TERADYNE CONNECTOR 72 PIN Search Results

Teradyne connector 72 pin

Contextual Info: H D M /H U M 2 mm Backplane Interconnection System ^ H ig h -d e n s ity 2 m m c o n t a c t sp a c in g : 2 0 c o n ta c ts p er lin e a r c m * S ta n d a r d a n d s h ie ld e d d a u g h te r b o a r d c o n n e c t o r o p t io n s v M o d u la r c o m p o n e n t s for

Contextual Info: HIGH DENSITY PLUS Modular Daughterboard-to-Backplane INTERCONNECTION SYSTEM FEATURES A N D BENEFITS • M o d u la r c o n n e c to rs — s ig n a l, p o w e r , p o la r iz in g a n d g u id a n c e ■ ■ U p t o six ro w s o f c o n ta c ts o n 0 .1 0 0 " g rid

Teradyne connector

Abstract: 85158 press tool 7990 mounting block 890036 pc repair MANUAL 220-13400
Contextual Info: m olex Application Tooling In order to insert a typical row of connectors excluding the Daughtercard modules , it is necessary to select the individual insertion tools and then pick the appropriate tooling holder (See also examples below): 1. Determine the combination of signal modules and power

Contextual Info: FEATURES AND SPECIFICATIONS Features and Benefits • Pins pass through backplane to allow rear side mating of cards or cables ■ Gold contacts at both ends for excellent contact mating ■ Surface Mount Compatible Reference Information Product Specification: PS-73670-9999

liquid crystal polymer dielectric

Contextual Info: FEATURES AND SPECIFICATIONS Features and Benefits • Pins pass through backplane to allow rear side mating of cards or cables ■ Gold contacts at both ends for excellent mating ■ Surface Mount Compatible Reference Information Product Specification: PS-73670-9999

C72500

Contextual Info: FEATURES AND SPECIFICATIONS Backplane Connector Systems Features and Benefits • Similar features as the 73632 unshielded version ■ 6-row 2mm connector provides 25 shielded contacts per linear centimeter over 63 real signals per inch ■ Space-efficient contact shields reduce crosstalk while leveraging the number of usable signal pins

Teradyne connector

Contextual Info: FEATURES AND SPECIFICATIONS Features and Benefits • Pins pass through backplane to allow rear side mating of cards or cables ■ Gold contacts at both ends for excellent contact mating ■ Surface Mount Compatible Backplane Connector Systems Reference Information

Contextual Info: 2.00mm .079" Pitch HDM* Board-to-Board Backplane Header FEATURES AND SPECIFICATIONS • ■ ■ ■ 2 keys) and makes metallic sound when card is in wrong slot Guide pin provides ± 1.9mm of capture prior to plastic mating Can use 1 guide pin in center of connector or on both ends

C72500

Abstract: 48-18
Contextual Info: Backplane Connectors C FEATURES AND SPECIFICATIONS Features and Benefits • High density 2mm metric connector in the same form factor as Futurebus ■ 6-row connector provides 30 contacts per linear centimeter over 75 per inch ■ Designed for high-density/high-speed applications

Contextual Info: Features and Benefits • Similar features as the 73642 header ■ Eye of the needle press fit for high reliability ■ Metal hex key offers 8 coding combinations 64 with ■ ■ ■ ■ 2 keys and makes metallic sound when card is in wrong slot Guide pin provides ± 1.9mm of capture prior to plastic

Contextual Info: Backplane Connectors C FEATURES AND SPECIFICATIONS Features and Benefits • High density 2mm metric connector in the same form factor as Futurebus ■ 6-row connector provides 30 contacts per linear centimeter over 75 per inch ■ Designed for high-density/high-speed applications

teradyne

Abstract: C72500
Contextual Info: Backplane Connectors C FEATURES AND SPECIFICATIONS Features and Benefits • High-density 2.00mm metric connector in the same form factor as Futurebus ■ 6-row 2mm connector provides 30 contacts per linear centimeter over 75 per inch ■ Designed for high-density, high-speed applications

C72500

Abstract: Teradyne connector
Contextual Info: 2.00mm .079" Pitch HDM* Board-to-Board Daughterboard Receptacle FEATURES AND SPECIFICATIONS Features and Benefits • High-density 2.00mm metric connector in the same form factor as Futurebus ■ 6-row 2mm connector provides 30 contacts per linear centimeter (over 75 per inch)

Contextual Info: FEATURES AND SPECIFICATIONS Features and Benefits • Duckpin compliant zone is only 2.5mm long to permit Backplane Connector Systems installation of headers from front and rear of midplanes into the same holes ■ Enables orthogonal packaging North-South on front,

Contextual Info: 2.00mm .079" Pitch HDM* Board-to-Board Stacking Header FEATURES AND SPECIFICATIONS Features and Benefits For parallel board packaging Available in press-fit or solder tail Up to 32mm board-to-board stack heights For Mezzanine cards, parallel backplanes and bridge board

Contextual Info: Features and Benefits • Duckpin compliant zone is only 2.5mm long to permit installation of headers from front and rear of midplanes into the same holes ■ Enables orthogonal packaging North-South on front, East-West on rear ■ Requires midplanes 5mm thick

Teradyne connector 72 pin

Contextual Info: FEATURES AND SPECIFICATIONS Features and Benefits • Duckpin compliant zone is only 2.5mm long to permit Backplane Connector Systems installation of headers from front and rear of midplanes into the same holes ■ Enables orthogonal packaging North-South on front,

Contextual Info: m o le x FEATURES AND SPECIFICATIONS Features and Benefits Electrical HDM* • High-density 2.00mm metric connector in the same form factor as Futurebus Voltage: 1000V Current: 1,0A Board-to-Board ■ 6-row 2mm connector provides 30 contacts per linear centimeter over 75 per inch

Contextual Info: Features and Benefits • Similar features as the 73632 unshielded version ■ 6-row 2mm connector provides 25 shielded contacts per linear centimeter over 63 real signals per inch ■ Space-efficient contact shields reduce crosstalk while lever■ ■ ■

Contextual Info: 2.00mm .079" Pitch HDM* Board-to-Board Stacking Header FEATURES AND SPECIFICATIONS Features and Benefits For parallel board packaging Available in press-fit or solder tail Up to 32mm board-to-board stack heights For Mezzanine cards, parallel backplanes, and bridge

Teradyne connector 72 pin

Abstract: b 939 a c 939 Teradyne connector
Contextual Info: Backplane Connectors FEATURES AND SPECIFICATIONS Features and Benefits • High-density 2mm, 6-row connector provides 30 contacts per linear centimeter over 75 per inch ■ Designed for high-density/high-speed applications ■ HDM header modules can mate interchangeably with

Contextual Info: Backplane Connectors FEATURES AND SPECIFICATIONS Features and Benefits • High-density 2mm, 6-row connector provides 30 contacts per linear centimeter over 75 per inch ■ Designed for high-density/high-speed applications ■ HDM header modules can mate interchangeably with

Contextual Info: FEATURES AND SPECIFICATIONS Features and Benefits For parallel board packaging Available in press-fit or solder tail Up to 32mm board-to-board stack heights Mezzanine card to facilitate blind mate Surface Mount Compatible Electrical Current: 1.0A Contact Resistance:

Contextual Info: FEATURES AND SPECIFICATIONS Features and Benefits • Similar features as the 73642 header ■ Eye of the needle press-fit for high reliability ■ Metal hex key offers 8 coding combinations 64 with ■ ■ ■ Backplane Connector Systems ■ 2 keys and makes metallic sound when card is in