TENSOLITE PRICE Search Results

SKE 1/08

Abstract: MIL-R-5847 Str 5654 str 5717 diode SKE 1/08 85037SSGA 84149ssga MIL-STD-348A SMP tensolite smp flange STR 5706
Contextual Info: RF/Microwave Products Connectors, Cables and Assemblies A Company Introduction Tensolite is your reliable resource for high performance interconnect products. Long appreciated for quality and ser vice, the products in this catalog display the wide range available to choose from for next

NFO-125-1

Abstract: CAN24TST120 EN2267 BMS 13-60 wire M27500- twisted pair NF24-2Q100 EN2714-013 NFO-125-3 NF24Q100-01 NF24P100
Contextual Info: High-Performance Cable Tensolite, A Carlisle Company F or over fifty year s Te nsolite has been providing leading-edge d esigns in w ire and cable . This product guide is intended t o pr ovide a we ll focused pres entation of our product line in regards to your

ic 7483

Abstract: 7483 IC peltola NGT 03 WHU18-1818-072 WHU18-3636-048 7483 IC APPLICATIONS WHU18-1836-036 data sheet ic 7483 7-1114-600-18
Contextual Info: RF Microwave Standard Assemblies RF Microwave Standard Assemblies 146 Q-Flex Series Specifications Q-Flex assemblies are a unique ALTERNATIVE to custom designed flexible coaxial cables.Traditionally custom specified, these cables are now available in various lengths and deliverable in 24

WHU18-3636-36

Abstract: WHU18-1818-36 plug 3.5mm female TS1818 tensolite series N Huber suhner TS1818-24 MCX 90 plug TS7878 price* HUBER SUHNER
Contextual Info: Richardson Electronics GENERAL PURPOSE TEST PART NUMBER WHU18-3636-36 ST-18SMAMSMAM36 WHU18-1818-36 ST-18NMNM36 ST-18QMAMSMAM36 New SUPPLIER MAX FREQ GHz LENGTH CONNECTORS VSWR MAX MAX IL in dB COMMENTS Available in various lengths: 24", 36", 48", 60", 72" triplebooted stock

Contextual Info: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v01.0310 C-10 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-10 Package Outline Drawing

tensolite

Contextual Info: v00.0206 C-1 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-1 Package Outline Drawing NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. SPACER MATERIAL: ALUMINUM 3. PLATING: ELECTROLYTIC GOLD 50 MICROINCHES MIN., OVER ELECTROLYTIC NICKEL 75 MICROINCHES MIN.

Contextual Info: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v00.0206 C-1 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-1 Package Outline Drawing

Contextual Info: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v00.0206 C-2 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-2 Package Outline Drawing

5602-5CCSF

Abstract: tensolite
Contextual Info: v00.0406 C-10 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-10 Package Outline Drawing NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. SPACER MATERIAL: ALUMINUM 3. PLATING: ELECTROLYTIC GOLD 50 MICROINCHES MIN., OVER ELECTROLYTIC NICKEL 75 MICROINCHES MIN.

tensolite

Contextual Info: v00.0206 C-1 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-1 Package Outline Drawing NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. SPACER MATERIAL: ALUMINUM 3. PLATING: ELECTROLYTIC GOLD 50 MICROINCHES MIN., OVER ELECTROLYTIC NICKEL 75 MICROINCHES MIN.

tensolite

Abstract: tensolite* connec
Contextual Info: v00.0206 C-2 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-2 Package Outline Drawing NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. SPACER MATERIAL: ALUMINUM 3. PLATING: ELECTROLYTIC GOLD 50 MICROINCHES MIN., OVER ELECTROLYTIC NICKEL 75 MICROINCHES MIN.

tensolite

Abstract: 231CCSF tensolite price 231CC
Contextual Info: v01.0310 C-10 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-10 Package Outline Drawing Typical Package Weight Package 18.7 gms Spacer 3.3 gms +/- 1 gms Tolerance NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. FINISH: GOLD PLATE OVER NICKEL PLATE

tensolite

Abstract: 5602
Contextual Info: v00.0206 C-3 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-3 Package Outline Drawing NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. SPACER MATERIAL: ALUMINUM 3. PLATING: ELECTROLYTIC GOLD 50 MICROINCHES MIN., OVER ELECTROLYTIC NICKEL 75 MICROINCHES MIN.

tensolite

Abstract: 231CCSF
Contextual Info: v00.0406 C-10 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-10 Package Outline Drawing Typical Package Weight Package 18.7 gms Spacer 3.3 gms +/- 1 gms Tolerance NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. SPACER MATERIAL: ALUMINUM 3. PLATING: ELECTROLYTIC GOLD 50 MICROINCHES MIN., OVER

HMC-C035

Abstract: Mixer Output IP3 41 dBm
Contextual Info: HMC-C035 v01.1106 GaAs MMIC DOUBLE BALANCED MIXER MODULE, 23 - 37 GHz Features Wide IF Bandwidth: DC - 13 GHz Passive: No DC Bias Required Input IP3: +19 dBm LO/RF Isolation: 35 dB Hermetically Sealed Module 5 Typical Applications Field Replaceable Coaxial Connectors

C035

Abstract: double balanced mixer balun HMC-C035
Contextual Info: HMC-C035 v02.1007 CONNECTORIZED MODULES - MIXERS 12 GaAs MMIC DOUBLE BALANCED MIXER MODULE, 23 - 37 GHz Features Wide IF Bandwidth: DC - 13 GHz Passive: No DC Bias Required Input IP3: +19 dBm LO/RF Isolation: 35 dB Hermetically Sealed Module Typical Applications

double balanced mixer balun

Abstract: HMC-C015 tensolite
Contextual Info: HMC-C015 v02.1106 CONNECTORIZED MODULES - MIXERS 12 GaAs MMIC DOUBLE BALANCED MIXER MODULE, 24 - 38 GHz Features Passive: No DC Bias Required Input IP3: +20 dBm LO/RF Isolation: 35 dB Wide IF Bandwidth: DC - 8 GHz Hermetically Sealed Module Typical Applications

Contextual Info: HMC-C015 v02.1106 GaAs MMIC DOUBLE BALANCED MIXER MODULE, 24 - 38 GHz Features Passive: No DC Bias Required Input IP3: +20 dBm LO/RF Isolation: 35 dB Wide IF Bandwidth: DC - 8 GHz Hermetically Sealed Module 5 Typical Applications Field Replaceable Coaxial Connectors

SMA Package

Abstract: tensolite
Contextual Info: v00.0206 C-6 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-6 Package Outline Drawing NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. SPACER MATERIAL: ALUMINUM 3. PLATING: ELECTROLYTIC GOLD 50 MICROINCHES MIN., OVER ELECTROLYTIC NICKEL 75 MICROINCHES MIN.

tensolite

Contextual Info: v01.0310 C-5 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-5 Package Outline Drawing Typical Package Weight Package 17.7 gms Spacer 2.6 gms NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. FINISH: GOLD PLATE OVER NICKEL PLATE 3. MOUNTING SPACER: NICKEL PLATED ALUMINUM

tensolite

Contextual Info: v01.0310 C-11 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-11 Package Outline Drawing Package Information NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. PLATING: GOLD PLATE OVER NICKEL PLATE Package Type C-11 Package Weight [1] 20 gms [2] 4. ALL DIMENSIONS ARE IN INCHES [MILLIMETERS].

double balanced mixer balun

Abstract: HMC-C015
Contextual Info: HMC-C015 v00.0905 MIXERS - CONNECTORIZED MODULES 10 GaAs MMIC DOUBLE BALANCED MIXER MODULE, 24 - 38 GHz Features Passive: No DC Bias Required Input IP3: +20 dBm LO/RF Isolation: 35 dB Wide IF Bandwidth: DC - 8 GHz Hermetically Sealed Module Typical Applications

transistor c014

Abstract: c014 c014 DATASHEET HMC-C014
Contextual Info: HMC-C014 v00.0805 GaAs MMIC FUNDAMENTAL MIXER MODULE, 16 - 32 GHz MIXERS - CONNECTORIZED MODULES 10 Features Passive: No DC Bias Required Input IP3: +19 dBm LO/RF Isolation: 35 dB Wide IF Bandwidth: DC - 8 GHz Hermetically Sealed Module Typical Applications

V00100

Abstract: Mixer Output IP3 41 dBm
Contextual Info: HMC-C035 v00.1006 GaAs MMIC DOUBLE BALANCED MIXER MODULE, 23 - 37 GHz Features Wide IF Bandwidth: DC - 13 GHz Passive: No DC Bias Required Input IP3: +19 dBm LO/RF Isolation: 35 dB Hermetically Sealed Module 5 Typical Applications Field Replaceable Coaxial Connectors