TAZ SERIES Search Results

D5072

Abstract: CWR09 CWR11
Contextual Info: TAZ, CWR09, CWR11 Series Tape and Reel Packaging Solid Tantalum Chip TAZ Tape and reel packaging for automatic component placement. Please enter required Suffix on order. Bulk packaging is standard. TAZ TAPING SUFFIX TABLE Case Size reference Tape width mm

CWR11

Abstract: CWR09
Contextual Info: TAZ, CWR09, CWR11 Series Tape and Reel Packaging Solid Tantalum Chip TAZ Tape and reel packaging for automatic component placement. Please enter required Suffix on order. Bulk packaging is standard. TAZ TAPING SUFFIX TABLE Case Size reference Tape width mm

TBJ series

Abstract: CWR29 SRC9000 CWR19 AVX TAZ cwr29 capacitor CWR06 CERAMIC CHIP resistor cwr06 capacitor CWR09
Contextual Info: AVX Tantalum Division Biddeford Surface Mount Military/Aerospace Products HIGH RELIABILITY TANTALUM CHIP PRODUCT FAMILY - DESIGN GUIDE TAZ Series Case Size R A B C D E F TAZ FAMILY SIZES: CWR09, CWR19, CWR29 and TCP Modules The TAZ family boasts the widest range of case sizes and

AVX taa

Abstract: 3528 footprint TBJ series MIL-PRF-55365 NASA SP-R-0022A 55365/8 cwr capacitor MIL-PRF-55365/8 AVX TAZ NASA
Contextual Info: A KYOCERA GROUP COMPANY AVX Surface Mount Tantalum Military/Aerospace Products Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 TAZ Series CWR09 and COTS-Plus . . . . . . . . . . . . . . . CWR09 - MIL-PRF-55365/4 and TAZ COTS-Plus

LI-CAM-IMX136-1.8

Abstract: LM3670MFX-0.8
Contextual Info: TAZ Series COTS-Plus The TAZ part has fully molded, compliant leadframe construction designed for use in applications utilizing solder Reflow, Wave or Vapor Phase , conductive adhesive or thermal compression bonding techniques. Each chip is marked with polarity,

CWR06

Abstract: CWR09 CWR11 MIL-PRF-55365
Contextual Info: A KYOCERA GROUP COMPANY AVX Surface Mount Tantalum Military/Aerospace Products Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 TAZ Series CWR09 and COTS-Plus . . . . . . . . . . . . . . . CWR09 - MIL-PRF-55365/4 and TAZ COTS-Plus

AVX TAZ

Abstract: 004C CWR06 CWR09 CWR11 MIL-PRF-55365 TAZH107 TAZB225
Contextual Info: TAZ Series Including CWR09 and COTS-Plus The TAZ part has fully molded, compliant leadframe construction designed for use in applications utilizing solder Reflow, Wave or Vapor Phase , conductive adhesive or thermal compression bonding techniques. Each chip is marked with polarity,

TAZB335

Abstract: TAZC106
Contextual Info: TAZ Series COTS-Plus The TAZ part has fully molded, compliant leadframe construction designed for use in applications utilizing solder Reflow, Wave or Vapor Phase , conductive adhesive or thermal compression bonding techniques. Each chip is marked with polarity,

Contextual Info: TAZ Series COTS-Plus The TAZ part has fully molded, compliant leadframe construction designed for use in applications utilizing solder Reflow, Wave or Vapor Phase , conductive adhesive or thermal compression bonding techniques. Each chip is marked with polarity,

CWR19

Contextual Info: TAZ Series Including CWR09, CWR19, CWR29 and COTS-Plus The TAZ part has fully molded, compliant leadframe construction designed for use in applications utilizing solder Reflow, Wave or Vapor Phase , conductive adhesive or thermal compression bonding techniques. Each

CWR19

Contextual Info: TAZ Series Including CWR09, CWR19, CWR29 and COTS-Plus The TAZ part has fully molded, compliant leadframe construction designed for use in applications utilizing solder Reflow, Wave or Vapor Phase , conductive adhesive or thermal compression bonding techniques. Each

CWR19

Contextual Info: TAZ Series Including CWR09, CWR19, CWR29 and COTS-Plus The TAZ part has fully molded, compliant leadframe construction designed for use in applications utilizing solder Reflow, Wave or Vapor Phase , conductive adhesive or thermal compression bonding techniques. Each

LI-CAM-IMX136-1.8

Abstract: LM3670MFX-0.8
Contextual Info: TAZ Series COTS-Plus The TAZ part has fully molded, compliant leadframe construction designed for use in applications utilizing solder Reflow, Wave or Vapor Phase , conductive adhesive or thermal compression bonding techniques. Each chip is marked with polarity,

CWR19

Contextual Info: TAZ Series Including CWR09, CWR19, CWR29 and COTS-Plus The TAZ part has fully molded, compliant leadframe construction designed for use in applications utilizing solder Reflow, Wave or Vapor Phase , conductive adhesive or thermal compression bonding techniques. Each

LI-CAM-IMX136-1.8

Abstract: LM3670MFX-0.8
Contextual Info: TAZ Series COTS-Plus The TAZ part has fully molded, compliant leadframe construction designed for use in applications utilizing solder Reflow, Wave or Vapor Phase , conductive adhesive or thermal compression bonding techniques. Each chip is marked with polarity,

Contextual Info: TAZ Series CWR09 - MIL-PRF-55365/4 Established Reliability, COTS-Plus & Space Level This is the original high reliability molded tantalum chip series and the case sizes still represent the most flexible of surface mount form factors. TAZ offers nine case sizes,

Contextual Info: TAZ Series CWR09 - MIL-PRF-55365/4 Established Reliability, COTS-Plus & Space Level This is the original high reliability molded tantalum chip series and the case sizes still represent the most flexible of surface mount form factors. TAZ offers nine case sizes,

AVX TAZ

Abstract: 004C CWR06 CWR09 MIL-C-55365 TAZ Series SOT-23 marking 020X
Contextual Info: TAZ Series The TAZ molded surface mount series is designed for use in applications utilizing either solder, conductive adhesive or thermal compression bonding techniques. Case sizes A through H are compatible with CWR06 pad layouts and are qualified as the CWR09 style.

CWR29

Abstract: CWR19H CWR19 TAZC685 Tantalum 106-h Military/CWR29 LM3670MFX-0.8 CWR06 CWR09 CWR11
Contextual Info: TAZ Series Including CWR09, CWR19, CWR29 and COTS-Plus The TAZ part has fully molded, compliant leadframe construction designed for use in applications utilizing solder Reflow, Wave or Vapor Phase , conductive adhesive or thermal compression bonding techniques. Each

CWR19

Contextual Info: TAZ Series Including CWR09, CWR19, CWR29 and COTS-Plus The TAZ part has fully molded, compliant leadframe construction designed for use in applications utilizing solder Reflow, Wave or Vapor Phase , conductive adhesive or thermal compression bonding techniques. Each

Contextual Info: Data sheet E 1/7.192 TAZ VISHAY toroidal transformers -10499 NFC 52200 A1TWOHIC TAZ toroidal transformers are designed for 50 / 60 Hz power supplies used for electronic, circuitry. Performance and geometry of magnetic core give an excellent efficiency and very low radiation.

TAZD685

Abstract: TAZG686 CWR19K-156 TAZG226 SB 0200-A TAZA474
Contextual Info: TAZ Series Including CWR09 and COTS-Plus The TAZ part has fully molded, compliant leadframe construction designed for use in applications utilizing solder Reflow, Wave or Vapor Phase , conductive adhesive or thermal compression bonding techniques. Each chip is marked with polarity, capacitance code and rated voltage.

d5072

Abstract: CWR11 CWR06 CWR09 MIL-PRF-55365 47SB
Contextual Info: TAZ Series Including CWR09 and COTS-Plus The TAZ part has fully molded, compliant leadframe construction designed for use in applications utilizing solder Reflow, Wave or Vapor Phase , conductive adhesive or thermal compression bonding techniques. Each chip is marked with polarity, capacitance code and rated voltage.

004C

Abstract: CWR06 CWR09 CWR11 MIL-PRF-55365
Contextual Info: TAZ Series Including CWR09 and COTS-Plus The TAZ part has fully molded, compliant leadframe construction designed for use in applications utilizing solder Reflow, Wave or Vapor Phase , conductive adhesive or thermal compression bonding techniques. Each chip is marked with polarity, capacitance code and rated voltage.