TABLE PTH LEAD Search Results

Contextual Info: 8 PEFORMANCE-BASED PLATING SEE NOTE 2 LETTER TARGET LEAD-FREE DESIGNATION O NL Y WITH A P P L I C A B L E PL A TIN G CODES 4-COLUMN DIFFERENTIAL S IGNAL LETTER DESIGNATION REPRESENTED DASH CO NO C TELCORDIA UE NO D TELCORDIA CO YES E TELCORDIA UE YES LEFT

Contextual Info: 8 PERFORMANCE-BASED PLATING SEE NOTE 2 LETTER TARGET LEAD-FREE DESIGNATION O N L Y WI TH A P P L I C A B L E PL ATI NG CODES 8-COLUMN DIFFERENTIAL S IGNAL APPLICATION LEAD-FREE B TELCORDIA CO NO C TELCORDIA UE NO D TELCORDIA CO YES E TELCORDIA UE YES CONTACT

Contextual Info: 8 PEFORMANCE-BASED PLATING SEE NOTE 2 LETTER TARGET LEAD-FREE DESIGNATION O NL Y WITH A P P L I C A B L E PL A TIN G CODES 6-COLUMN DIFFERENTIAL S IGNAL APPLICATION LEAD B TELCORDIA CO NO C TELCORDIA UE NO D TELCORDIA CO YES E TELCORDIA UE YES CONTACT MATING

Contextual Info: 7 8 THIS DRAWING IS UNPUBLISHED. C COPYRIGHT 20 RELEASED FOR PUBLICATION 6 5 4 3 2 1 20 REVISIONS ALL RIGHTS RESERVED. - P LTR C 20.3 FINISH: 30µ" MIN GOLD IN CONTACT AREA. SELECTIVE TIN ON PCB TAILS, NICKEL OVERALL. 3 FINISH: 30µ" MIN GOLD IN CONTACT AREA. SELECTIVE TIN-LEAD

AN 8054

Abstract: table pth lead TS-0254
Contextual Info: 3M 4-Wall, Tripolarized Header .050" x .100" Latch/Ejector, PTH & SMT Straight, PTH Right Angle 810 Series • Tripolarized for robust alignment when mating to 820 series socket • 50 mil × 100 mil halves the connector length vs. traditional 100 mil x 100 mil products

Contextual Info: REVISION A DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] SSMB-J-P-XX-RA-THX GENDER -J: JACK DO NOT SCALE FROM THIS PRINT LEAD STYLE -1: .093" BOARD -2: .062" BOARD -3: .039" BOARD SEE TABLE 1 TYPE -P: PCB TERMINATION -TH: THROUGH HOLE 3.92 .154 REF ORIENTATION

Contextual Info: REVISION A Pb THIS PRODUCT MANUFACTURED WITH LEAD-FREE PROCESSING GRF7X-J-P-XX-ST-TH1 DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] SERIES GRF7: GRF 75 OHM GRF7V: GRF 75 OHM HIGH VIBRATION SEE TABLE 2 DO NOT SCALE FROM THIS PRINT TERMINATION -TH1: THROUGH HOLE

Contextual Info: REVISION B Pb THIS PRODUCT MANUFACTURED WITH LEAD-FREE PROCESSING MMCX7-J-P-XX-RA-THX DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] DO NOT SCALE FROM THIS PRINT GENDER -J: JACK TERMINATION -TH: THROUGH HOLE TYPE -P: PCB C +0.09 1.51 - 0.11 ORIENTATION -RA: RIGHT ANGLE

AN 8054

Abstract: standard profile header right angle posts single
Contextual Info: 3M 4-Wall, Tripolarized Header .050" x .100" Latch/Ejector, PTH & SMT Straight, PTH Right Angle 810 Series • Tripolarized for robust alignment when mating to 820 series socket • 50 mil × 100 mil halves the connector length vs. traditional 100 mil x 100 mil products

AN 8054

Contextual Info: 3M 4-Wall, Tripolarized Header .050" x .100" Latch/Ejector, PTH & SMT Straight, PTH Right Angle 810 Series • Tripolarized for robust alignment when mating to 820 series socket • 50 mil × 100 mil halves the connector length vs. traditional 100 mil x 100 mil products

AN 8054

Abstract: TS-0253-J
Contextual Info: 3M 4-Wall, Tripolarized Header .050" x .100" Latch/Ejector, PTH & SMT Straight, PTH Right Angle 810 Series • Tripolarized for robust alignment when mating to 820 series socket • 50 mil × 100 mil halves the connector length vs. traditional 100 mil x 100 mil products

Contextual Info: DRW NO. ± C-367-5G00-000 ZONE REV SCR NUMBER ALL A CSAS-9E4MBM.VER01 BACKPLANE RIGHT POLARIZED ASSEMBLY PART NUMBER ASSIGNMENT 367 - X X 0 X SH DESCRIPTION BY NEW RELEASE HCL-AK REV A 1 DATE 12/06/2013 APPROVED D. SMITH X X X L LOAD 5 STANDARD LOADED, LEADFREE

AN 8054

Contextual Info: 3M 4-Wall, Tripolarized Header .050″ x .100″ Latch/Ejector, PTH & SMT Straight, PTH Right Angle 810 Series • Tripolarization to mating socket • 50 mil × 100 mil halves the connector length • Latch and eject for rugged high performance applications

Contextual Info: 3M 4-Wall, Tripolarized Header .050″ x .100″ Latch/Ejector, PTH & SMT Straight, PTH Right Angle 810 Series • Tripolarization to mating socket • 50 mil × 100 mil halves the connector length • Latch and eject for rugged high performance applications

3505-28

Contextual Info: 3M 4-Wall, Tripolarized Header .050" x .100" Latch/Ejector, PTH & SMT Straight, PTH Right Angle 810 Series • Tripolarization to mating socket • 50 mil × 100 mil halves the connector length • Latch and eject for rugged high performance applications

IT 7831

Abstract: JESD97 2609 al 3505-28B
Contextual Info: 3M 4-Wall, Tripolarized Header .050″ x .100″ Latch/Ejector, PTH & SMT Straight, PTH Right Angle 810 Series • Tripolarization to mating socket • 50 mil × 100 mil halves the connector length • Latch and eject for rugged high performance applications

AN 8054

Contextual Info: 3M 4-Wall, Tripolarized Header .050″ x .100″ Latch/Ejector, PTH & SMT Straight, PTH Right Angle 810 Series • Tripolarization to mating socket • 50 mil × 100 mil halves the connector length • Latch and eject for rugged high performance applications

Contextual Info: REVISION D Pb THIS PRODUCT MANUFACTURED WITH LEAD-FREE PROCESSING DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] MMCX7-J-P-XX-ST-TH1 TERMINATION -TH1: THROUGH HOLE DO NOT SCALE FROM THIS PRINT ORIENTATION -ST: STRAIGHT GENDER -J: JACK -B- 3.50 .138 REF TYP

Contextual Info: REVISION A Pb THIS PRODUCT MANUFACTURED WITH LEAD-FREE PROCESSING MMCXV-J-P-XX-ST-TH1 DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] TERMINATION -TH1: THROUGH HOLE SERIES -V: HIGH VIBRATION 50 OHM DO NOT SCALE FROM THIS PRINT ORIENTATION -ST: STRAIGHT GENDER

Contextual Info: 13 10 12 M ATERIAL NUMBER tt OF COLUMNS n OF DIFF PAIR DIM ’’A" MAX DIM “B“ 7 6060- *0 10 50 26.60 17.10 76060 PTH 0 7 6060- *2 12 60 30.40 20.90 0.46 7 6060- *4 14 70 34.20 24.70 ±0.05 7 6060- *6 16 80 38.00 28.50 7 6060- *0 10 50 26.60

QFN 76 9x9 footprint

Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
Contextual Info: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance

FOOTPRINT MO-229 2X3 SOLDERING

Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
Contextual Info: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level

BD 4914

Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
Contextual Info: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.

C-439-3200-500

Contextual Info: 3 X DRW NO. ▼ ZONE TABLE 1 GbX S T A N D A R D REVISION OF ALL PART NUMBERS IS BACKPLANE POW ER CONNECTOR GbX POW ER MODULE LEAD OFF • JT SEE D E T A I L 3 = 8 = 1P O SITIO N 2 = 2 P O SITIO N 5 = 7 = 3 P O SITIO N B P . 5 0 u ' GOLD. 1 P O SITIO N B P .