TAPING OF DIODES Search Results

Contextual Info: Standard Taping Specifications 1. Features of Standard Taping Specifications H itach i silico n diode taping sp ecificatio n s are classified into three major categories according to the types o f automatic mounting machines of set manufacturers. 1 Horizontal type taping

Contextual Info: General-purpose Diodes - Taping Specifications Taping Specifications Taping Name 1.35 ±0.4 1.1±0.2 1.5 ±0.2 +0.4 2.0 ±0.5 5.5 13 ±0.5 1,800 pcs. 4.0 ±0.1 Pull out direction 2.0 per reel 21±0.8 R1.0 2.6 5.1–0.1 Marking of Part No., Lot No., quantity, etc.

Contextual Info: SANYO Taping S p e c i f i c a t i o n of Diodes CD Axial taping w Taping Suffix Pack ing 26 BT Box for zigzag bended type 52 ATI Box for zigzag bended type 5, OOOPcs/box 3 , OOOPcs/box) GMA01-BT DSF10TB-AT1 CP type taping o o o TB TA TA T w o - o u t e r - 1eads on the hole side

melf smd dimensions

Abstract: BFQ67-GS08
Contextual Info: VISHAY Vishay Semiconductors Tape and Reel Standards Taping of RF Transistors and Diodes Taping of SMT Devices Vishay’s Transistors in SMD packages are available in an antistatic 8 mm blister tape in accordance with DIN IEC 268–3 for automatic component insertion.

Taping of Diodes

Abstract: taping
Contextual Info: Taping of Diodes www.vishay.com Vishay Semiconductors Taping of Diodes AXIAL LEAD COMPONENTS Diodes and rectifiers with axial leads are normally delivered in taped form according to IEC 286-1 see figure 1 . The cathode side is designated by a colored tape. Taped

marking code w2 sot323

Abstract: marking code vishay label marking code w2 sot23 MARKING W2 SOT23 SOD80 marking DO214AC DO219AB DO35
Contextual Info: Taping of Diodes 2 Vishay Semiconductors Taping of Diodes 2 AXIAL LEAD COMPONENTS Diodes and rectifiers with axial leads are normally delivered in taped form according to IEC 286-1 see figure 1 . The cathode side is designated by a colored tape. Taped devices

marking code w2 sot23

Abstract: MARKING W2 SOT23 SOD80 marking SOD64 DO214AC DO219AB DO35 DO41 W2 SOT23
Contextual Info: Taping of Diodes 1 Vishay Semiconductors Taping of Diodes 1 AXIAL LEAD COMPONENTS Diodes and rectifiers with axial leads are normally delivered in taped form according to IEC 286-1 see figure 1 . The cathode side is designated by a colored tape. Taped devices

Contextual Info: SAfiYO Taping S p e c i f i c a t i o n CD Axial of Diodes taping Taping S u f f i x 1? 26mm BT 52mm ATI Pack i ng Box f o r z i g z a g bended type Box f o r bended type zigzag BT or AT 1 : 3 , O O O p c s / 5 , 0 0 0 p c s / b o x . CD CP t y pe taping o

RF smd code SOT143 Package

Contextual Info: Vishay Telefunken Tape and Reel Standards Taping of RF Transistors and Diodes Taping of SMT Devices Vishay’s Transistors in SMD packages are available in an antistatic 8 mm blister tape in accordance with DIN IEC 268–3 for automatic component insertion. The blister tape is a plastic strip with impressed component

4001 smd

Abstract: BFQ67-GS08 diodes 4001
Contextual Info: Vishay Semiconductors Tape and Reel Standards Taping of RF Transistors and Diodes Taping of SMT Devices Vishay’s Transistors in SMD packages are available in an antistatic 8 mm blister tape in accordance with DIN IEC 268–3 for automatic component insertion. The blister tape is a plastic strip with impressed component

Contextual Info: TAPING STYLE OF K & T-PACK TYPE DIODES DIMENSIONS OF TAPING K-PACK STYLE Symbol Dimensions 6.8 ±0.1 B 10.1 ±0.1 Ko 2.8 ±0.1 P1 8.0 ±0.1 + Do + 1.5 ±0.1 Po 4.0 ± 0.1 E 1.75 ±0.1 P2 2.0 ±0.1 F 7.5 ±0.1 W1 13.3 ±0.1 W 16.0 ±0.3 T 0.2 ±0.05 K1 3.0 ±0.1

Contextual Info: TAPING STYLE OF SC TYPE DIODES Symbol 2 . 6 5+0.1 A2 1.8 +0.l Bl 5.6 ±0.l B2 3.15±0.l K o 2.7 +0.1 PI 4.0 +0.1 > D o DIMENSIONS OP TAPING Dimensions and Angle A1 <§ Po *1.5 ± 1 - 1 P 0 4.0 ±0.1 E 1.75+0.1 P2 2.0 ±0.05 F 5.5 ±0.05 W1 9.5 ± ; - 3 W

SMD Dioden

Abstract: sod-80 SMD MELF SMD melf smd dimensions diode melf smd smd-diodes 14 do-214aa DO-214AA package DIL-16 DO-214AA diode
Contextual Info:  Packaging – Verpackungsvorschriften Taping of axial devices Gurtung axialer Bauelemente Most of Diotec’s diodes and rectifiers are supplied taped with marked polarity facing the same direction. For device dimensions refer to the relevant data sheet.

Contextual Info: URFACE-MOUNT DEVICES ECTIFIER DIODES POWER TRANSISTORS OWER MOSFET IDAC SURGE ABSORBERS POWER ICs OUTLINE DIMENSIONS BASIC ORDERING QUANTITIES AND PACKING FORM Code No. Taping STANDARD FORMING LIST OF DISCONTINUED PARTS

MA2S376

Contextual Info: Variable Capacitance Diodes MA2S376 Silicon epitaxial planar type Unit : mm For VCO of a UHF radio 0.15 min. + 0.05 • Small series resistance rD • SS-mini type package, allowing downsizing of equipment and automatic insertion through the taping package

SC-76A

Abstract: 76A marking MA2Z377 MA377 SC76A
Contextual Info: Variable Capacitance Diodes MA2Z377 MA377 Silicon epitaxial planar type Unit: mm 0.30+0.10 –0.05 For VCO of UHF band radio 5˚ • S-Mini type package, allowing downsizing of equipment and automatic insertion through the taping package (0.4) 1.7±0.10

MA2Z377

Abstract: MA377 220VR
Contextual Info: Variable Capacitance Diodes MA2Z377 MA377 Silicon epitaxial planar type Unit: mm 0.30+0.10 –0.05 For VCO of UHF band radio 5˚ • S-Mini type package, allowing downsizing of equipment and automatic insertion through the taping package (0.4) 1.7±0.10

list zener

Contextual Info: Contents Page List of Types 4 Alphanumerical List of Types 5 Technical Information 7 Packaging & Taping 22 Small Signal Diodes 27 Tuner Diodes 81 Schottky Diodes 102 Dual Zener Diodes 139 Zener Diodes 144 Voltage Stabilizers 223 Addresses 235 3

MA2S376

Contextual Info: Variable Capacitance Diodes MA2S376 Silicon epitaxial planar type Unit : mm For VCO of a UHF radio 0.15 min. + 0.05 • Small series resistance rD • SS-mini type package, allowing downsizing of equipment and automatic insertion through the taping package

Contextual Info: SURFACE-MOUNT DEVICES RECTIFIER DIODES "W E R TRANSISTORS OWER MOSFET SIDAC SURGE ABSORBERS OWER ICs 'UTLINE DIMENSIONS BASIC ORDERING QUANTITIES AND PACKING FORM Code No. Taping STANDARD FORMING LIST OF DISCONTINUED PARTS

cd 4074 B

Abstract: MA2Z365 MA365
Contextual Info: Variable Capacitance Diodes MA2Z365 MA365 Silicon epitaxial planar type Unit : mm INDICATES CATHODE 2 + 0.1 1 • The largest capacitance ratio of 14 (CD(2V) / CD(25V) • S-mini type package, allowing downsizing of equipment and automatic insertion through the taping package

SC76A

Abstract: MA2Z376 MA376 SC-76A
Contextual Info: Variable Capacitance Diodes MA2Z376 MA376 Silicon epitaxial planar type Unit: mm 0.30+0.10 –0.05 For VCO of UHF band radio 5˚ • Small series resistance rD • S-Mini type package, allowing downsizing of equipment and automatic insertion through the taping package

Contextual Info: MA111 Band Switching Diodes MA80WA, MA80WK Silicon epitaxial planer type Unit : mm For band switching 2.1±0.1 voltage dependence of diode capacity CD ● S-Mini package, with two elements incorporated enabling down-siz- ing of the equipment and automatic insertion through taping

MA2Z376

Abstract: MA376
Contextual Info: Variable Capacitance Diodes MA2Z376 MA376 Silicon epitaxial planar type Unit: mm 0.30+0.10 –0.05 For VCO of UHF band radio 5˚ • Small series resistance rD • S-Mini type package, allowing downsizing of equipment and automatic insertion through the taping package