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TLP2719
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Toshiba Electronic Devices & Storage Corporation
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Photocoupler (photo-IC output), High-speed / IPM driver, 1 Mbps, 5000 Vrms, SO6L |
Datasheet
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77311-827-19LF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch. |
PDF
|
|
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86094327194758E1LF
|
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Amphenol Communications Solutions
|
Din Headers and Receptacles, Backplane connectors, Right Angle Header Press-Fit Style C 32 ways, Class II |
PDF
|
|
|
77311-127-19LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch. |
PDF
|
|
|
77311-127-19
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch. |
PDF
|
|
