TEST & BURN IN SOCKETS Search Results

Contextual Info: 3M " K Sockets • Sockets for computer chips • Test and burn-in sockets • Other production sockets 3M Electronic Specialty Markets http://www.mmm.com/esm 85

pogo pins

Contextual Info: CRYSTAL OSCILLATOR TEST & BURN IN SOCKET AXS-7050-06-13 Precision test socket for 7x5mm, Pb RoHS 6 pad crystal oscillator packages. Compliant FEATURES: | | | | | | | | | | | | | | | APPLICATIONS: APPLICATIONS: APPLICATIONS: • Accurate and reliable testing of frequency control devices

pogo pins

Contextual Info: CRYSTAL TEST & BURN IN SOCKET AXS-5032-02-06 Precision test socket for 5x3.2mm, Pb RoHS Compliant 2 pad crystal packages. | | | | | | | | | | | | | | | FEATURES: • Accurate and reliable testing of frequency control devices • Contact force ideal for avoiding measurement error

TEXTOOL

Abstract: land pattern BGA 0,50 3M 2380
Contextual Info: 3M Textool, 1.0mm pitch, Lidded, BGA Test & Burn-In Sockets Type I, II, III • Highly reliable contact that allows for normal variation in BGA ball-diameter and position. • Low spring-rate design achieves minimal solder ball deformation while allowing up to a 0.2mm

Contextual Info: Test & Burn-In Grid ZIP Sockets Pin Grid Arrays • Lever actuated zero insertion force mechanism • Rugged 3-plate construction for durability and electrical reliability • Available in 10 x 10 through 25 x 25 matrices • PTFE coated stainless steel handle - durable

TEXTOOL

Abstract: TS-1358-04 2XXX-1358
Contextual Info: 3M Textool, Interstitial Pin Grid Array Test & Burn-In Sockets • 19 X 19 outer matrix with 18 X 18 inner staggered matrix holds up to 685 leads. • Lever actuated, zero insertion force mechanism. • Rugged, 3-plate construction for durability and electrical reliability.

YSK005-015AH

Abstract: YSK0076-040AH YSK0076 HPG241F30AH YSK0076-026AH YSK005-002AH YSK035-004AH YSK0076-068AH YSK0076-011AH YSK0102-011AH
Contextual Info: Y SERIES DISCRETE SIGNAL & POWER CONTACTS Models for dry circuit to 500 amps .016” .4mm to .650” (16.5mm) diameter pins with mating sockets Long life contacts Contact resistance from .04 to 8 milliohms Ideal for test, burn-in, and highpower use INDIVIDUAL CONTACTS

BURN

Contextual Info: CRYSTAL OSCILLATOR TEST & BURN IN SOCKET AXS-7050-06-07 FEATURES: • Accurate and reliable testing of frequency control devices • Contact force ideal for avoiding measurement error • Highest quality socket available • Clam shell design for easy open and close

j 6810

Abstract: J 6810 D PGA zif socket 289 ASTM B545 amp pga socket
Contextual Info: ZIF PGA Test & Burn-in Socket for Any Footprint on Std 13x13 to 21x21 Grid FEATURES • A strong, metal cam activates the normally closed contacts, preventing dependency on plastic for contact force • The handle can be provided on right or left hand side

tic 154

Abstract: tic 154 a TIC 31 tic 32 AA-28-C182-1-0 28-C182-10 B 0483
Contextual Info: IC-Sockets Test- and Burn-In sockets Lock/Eject-DlP-sockets I¿C C TVHA.OCK t-A T C H _ _ Ri Ulit^ ti i . . „ S î Ï Ï Ï Ï jm iJM FTT Excellent vibration resistance. Damage-free, easy ejection of sockets and Jumpers. Pitch 15,24 mm. Part no. AÛ8-TC

2XXX-1361-SX-3302

Abstract: TS-1361-04
Contextual Info: Test & Burn-In SPGA Socket • • • • Package for 1.27 mm .050" pitch PGA Zero insertion force Double mating contact Lever mechanism for opening and shutting switch over • Maximum grid 37x37 and lead count of 600 TS-1361-04 Sheet 1 of 3 Date Issued: June 20, 2001

Contextual Info: Zero Insertion Force PGA Test and Burn-in Sockets cont. * * * * * Grid Size 12 x 12 13 x 13 14 x 14 15 x 15 16 x 16 17 x 17 18 x 18 19 x 19 20 x 20 21 x 21 No. of Pins 144 169 196 225 256 289 324 361 400 441 Dim. “C” 1.100 [27.94] 1.200 [30.48] 1.300 [33.02]

0408 GO Diode

Abstract: ZGP323 ZGP323ICE02ZEMG
Contextual Info: ZGP323ICE02ZEMG Z8 GP ZGP323 In-Circuit Emulator User Manual UM019606-0408 Copyright 2008 by Zilog , Inc. All rights reserved. www.zilog.com Z8 GP™ ZGP323 In-Circuit Emulator User Manual ii Revision History Each instance in the Revision History table reflects a change to this document from its previous revision. For more details, refer to the corresponding pages and appropriate links in the following table.

24c16an

Abstract: goodmans module 80 SERVICE MANUAL samsung television sansui television service mode manual YAMAHA mate 111 SEM 2006 samsung SERVICE MANUAL sansui siemens ntc k25 samsung led tv service manual sony led tv service manual
Contextual Info: ZLP128ICE01ZEM Crimzon In-Circuit Emulator User Manual UM018403-0207 Introduction Thank you for purchasing the ZiLOG Crimzon™ In-Circuit Emulator ICE . The Crimzon ICE provides Crimzon chip family emulation with a trace and event system for program debugging using ZDS II development tools. Once your code is complete, use the included

G6B-1147P-FD-US

Abstract: G6b1184 G6B-4BND G6B-1184P G6B-47BND G6B-47B P6BF-4BN G6B equivalent g6b1184p P6B-Y1
Contextual Info: Terminal Relay G6B-4@@ND CSM_G6B-4_ND_DS_E_3_1 Compact Terminal Relay with 4 Independent Outputs • Equipped with four G6B Mini-relays that are compact, highly sensitive, and highly resistant to dielectric surges, and that can switch 5 amps of power. • Sealed plastic construction used for relays.

P6BF-4BND

Abstract: G6B-47BND G6B-1184P G6B-4BND G6B-1174P-FD-US-P6B G6B-1114P-FD-US-P6B P6BF-4BN 1174P G6B-1184P-US G6B-1147P-FD-US
Contextual Info: Terminal Relay G6B-4@@ND CSM_G6B-4_ND_DS_E_5_1 Compact Terminal Relay with 4 Independent Outputs • Equipped with four G6B Mini-relays that are compact, highly sensitive, and highly resistant to dielectric surges, and that can switch 5 amps of power. • Sealed plastic construction used for relays.

P7TF-OS16

Abstract: omron p7tf-OS16-1 omron p7tf G3TA OS16 p7tf-05 P7TF-OS08 G3TA-OD201S-US
Contextual Info: Solid State Relays G3TA Refer to Safety Precautions for All Solid State Relays. I/O SSRs That Mount to OMRON’s G7TC I/O Block • Input and output modules are available in wide variety. • Snaps easily into P7TF I/O Terminals and can be used together with G7T I/O relays.

G3HD-202SN-VD

Abstract: PT08 PT08-0 PT08QN PTF08A-E EN609474-3
Contextual Info: Solid State Relays G3@-VD G3H/G3HD Refer to Safety Precautions for All Solid State Relays. International Standards for G3H Series, Same Profile as LY Power Relays • Shape-compatible with mechanical relays. • Certified by UL, CSA, and VDE models numbers with a suffix

ultrasonic water level indicator project

Abstract: EN29001
Contextual Info: I mIa IrIl I Technical Inform ation Installation Details and Material Specification Series ! Maximum Power : Dissipation mW Maximum Reverse Voltage VDC Panel Cutout Minimum Mounting Centres Maximum Panel Thickness 6.35 with wiring socket 13.0 with wiring socket

SuperPro IS01

Abstract: how to reset ATMEL 24C04 eprom programmer schematic diagram What are the pins to reset 24C04 24c04 st 24C04 FAT16 FAT32 M25P64 IC 24C04
Contextual Info: Contents Contents . 1 Outline . 3

Out of this World Interconnect Solutions

Abstract: 232-100-H0 VG96929 232-100-H7 232-100-H2 232-100-H5
Contextual Info: Qwik Connect Out of This World INTERCONNECT SOLUTIONS GLENAIR n A p ril 2 0 1 2 n VOLUME 16 n NUMBER 2 Out of This World INTERCONNECT SOLUTIONS TABLE OF Contents Contacts, Wires and Cables • SAE-AS39029 Crimp Contacts • High Performance Shielded Contacts

mechanical engineering project

Abstract: AT49BV162A M29W008AB M29W008AT MT28F008B3
Contextual Info: Technical Note ZTP 1.3.3/1.3.4 Frequently Asked Questions TN004601-1105 ZiLOG Worldwide Headquarters • 532 Race Street • San Jose, CA 95126-3432 Telephone: 408.558.8500 • Fax: 408.558.8300 • www.zilog.com ZTP 1.3.3/1.3.4 Frequently Asked Questions

5- pin smd IC 358

Abstract: P-MQFP-80-1 yamaichi IC Test Socket DK55 TSOP 54 SOCKETS smt mount C176CR C513 HR 7058 IC51-0804-956-2 P-MQFP-44
Contextual Info: YAMAICHI - Product Information page 1 of 6 Karl-Schmid-Straße 9 D-81829 München Telefon 0 89 / 45 10 21-0 Telefax 0 89 / 45 10 21-10 E-mail: sales@yamaichi.de Internet: http://www.yamaichi.de IC149 Production Use Socket for following Siemens IC`s: • C511 / C513

TAIYO PSR 4000

Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).