawing format. Add device type 03. Device 01, case E, inactive for new design. Table I (device 01) change test condition for Ij|_- Table I (device 02): Delete test Rpgg ant^ ^CT' add test ÀRq s v change test conditions and limits for: «qs V CIS'

QT12C05

Abstract: QT12C01 QT60248 QT12C QT6C01 QT60160 TE2124 QT60000 QT60486
Contextual Info: lQ QT60240 TEMPERATURE TEST 1 Introduction 4. The temperature test has following test sequence: This document outlines the results of the temperature test for QT60240. This test and its results shall apply to the QT60000 chip family that includes QT60160,

AN557

Abstract: HI-200 HI-201 HI-201HS HI-303 HI-307 HI-390 HI-5042 HI201 cross reference
Contextual Info: Recommended Test Procedures for Analog Switches Application Note Introduction The following text describes the basic test procedures that can be used for most Intersil CMOS switches. Various test conditions are used with the various switches. Table 1 has

Contextual Info: D-Subminiature Adapter Test Kit & Hardware Adapter Test Kit Specially designed for EMI evaluation process • ■ Male/female adapter part Adapter Test Kit Easily plugged into equipment under testing conditions Hardware ■ Ideal for new products and retrofitting

jackscrew

Contextual Info: D-Subminiature Adapter Test Kit & Hardware Adapter Test Kit Specially designed for EMI evaluation process Adapter Test Kit • Male/female adapter part ■ Easily plugged into equipment under testing conditions Hardware ■ Ideal for new products and retrofitting

Contextual Info: 8. Reliability 8. Reliability The reliability of surface mount devices is periodically checked and controlled according to the following table : Reliability of Surface Mount Devices Test Item Test Time Test Conditions Criteria External dimensions Physical dimensions m ust meet individual

mil-std-202 method 112 test condition c

Contextual Info: Specifications and Test Circuits VISHAY Vishay Dale ENVIRONMENT L AND MECHANICAL SPECIFICATIONS DESCRIPTION LIMITS/CONDITIONS TEST PROCEDURES Thermal Cycle - 55°C, + 85°C, 5 cycles MIL-STD-202, Method 107, Condition A Gross Leak Test All units 100% leak tested