|
68604-215HLF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 15 Positions, 2.54 mm (0.100in) Pitch. |
PDF
|
|
|
68004-215HLF
|
|
Amphenol Communications Solutions
|
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 15 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail. |
PDF
|
|
|
54122-110042150LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 4 position, 2.54mm (0.100in) pitch |
PDF
|
|
|
FX018
|
|
Texas Instruments
|
2-Phase DCAP+ Step-Down Controller for VR12.6 CPU 32-VQFN -40 to 105 |
|
|
