STD 808 B Search Results

d 5072

Abstract: d 5072 transistor elco 4.62 ELCO plug 56 PIN 09 69 201 5072 ST PER 852 C 818 001-120 plug 3.5mm 3226f 1-14-2B
Contextual Info: ELCO Microleaf Board to Board Connectors Contents ELCO A Family of Microleaf Connectors Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Selection Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Tyco 108-25007

Abstract: 102387-3 tyco 114-25003 tyco 108-25020 82007 1-87666-6 104479-8 crimper 567297-2 1-104479-3 91516-1
Contextual Info: AMPMODU Interconnection System Wire-to-Board, .100 [2.54] Centerline Products Wire Sizes Contact Platings Wire-to-Board Products Mating Post Lengths Wire Size AWG [mm2] 20 0.5-0.6 22-30 0.3-0.05 32 0.03 Platings .000015 [0.00038] Gold .000030 [0.00076] Gold

Contextual Info: SN54HC808, SN74HC808 HEX 2-INPUT AND DRIVERS D 2804, MARCH 1 9 8 4 -R E V IS E D SEPTEM BER 1987 High-Current Outputs Can Drive Up to 15 LSTTL Loads SN S4H C808 . . . J PACKAG E S N 7 4 H C 8 0 8 . . . DW OR N P A C K A G E TO P V IEW 1A C 1CJ20 D vCc IB C

Contextual Info: Dura-Con High Reliability Metal Shell .050" 1.27mm Density Solder Cup/Wire D-Microminiature • Both plug and socket available in 9, 15, 21, 25, 31, 37, 51, and 100 positions. FEATURES ■ Several styles of mounting are available for cable-to-cable, cable-to-panel

MIL-PRF-83513

Abstract: MIL-PRF-83513-D jackscrew airborne socket 775 MIL-C-835 M83513/MIL-W-16878/4-BCB
Contextual Info: Micro-D High Reliability Metal Shell 1.27mm Density Solder Cup/Wire D-Microminiature • Both plug and socket available in 9, 15, 21, 25, 31, 37, 51, and 100 positions. FEATURES ■ Several styles of mounting are available for cable-to-cable, cable-to-panel

3 x 4 membrane keypad

Abstract: Digital Displays BOS 753 BOS 600 BOS 602 material abs 757
Contextual Info: n^ Nr D U j Handgehäuse-Serie. hand-held enclosure series mà B O PL A G E H Ä U S E SYSTEME Das Gehäuse für mobile Datenerfassung/-Übertragung The enclosure for mobile data acquisition/transmission BOS 500 Digital-Handgehäuse aus ABS mit Panoramascheibe

HC20K1000

Abstract: HC20K1500 HC20K400 HC20K600
Contextual Info: 15. Introduction to HardCopy APEX Devices H51006-2.2 Introduction HardCopy APEXTM devices enable high-density APEX 20KE device technology to be used in high-volume applications where significant cost reduction is desired. HardCopy APEX devices are physically and

"Content Addressable Memory"

Abstract: HC20K1000 HC20K1500 HC20K400 HC20K600
Contextual Info: 7. Introduction to HardCopy APEX Devices H51006-2.3 Introduction HardCopy APEXTM devices enable high-density APEX 20KE device technology to be used in high-volume applications where significant cost reduction is desired. HardCopy APEX devices are physically and

479 SOCKET PINOUT

Abstract: 476 10k 615 EP610 ORDERING apex complex 478 SOCKET PINOUT ep20k200 PINOUT ALTERA+MAX+5000+programming
Contextual Info: Index 16 Numerics 2.5-V device support APEX 20K devices 71 FLEX 10K devices 128,138,273 FLEX 6000 devices 446 MAX® 7000 devices 616 MAX 3000A devices 683 3.3-V device support configuration devices 810 FLEX 10K devices 128,133,138,273 FLEX 8000 devices 376

Contextual Info: i DRAWING MADS IN AM ERICAN PRO JECTIO N 1 9 7 2 «V AM R INCORPORATED. A U RIG H TS R ESERV ED * AM R PRODUCT* COVERED BY P A T E N T S A N D /O R ^ P A T E N T S PENDING. ' R E V IS IO N S S M B MB M l HTIV MMMEL R HfFff II BE IM W s m mn m m tom mmm mans

Contextual Info: Series 75 Metal-Core Conduit 750-196 Flexible Metal-Core EMI/RFI Conduit with 3 External Braids and Jacket Triple braided shield and jacket for high dB shielding requirements, environmental How To Order Basic No. SYM B C N SYM B C T N S A L D M E F N H E V

750-196

Contextual Info: Series 75 Metal-Core Conduit 750-196 Flexible Metal-Core EMI/RFI Conduit with 3 External Braids and Jacket Triple braided shield and jacket for high dB shielding requirements, environmental How To Order Basic No. SYM B C N SYM B C T N S A L D M E F N H E V

ABR800

Abstract: ABR810 BR10
Contextual Info: ABR800 - ABR810 AVALANCHE BRIDGE RECTIFIERS PRV : 50 - 1000 Volts Io : 8.0 Amperes BR10 0.520 13.20 0.480 (12.20) FEATURES : * * * * * * * 0.158 (4.00) 0.142 (3.60) High case dielectric strength High surge current capability High reliability Low reverse current

Contextual Info: PAN-TERM Wire Joints Part Number System for PAN-TERM Wire Joints Type J = Wire Joint Non-Insulated JN = Wire Joint (Nylon Insulated) JN418-212-C Package Size X = 10 L = 50 C = 100 T = 200 D 500 M 1000 Wire Range: J Types: JN Types: 214-312 = two #14 or three #12

Contextual Info: /T\l h r t 3 ~ n f ? \ Z A I J zU - E J u A a Configuration Devices , Contents Configuration Devices for APEX & FLEX Devices Data Sheet Features. 789

V59C1G01168

Contextual Info: V59C1G01 808/168 QC HIGH PERFORMANCE 1Gbit DDR2 SDRAM 8 BANKS X 16Mbit X 8 (808) 8 BANKS X 8Mbit X 16 (168) 37 3 25A 25 19A DDR2-533 DDR2-667 DDR2-800 DDR2-800 DDR2-1066 Clock Cycle Time (tCK3) 5ns 5ns 5ns 5ns 5ns Clock Cycle Time (tCK4) 3.75ns 3.75ns 3.75ns

Contextual Info: V59C1G01 808/168 QC HIGH PERFORMANCE 1Gbit DDR2 SDRAM 8 BANKS X 16Mbit X 8 (808) 8 BANKS X 8Mbit X 16 (168) 37 3 25A 25 19A DDR2-533 DDR2-667 DDR2-800 DDR2-800 DDR2-1066 Clock Cycle Time (tCK3) 5ns 5ns 5ns 5ns 5ns Clock Cycle Time (tCK4) 3.75ns 3.75ns 3.75ns

Contextual Info: V59C1G01 808/168 QC HIGH PERFORMANCE 1Gbit DDR2 SDRAM 8 BANKS X 16Mbit X 8 (808) 8 BANKS X 8Mbit X 16 (168) 37 3 25A 25 19A DDR2-533 DDR2-667 DDR2-800 DDR2-800 DDR2-1066 Clock Cycle Time (tCK3) 5ns 5ns 5ns 5ns 5ns Clock Cycle Time (tCK4) 3.75ns 3.75ns 3.75ns

Contextual Info: V59C1G01 408/808 QB HIGH PERFORMANCE 1Gbit DDR2 SDRAM 8 BANKS X 32Mbit X 4 (408) 8 BANKS X 16Mbit X 8 (808) 37 3 25A 25 19A DDR2-533 DDR2-667 DDR2-800 DDR2-800 DDR2-1066 Clock Cycle Time (tCK3) 5ns 5ns 5ns 5ns 5ns Clock Cycle Time (tCK4) 3.75ns 3.75ns 3.75ns

V59C1G01

Contextual Info: V59C1G01 408/808/168 QB HIGH PERFORMANCE 1Gbit DDR2 SDRAM 8 BANKS X 32Mbit X 4 (408) 8 BANKS X 16Mbit X 8 (808) 8 BANKS X 8Mbit X 16 (168) 37 3 25A 25 19A DDR2-533 DDR2-667 DDR2-800 DDR2-800 DDR2-1066 Clock Cycle Time (tCK3) 5ns 5ns 5ns 5ns 5ns Clock Cycle Time (tCK4)

Contextual Info: PRELIMINARY V59C1G01 408/808/168 QB HIGH PERFORMANCE 1Gbit DDR2 SDRAM 8 BANKS X 32Mbit X 4 (408) 8 BANKS X 16Mbit X 8 (808) 8 BANKS X 8Mbit X 16 (168) 3 25A 25 19A DDR2-667 DDR2-800 DDR2-800 DDR2-1066 Clock Cycle Time (tCK3) 5ns 5ns 5ns 5ns Clock Cycle Time (tCK4)

V59C1

Contextual Info: PRELIMINARY V59C1G01 408/808/168 QA HIGH PERFORMANCE 1Gbit DDR2 SDRAM 8 BANKS X 32Mbit X 4 (408) 8 BANKS X 16Mbit X 8 (808) 8 BANKS X 8Mbit X 16 (168) 5 37 3 25A 25 18 DDR2-400 DDR2-533 DDR2-667 DDR2-800 DDR2-800 DDR2-1066 Clock Cycle Time (tCK3) 5ns 5ns 5ns

Contextual Info: PRELIMINARY V59C1G01 408/808/168 QA HIGH PERFORMANCE 1Gbit DDR2 SDRAM 8 BANKS X 32Mbit X 4 (408) 8 BANKS X 16Mbit X 8 (808) 8 BANKS X 8Mbit X 16 (168) 3 25A 25 18 DDR2-667 DDR2-800 DDR2-800 DDR2-1066 Clock Cycle Time (tCK3) 5ns 5ns 5ns 5ns Clock Cycle Time (tCK4)

TDA 70000 pin

Contextual Info: V59C1G01 408/808/168 QB HIGH PERFORMANCE 1Gbit DDR2 SDRAM 8 BANKS X 32Mbit X 4 (408) 8 BANKS X 16Mbit X 8 (808) 8 BANKS X 8Mbit X 16 (168) 37 3 25A 25 19A DDR2-533 DDR2-667 DDR2-800 DDR2-800 DDR2-1066 Clock Cycle Time (tCK3) 5ns 5ns 5ns 5ns 5ns Clock Cycle Time (tCK4)