TEMP 8823 Search Results
TEMP 8823 Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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CO-316SMAX200-001 |
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Amphenol CO-316SMAX200-001 RG316 High Temperature Teflon Coaxial Cable - SMA Male to SMA Male 1ft | |||
CO-316SMAX200-003 |
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Amphenol CO-316SMAX200-003 RG316 High Temperature Teflon Coaxial Cable - SMA Male to SMA Male 3ft | |||
CO-316SMAX200-005 |
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Amphenol CO-316SMAX200-005 RG316 High Temperature Teflon Coaxial Cable - SMA Male to SMA Male 5ft | |||
CO-316SMAX200-007.5 |
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Amphenol CO-316SMAX200-007.5 RG316 High Temperature Teflon Coaxial Cable - SMA Male to SMA Male 7.5ft | |||
CO-316SMAX200-004 |
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Amphenol CO-316SMAX200-004 RG316 High Temperature Teflon Coaxial Cable - SMA Male to SMA Male 4ft |
TEMP 8823 Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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D-xxxV
Abstract: GS88237BB-200 GS88237BB-200V GS88237BB-250IV GS88237BB-250V
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GS88237BB/D-xxxV 165-Bump 119-bump D-xxxV GS88237BB-200 GS88237BB-200V GS88237BB-250IV GS88237BB-250V | |
GS88237BB-200V
Abstract: GS88237BB-250IV GS88237BB-250V GS88237BB-200
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GS88237BB/D-xxxV 165-Bump 119-bump GS88237BB-200V GS88237BB-250IV GS88237BB-250V GS88237BB-200 | |
Contextual Info: Preliminary GS88237CB-333/300/250/200 119-Bump BGA Commercial Temp Industrial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive |
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GS88237CB-333/300/250/200 119-Bump x18/x36 88237C 119-BGA | |
Contextual Info: Preliminary GS88237CB-333/300/250/200 119-Bump BGA Commercial Temp Industrial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive |
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GS88237CB-333/300/250/200 119-Bump x18/x36 88237C | |
Contextual Info: Preliminary GS88237CB-333/300/250/200 119-Bump BGA Commercial Temp Industrial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive |
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GS88237CB-333/300/250/200 119-Bump x18/x36 200hich 88237C 119-BGA | |
Contextual Info: Preliminary GS88237BB-333/300/275/250/225/200 119-Bump BGA Commercial Temp Industrial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive |
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GS88237BB-333/300/275/250/225/200 119-Bump x18/x36 GS88237BB-333/300/275/250/225/200 | |
GS88237AB-133
Abstract: GS88237AB-150 GS88237AB-166 GS88237AB-200 GS88237AB-225 GS88237AB-250 GS88237A GS88237AB
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GS88237AB-250/225/200/166/150/133 119-Bump 88219A 88237A GS88237AB-133 GS88237AB-150 GS88237AB-166 GS88237AB-200 GS88237AB-225 GS88237AB-250 GS88237A GS88237AB | |
GS88237BB-200
Abstract: GS88237B GS88237BB GS88237BB-166 GS88237BB-225 GS88237BB-250 GS88237BB-250I
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GS88237BB-333/300/275/250/225/200 119-Bump x18/x36 GS88237BB-200 GS88237B GS88237BB GS88237BB-166 GS88237BB-225 GS88237BB-250 GS88237BB-250I | |
GS88237CContextual Info: GS88237CB-333/300/250/200 119-Bump BGA Commercial Temp Industrial Temp 333 MHz–200 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan |
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GS88237CB-333/300/250/200 119-Bump x18/x36 88237C 119-BGA GS88237C | |
Contextual Info: GS88237CB-333/300/250/200 119-Bump BGA Commercial Temp Industrial Temp 333 MHz–200 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan |
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GS88237CB-333/300/250/200 119-Bump x18/x36 88237C | |
GS88237AB-250
Abstract: GS88237A GS88237AB GS88237AB-133 GS88237AB-150 GS88237AB-166 GS88237AB-200 GS88237AB-225
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GS88237AB-250/225/200/166/150/133 119-Bump GS88237AB 88219A 88237A GS88237AB-250 GS88237A GS88237AB-133 GS88237AB-150 GS88237AB-166 GS88237AB-200 GS88237AB-225 | |
GS88237BB-200
Abstract: GS88237B GS88237BB GS88237BB-250 GS88237BB-300 GS88237BB-333 GS88237BB-333I GS88237BB-250I x327
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GS88237BB-333/300/250/200 119-Bump GS88237BB GS88237BB-200 GS88237B GS88237BB-250 GS88237BB-300 GS88237BB-333 GS88237BB-333I GS88237BB-250I x327 | |
Contextual Info: GS88237CB-333/300/250/200 119-Bump BGA Commercial Temp Industrial Temp Features • • • • • • • • • • • • • 333 MHz–200 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 256K x 36 9Mb SCD/DCD Sync Burst SRAM Single/Dual Cycle Deselect selectable |
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GS88237CB-333/300/250/200 119-Bump x18/x36 119-BGA 88237C | |
Contextual Info: GS88237BB/D-333/300/250/200 119- & 165-Bump BGA Commercial Temp Industrial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features 333 MHz–200 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O SCD and DCD Pipelined Reads The GS88237BB/D is a SCD Single Cycle Deselect and |
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GS88237BB/D-333/300/250/200 165-Bump x18/x36 119-bump | |
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GS88237BB-200
Abstract: GS88237B GS88237BB-250 GS88237BB-300 GS88237BB-333 GS88237BB-333I GS88237BB-250I
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GS88237BB/D-333/300/250/200 165-Bump GS88237BB/D GS88237BB-200 GS88237B GS88237BB-250 GS88237BB-300 GS88237BB-333 GS88237BB-333I GS88237BB-250I | |
Contextual Info: B D _L NOTES: 1. MATERIAL: 1.1 HOUSING: HALOGEN FREE PLASTIC, HIGH TEMP. U L94V-0; COLOR: BLACK 1.2 CONTACT: COPPER ALLOY 1.3 FITTING NAIL: COPPER ALLOY 2. FINISH: 2.1 CONTACT: UNDER PLATING: 5 0 u ”~ 10 0 u ” NICKEL OVERALL. FINISH: SEE ORDER INFORMATION. |
OCR Scan |
L94V-0; 88238-X | |
Contextual Info: GS88237CB-xxx 119-Bump BGA Commercial Temp 333 MHz–200 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive |
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GS88237CB-xxx 119-Bump x18/x36 88237C | |
Contextual Info: D B TERMINAL 8.0±o.i NOTES: 1. MATERIAL 1.1 HOUSING: THERMOPLASTIC, HIGH TEMP., U L 9 4 V -0 ; C0L0R:BLACK. 1.2 CONTACT: COPPER ALLOY 1.3 FITTING NAIL: COPPER ALLOY 2. FINISH: 2.1 CONTACT: N :1 0 0 ~ 2 0 0 u " MATT TIN PLATING 1:1 ~ 3 u * GOLD PLATING 5 0 ~ 1 0 0 u " NICKEL UNDERPLATING OVERALL |
OCR Scan |
APP96007JIIâ ECN-0709056) 020XX | |
9813
Abstract: ic 8275 ic 9661 UPD789012 IC 8823 58828
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OCR Scan |
uPD789B12 UPD789812 9813 ic 8275 ic 9661 UPD789012 IC 8823 58828 | |
Contextual Info: GS88237CB-xxx 119-Bump BGA Commercial Temp 333 MHz–200 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive |
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GS88237CB-xxx 119-Bump x18/x36 88237C | |
bcm 4330
Abstract: telemecanique contactor catalogue A5 GNC mosfet philips ecg master replacement guide Elektronikon II keltron electrolytic capacitors PART NO SELEMA DRIVER MOTOR AC 12v dc EIM Basic MK3 lenze 8600 Atlas copco rc universal 60 min
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MT8880AC
Abstract: MT8870CE MT8880CE MT8870C JEDEC-22BA102 cd200 mt8870 example code 87Q4 MT8870C-1 MT88L70
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MT88870CS MT9126AS MT8880AC MT8870CE MT8880CE MT8870C JEDEC-22BA102 cd200 mt8870 example code 87Q4 MT8870C-1 MT88L70 | |
MIL-STD-461BContextual Info: interpoint Mflb3a7S 10301 Willows Road 000DS70 Sût. • IGC FMC-461 EMI FILTER MODULE P.O. Box 9 7 0 0 5 Redmond. WA 9 8 0 7 3 -9 7 0 5 TEL: 206 882-3100 TEL: (800) 8 2 2 -8 7 8 2 FAX: (206) 882-1990 • Less than 2.4 sq. in. of board area • -5 5 °C to + 125°C operation |
OCR Scan |
FMC-461 MIL-STD-461B MIL-STD-704D | |
940-100
Abstract: interpoint FMC 150 MIL-STD 461 B
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OCR Scan |
FMC-461 MIL-STD-461B MIL-STD-704D FMC-461â 9401001HXC FMC-461/883 9401001HZC F/883 940-100 interpoint FMC 150 MIL-STD 461 B |