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    TDPF-1950L-19 Search Results

    TDPF-1950L-19 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54122-112261950LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 26 position, 2.54mm (0.100in) pitch PDF
    54122-810061950LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 6 position, 2.54mm (0.100in) pitch PDF
    54121-112081950LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch. PDF
    54122-110201950LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch PDF
    54112-810261950LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch. PDF

    TDPF-1950L-19 Datasheets (1)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    TDPF-1950L-19
    		TOKO CERAMIC DUPLEXER FOR W-CDMA Original PDF 131.84KB 2