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    TEA 1102 N1 Search Results

    TEA 1102 N1 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    77311-102T17LF
    Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch. PDF
    10127721-102GLF
    Amphenol Communications Solutions Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 10 Position, 3.2mm Kink Tail (Gold Flash) plating, GW Compatible LCP, Black Color,Tray Packing. PDF
    G832MB110205024HR
    Amphenol Communications Solutions Pitch 0.8mm, Height 7.7 mm, 20 Positions, Dual Row, BTB Vertical Plug SMT, G/F Black PDF
    70299-1102LF
    Amphenol Communications Solutions Metral® Board Connectors, Backplane Connectors, Signal Header, Vertical, Press Fit, 4 Rows, 96 Positions. PDF
    20021111-02016T1LF
    Amphenol Communications Solutions Minitek127®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 16 Positions, 1.27mm (0.050in) pitch. PDF

    TEA 1102 N1 Datasheets (2)

    Philips Semiconductors
    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    TEA1102/N1
    Philips Semiconductors Fast charge ICs for NiCd, NiMH, SLA and LiIon Original PDF 313.93KB 28
    TEA1102_N1
    Philips Semiconductors Fast charge ICs for NiCd, NiMH, SLA and LiIon Original PDF 313.93KB 28