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T1610P Datasheets (1)

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Vishay Semiconductor Opto Division

Part	ECAD Model	Manufacturer	Description	Datasheet Type	PDF	PDF Size	Page count
T1610P-SD-F		Vishay Semiconductor Opto Division	Sensors, Transducers - Optical Sensors - Photodiodes - PHOTODIODE PIN CHIP 560NM CHIP	Original	PDF	75.87KB

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Amphenol Corporation GCB3106T1610PNBF1 PLUG CRIMP 3 CONTACTS - Bulk (Alt: GCB3106T1610PNBF1)
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Avnet Americas	GCB3106T1610PNBF1	Bulk		24 Weeks	25	1 - 10 - 100 - 1000 - 10000 -	Get Quote
Amphenol Corporation GCB3100T1610PNBT2F8 RECEPTACLE, CRIMP, 3 CONTACTS - Bulk (Alt: GCB3100T1610PNBT2F8)
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Avnet Americas	GCB3100T1610PNBT2F8	Bulk		24 Weeks	25	1 - 10 - 100 - 1000 - 10000 -	Get Quote
ITT Interconnect Solutions CAA&BINSERT1610P - Bulk (Alt: CAA&BINSERT1610P)
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Avnet Americas	CAA&BINSERT1610P	Bulk		18 Weeks	110	1 - 10 - 100 - 1000 $7.97 10000 $7.93	Buy Now
RS	CAA&BINSERT1610P	Bulk		18 Weeks	110	1 - 10 - 100 - 1000 $9.12 10000 $9.12	Get Quote
Master Electronics	CAA&BINSERT1610P					1 - 10 - 100 $8.25 1000 $8.09 10000 $8.09	Buy Now
TE Connectivity 901-20 CT 1-61-0 PN-T - Bag (Alt: ZPF000000000004627)
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Avnet Americas	901-20 CT 1-61-0 PN-T	Bag			200	1 - 10 - 100 - 1000 $3460.02 10000 $3424.72	Buy Now
Interstate Connecting Components	901-20 CT 1-61-0 PN-T					1 - 10 - 100 - 1000 - 10000 -	Buy Now
Amphenol Corporation GCB3100T1610PNBC1T2 RECEPTACLE CRIMP 3 CONTACTS - Bulk (Alt: GCB3100T1610PNBC1T2)
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Avnet Americas	GCB3100T1610PNBC1T2	Bulk		24 Weeks	25	1 - 10 - 100 - 1000 - 10000 -	Get Quote
Mouser Electronics	GCB3100T1610PNBC1T2					1 - 10 - 100 $78.84 1000 $78.84 10000 $78.84	Get Quote

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T1610P Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
Contextual Info: T1610P Vishay Semiconductors Silicon PIN Photodiode FEATURES • Package type: chip • Package form: single chip • Dimensions L x W x H in mm : 2.97 x 2.97 x 0.28 • Wafer diameter (in mm): 100 • Radiant sensitive area (in mm2): 7.7 • High photo sensitivity	Original	T1610P T1610P 2002/95/EC 2002/96/EC 2011/65/EU 2002/95/EC. 2011/65/EU. 12-Mar-12	PDF
Contextual Info: T1610P www.vishay.com Vishay Semiconductors Silicon PIN Photodiode FEATURES • Package type: chip A • Package form: single chip • Dimensions L x W x H in mm : 2.97 x 2.97 x 0.28 • Wafer diameter (in mm): 100 • Radiant sensitive area (in mm2): 7.7	Original	T1610P T1610P 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12	PDF
FVOV6870 Abstract: MIL-HDBK-263 Contextual Info: T1610P Vishay Semiconductors Silicon PIN Photodiode FEATURES • Package type: chip • Package form: single chip • Dimensions L x W x H in mm : 2.97 x 2.97 x 0.28 • Wafer diameter (in mm): 100 • Radiant sensitive area (in mm2): 7.7 • High photo sensitivity	Original	T1610P T1610P 2002/95/EC 2002/96/EC 11-Mar-11 FVOV6870 MIL-HDBK-263	PDF
Contextual Info: T1610P Vishay Semiconductors Silicon PIN Photodiode FEATURES • Package type: chip • Package form: single chip • Dimensions L x W x H in mm : 2.97 x 2.97 x 0.28 • Wafer diameter (in mm): 100 • Radiant sensitive area (in mm2): 7.7 • High photo sensitivity	Original	T1610P T1610P 2002/95/EC 18-Jul-08	PDF
FVOV6870 Abstract: MIL-HDBK-263 PIN photodiode chip photodiode die WAFER Contextual Info: T1610P Vishay Semiconductors Silicon PIN Photodiode FEATURES • Package type: chip • Package form: single chip • Dimensions L x W x H in mm : 2.97 x 2.97 x 0.28 • Wafer diameter (in mm): 100 • Radiant sensitive area (in mm2): 7.7 • High photo sensitivity	Original	T1610P T1610P 2002/95/EC 2002/96/EC 18-Jul-08 FVOV6870 MIL-HDBK-263 PIN photodiode chip photodiode die WAFER	PDF
FVOV6870 Abstract: MIL-HDBK-263 chip diode "sawn on foil" photodiode CIE eye response Contextual Info: T1610P Vishay Semiconductors Silicon PIN Photodiode FEATURES • Package type: chip • Package form: single chip • Dimensions L x W x H in mm : 2.97 x 2.97 x 0.28 • Wafer diameter (in mm): 100 • Radiant sensitive area (in mm2): 7.7 • High photo sensitivity	Original	T1610P T1610P 2002/95/EC 2002/96/EC 18-Jul-08 FVOV6870 MIL-HDBK-263 chip diode "sawn on foil" photodiode CIE eye response	PDF
Contextual Info: T1610P Vishay Semiconductors Silicon PIN Photodiode FEATURES • Package type: chip • Package form: single chip • Dimensions L x W x H in mm : 2.97 x 2.97 x 0.28 • Wafer diameter (in mm): 100 • Radiant sensitive area (in mm2): 7.7 • High photo sensitivity	Original	T1610P T1610P 2002/95/EC 2002/96/EC 2002/95/EC. 2011/65/EU. JS709A 02-Oct-12	PDF
Contextual Info: V I S H AY I N T E R T E C H N O L O G Y, I N C . OPTOELECTRONICS Bare Die Optoelectronics Bare Die Portfolio Infrared Emitters and Photo Detectors TABLE OF CONTENTS Introduction to Bare	Original	VMN-SG2200-1502	PDF