TES 262 Search Results

106 25K

Abstract: MC1554 t250v HA-2720 li87 Fairchild Semiconductor S2M rc4558 preamp UA715 ua740 HA-2050A
Contextual Info: BURN-IN CIRCUITS HA-2700 HA-2700 TO-99 "I 3 j" -v w —O— N O TES: T A = +125oC N O TES: T a = + 1 2 5 °c R1 = 1 M ego hm R-j = 1 M eg o h m HA-2720 N O TES: TA =+125° C-|C2 = 0.01 to 0.1 JUF R-| = 1 K£2 TO-99 R 'j = 1 0 K i2 R 4 = 5 K i2 R 2 = 2 M ii

lm 1458 high pass filter

Abstract: CI 2904 HA-2905 lt 2904 LM102 low pass filter Fairchild Semiconductor S2M ma702 MC1554 mC 1458 op and application Precision Monolithics
Contextual Info: BURN-IN CIRCUITS HA-2700 HA-2700 TO-99 "I 3 j"- v w —O— N O TES: T A = +125oC R1 = 1 M e g o h m HA-2720 N O TES: TA =+125° C -|C 2 = 0 .0 1 to 0.1 JUF R-| = 1 K£2 N O TES: T a = + 1 2 5 °c R-j = 1 M e g o h m TO-99 R 'j = 1 0 K i2 R 4 = 5 K i2 R 2 = 2 M ii

Neuron 3150

Abstract: Neuron Chip 3150 CYPRESS Neuron Chip 3150 2k x 8 nvram 3150 Echelon TDSR 3150 l gal20v8 application dallas date code FOR DS1230Y 57C256F-70
Contextual Info: N eu ro n 3150" Chip August 1991 External Memory Interface Lon W orks Engineering Bulletin Introduction T he NEURON 3150 CHIP p ro v id e s a n ex tern al m e m o ry b u s to p e rm it e x p a n sio n of m e m o ry u p to 58K b y tes b e y o n d th e 512 b y tes of EEPROM a n d 2K b y tes of RAM

45970-8115

Abstract: 00y5
Contextual Info: N O TES: h.005 DIM G 1. M A T E R IA D : H O U SIN G : DOR, U L 9 4 V - 0 , B D A C K CO N TACTS: SO D D ER i g 2. W F IN IS H : ADD O P T IO N S ü l& l r^ ir ^ r ^ ir ^ ir ^ ir^ ir^ ir^ ir^ ir^ T PRO D UCT M A TES 2.0 & 2.5: S E D E C T O P T IO N S 3.0 T H R U

TEKELEC te 360

Abstract: Naltron Jaco Electronics
Contextual Info: «HYUNDAI UNITED STA TES OF AMERICA Western Region ION Associates 9390 Research Blvd., Bldg. 2 Suite 210, Austin, TX 78759 Te 1:512-794-9006 Electrodyne 2620 S. Parker Road, Suite 395 Aurora, CO 80014 Te 1:303-695-8903 Fax:303-745-8924 ION Associates 221 E. Lamar Blvd., Suite 250

Contextual Info: TES Low ESR – QPL ESCC Low ESR Tantalum Chip Capacitor • QPL ESCC approved series • Manufactured in EU, ESA qualified plant, according to ESCC 3012 • Detailed specification 3012/004 • Low ESR designed parts, multianode D and E case included • Robust against higher thermo-mechanical stresses during assembly process

Contextual Info: TES Low ESR - EPPL 2 Low ESR Tantalum Chip Capacitor • EPPL 2 ESCC approved series • Manufactured in EU, ESA qualified plant, according to ESCC 3012 • Detailed specification 3012/004 • Low ESR designed parts, multianode D and E case included • Robust against higher thermo-mechanical stresses during assembly process

ci 1458 texas

Abstract: ca3130 replacement 1488 1489 standard philbrick amp op 2060 pe 2520 linear encoder ca3130 equivalent TELEDYNE PHILBRICK 5558 op amp MA776
Contextual Info: BURN-IN CIRCUITS HA-909 HA-909, H A-2500, HA-2502, HA-2510, HA-2512, H A-2520, HA-2522, HA-2600, HA-2602, HA-2620, H A-2622, HA -2050, HA-2050A , HA-2060, HA-2060A TO-99 H < a j— N O TES: T a = + 1 2 5 °C R- = 1 M egohm C-] = 0.01 jU F, 1 0 0 V HA-2000

tes 3012

Abstract: ESCC3012
Contextual Info: TES Low ESR - EPPL 2 Low ESR Tantalum Chip Capacitor • EPPL 2 ESCC approved series • Manufactured in EU, ESA qualified plant, according to ESCC 3012 • Detailed specification 3012/004 • Low ESR designed parts, multianode D and E case included • Robust against higher thermo-mechanical stresses during assembly process

TES 262

Abstract: capacitor 226 20V 476 capacitor 10 k e106050 B0035 tes 3012 E0065 D0055 TES 165 d0045
Contextual Info: TES Low ESR - EPPL 2 Low ESR Tantalum Chip Capacitor • EPPL 2 ESCC approved series • Manufactured in EU, ESA qualified plant, according to ESCC 3012 • Detailed specification 3012/004 • Low ESR designed parts, multianode D and E case included • Robust against higher thermo-mechanical stresses during assembly process

Contextual Info: STOCKO CORP fi fci 74a7ö Ü0GD017 2 S tiftgehâuse mit R astlasche für w a ag erech tes Stecken S E R IE S E R IE S S É R IE Pin connectors with snap-in locking device for horizontal connections MKS 2620 Em bases mâles à sorties à 9 0 ° en ligne à m ontage inversé,

HA-2500

Abstract: HA-2502 HA-2510 HA-2512 HA-2520 HA-2522 HA-2600 HA-2602 HA-2620 HA-909
Contextual Info: BURN-IN CIRCUITS HA-909 HA-909, HA-2500, HA-2502, HA-2510, HA-2512, HA-2520, HA-2522, HA-2600, HA-2602, HA-2620, HA-2622, HA-2050, HA-2050A, HA-2060, HA-2060A TO-99 H < a "1 3 j— NO Ta R- C-] TES: = + 1 2 5 °C = 1 M egohm = 0 .0 1 jU F , 1 0 0 V HA-2000

Contextual Info: ASP-62727-03 m N0 TES: ^ 1. NON O O O O O O O O S T A N D A R D S T A C K HEIGHT. 2. PA RTS TO BE PACKAGED IN TAPE & REEL. 3. SHEAR TAILS TO DIMENSION SHOWN. 4. « C » REPRESENTS A CRITICAL DIM. .140 REF 1.260 m .262 .4331 Q 12 POS. X .0 3937| - .0 3 9 3 7

toa8709

Abstract: 72558 CM4016A data sheet TI 2905 Teledyne 1322 transitron H1-201 HA-2600 HA-2605 HA-2720
Contextual Info: PA R T N U M BER M AN UFACTURER Solitron Sprague Teledyne Philbrick Texas Instruments Transitron H A R R IS E Q U IV A L E N T N O TES CM4016A HI-201 C2 ¿UC4000/4001/4002 HA-2600 C2 JUC4000C/4001C/4002C HA-2605 C2 juc4250 HA-2720 A2 juc4250c HA-2725 A2 62

LZ95G

Abstract: LZ95G55 x19d U884 lt428
Contextual Info: SHARP LZ95G55 Single-Chip Driver LSI for CCD DESCRIPTION • T h e L Z9 5G 55 is a C M O S single chip driver LSI Internal electronic shutter : w hich provides tim ing pulses used to drive a Shutter speed is selectable from 1 /6 0 PAL : C C D a re a sensor, and g en era tes synchronous

yx 801

Abstract: yx 801 led yx 801 ic AM2904 SI03L EZ 708 EZ 308 msr 206 pinout basic block diagram of bit slice processors 29203
Contextual Info: Am 2904 X C Status and Shift Control Unit > 3 lv> DISTINCTIVE CHARACTERISTICS <0 R ep laces m ost MSI used aro und any ALU - Including th e Am 2901, Am 2903A, A m 29203 and MSI ALUs. G e n e ra tes C arry-in to th e ALU - Carry signal is selectable from 7 diffe re nt sources.

ca3130 replacement

Abstract: CD4046 equivalent CD4016 equivalent CD4046 OP05 equivalent rca ca3020 lm1488 CA3558 RCA CA3100 CMP-01
Contextual Info: MANUFACTURER Motorola continued National Semiconductor PART NUM BER H A R R IS E Q U IV A L E N T N O TES MC 1545/1445 HA-2400/2405 C3 M C I 554/1454 HA-2630/2635 C3 MC1556/1456 HA-2600/2605 B2 M C I 558/1458 HA-2650/2655 A2 M C 1582L H D -245 C2 M C 1583L

HA2-2055-5

Abstract: rc4558 preamp H12-200 RC1556 MA727 MC1554 ram 2111 signetics 3507J h1200 38 Li-49
Contextual Info: BURN-IN CIRCUITS H A-909 H A-909, H A-2500, H A-2502, H A-2510, HA-2512, H A-2520, H A-2522, H A-2600, H A-2602, HA-2620, H A-2622, H A-2050, H A -2050A , H A-2060, HA-2060A TO-99 H < a "1 3 j— N O TES: T a = + 1 2 5 °C R- = 1 M ego hm C-] = 0 .0 1 jU F , 1 0 0 V

mxj 5 connector

Abstract: saa 1005
Contextual Info: DWG. NO. SD"52808-*20 I 3.7 (3 .7 ) F F F F C W A S S CKT. NO. I SIDE (CHAMFERING TO INDICATE CKT.NO. I) (EVEN C K T .) (□*?5'IIS\1S) DO 1. G M A TER IA L n o v y ? : pps,ul94v-o 9-S^-JU: IN ME T R I C 4 & I5 N O TES : 71— DIMENSIONS sMM V - 0

saa 1005

Abstract: erx 02
Contextual Info: DWG. NO. S D "5 2 8 0 8 -*2 0 I 3.7 ( 3 .7 ) F F F F C W A S S CKT. NO. I SIDE (CHAMFERING TO INDICATE CKT.NO. I) (EVEN C K T .) ( □ * ? 5 ' I S\1S) DO 1. G M A TER IA L n o v y ? : p p s ,u l9 4 v - o 9 -S ^ -JU : IN METRIC 4 & I5 N O TES : 71— DIMENSIONS

sd7501

Contextual Info: 13 12 10 DIM 'C' REF.- DIM 'C - 7.40 DIM JC’ - .291 R E F.- CIRCUIT A1 ID EN TIFIER IN V E R TE D A P PLICA TIO N ÌT I <ppp »310111 NO TES: 1 M ATE R IA LS : HOUSING - LIQUID C R Y S T A L PO LYM ER. U L 9 4 V - 0 W A FE R DIELECTRIC - LIQUID C R Y S T A L POLYM ER, U L 9 4 V - 0

TAB 2568

Abstract: MODJACK PS-45499-002 RNHA pk in 5819
Contextual Info: 1.80 E TD DTD un '.071 DT 3.25 IE PEG DETAIL SCALE 4:1 3.30 2 PLACES .130 PER PORT D N O TES: 1) M A T E R IA L : HOUSING: N Y LO N (PA ), G L A S S F IL L E D , U L 9 4 V - 0 , COLOR: B LA C K T E R M IN A L S : PH O SPHO R BRO N ZE 2) FINISH: T E R M IN A L S :

B331 transistor

Abstract: transistor b331 Transistor B28D A 42 B331 transistor A 92 B331 transistor A 42 B331 transistor B324 KT 117A 851B52 intel 8049 microcomputer
Contextual Info: 1 AP-91 USING THE 8049 AS AN 80 COLUMN PRINTER CONTROLLER I. INTRODUCTION This A pplication N ote d eta ils u sin g I N T E L ’S 8049 m icrocom puter a s a d ot m atrix p rin ter controller. P re v io u s I N T E L A pplication n o tes, e.g. AP-27 and AP-54 d escrib e d usin g in telligen t p ro c e sso rs and p eri­

H12-200

Abstract: MPC16S HI-200-5 Burr Brown 3550K HA2-2065-5 RC1556 HA2-2055 AM715 AM-462-2 H11-506A-5
Contextual Info: BURN-IN CIRCUITS HI-201 H I-2 0 0 TO-100 T a = +125°C R ! = 1 0 K ÌÌ D i D 2 D 3 = IN 4 0 0 2 F re q : = l O O K H z N O TES: T a = +125°C D 1 0 2 = IN 4 0 0 2 F re q : = l O O K H z HI -506/507/506A/507A f A-j = 5 0 K H Z DAS H NOTES: A q = 100KHZ A 2 = 25KHZ