STD 808 B Search Results

d 5072

Abstract: d 5072 transistor elco 4.62 ELCO plug 56 PIN 09 69 201 5072 ST PER 852 C 818 001-120 plug 3.5mm 3226f 1-14-2B
Contextual Info: ELCO Microleaf Board to Board Connectors Contents ELCO A Family of Microleaf Connectors Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Selection Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Tyco 108-25007

Abstract: 102387-3 tyco 114-25003 tyco 108-25020 82007 1-87666-6 104479-8 crimper 567297-2 1-104479-3 91516-1
Contextual Info: AMPMODU Interconnection System Wire-to-Board, .100 [2.54] Centerline Products Wire Sizes Contact Platings Wire-to-Board Products Mating Post Lengths Wire Size AWG [mm2] 20 0.5-0.6 22-30 0.3-0.05 32 0.03 Platings .000015 [0.00038] Gold .000030 [0.00076] Gold

Contextual Info: Databos Handheld Enclosure System For Finishing Services, Product Support, or to Order Call 1-301-696-9800 Bopla Enclosures • 7330 Executive Way • Frederick, MD 21704 • 301-696-9800 • www.Rose-Bopla.com • E-mail: RBinfo@pm-usa.com Last Update January 2012

Contextual Info: SN54HC808, SN74HC808 HEX 2-INPUT AND DRIVERS D 2804, MARCH 1 9 8 4 -R E V IS E D SEPTEM BER 1987 High-Current Outputs Can Drive Up to 15 LSTTL Loads SN S4H C808 . . . J PACKAG E S N 7 4 H C 8 0 8 . . . DW OR N P A C K A G E TO P V IEW 1A C 1CJ20 D vCc IB C

Contextual Info: Dura-Con High Reliability Metal Shell .050" 1.27mm Density Solder Cup/Wire D-Microminiature • Both plug and socket available in 9, 15, 21, 25, 31, 37, 51, and 100 positions. FEATURES ■ Several styles of mounting are available for cable-to-cable, cable-to-panel

UL 486C

Contextual Info: ELECTRICAL SOLUTIONS A. System Overview Parallel Splice, Non-Insulated B1. Cable Ties Type PS • Designed to splice two solid or stranded wires together to repair or lengthen wires • Parallel design results in only one crimp required to complete splice

Contextual Info: Dura-Con High Reliability Metal Shell F eatures • ■ .050" 1.27mm Density Solder Cup/Wire D-Microminiature Cinch Both plug and socket available in 9, 15, 21, 25, 31, 37, 51, and 100 positions. Several styles of mounting are available for cable-to-cable, cable-to-panel

Contextual Info: 3 DRAWING T H IS 0 MADE DRAWING COPYRIG HT RESERVED. IN 15 THIRD U N PU BLISH ED . 19 AMP ANGLE PRODUCTS RELEASED AMP BY MAY BE 2 PROJECTION FOR ] N C O R P O R A T E D , HARR I S B U R G , PA . COVERED U.S. BY AND BO RE IGN DIST LOC PU BLIC A TIO N ALL

MIL-PRF-83513

Abstract: MIL-PRF-83513-D jackscrew airborne socket 775 MIL-C-835 M83513/MIL-W-16878/4-BCB
Contextual Info: Micro-D High Reliability Metal Shell 1.27mm Density Solder Cup/Wire D-Microminiature • Both plug and socket available in 9, 15, 21, 25, 31, 37, 51, and 100 positions. FEATURES ■ Several styles of mounting are available for cable-to-cable, cable-to-panel

Contextual Info: Dura-Con High Reliability MIL-C-83513 .050" 1.27mm Density Solder Cup/Wire D-Microminiature FEATURES • All-plastic and metal shell wire versions available in solder cup, gold-plated solid wire, and insulated stranded wire. ■ PCB mount “terminal block” type connectors available in straight or

Contextual Info: 2 3 DRAWING T H IS 0 MADE DRAWING COPYRIGHT RE S E R V E D . IN 15 THIRD UNPUBLISHED. 19 AMP ANGLE PRODUCTS RELEASED AMP BY MAY BE PROJECTION FOR P U B LIC A TIO N ] N C OR P OR A T E D , HARR I S B U R G , PA . COVERED U .S . BY AND BORE I GN ALL INTERNATIONAL

n 340 ad

Abstract: we 652 AD-6547
Contextual Info: 3 DRAWI NG THIS O MA D E DR AWI NG COPYRIGHT RESERVED. IN THIRD 15 U N P U B L I S H E D . 19 AMP ANGLE AMP BY PRODUCTS MAY BE 2 PROJECTION RELEASED FOR PUBLICATION ] N C O R P O R A T E D , HARR I S B U R G , PA . COVERED BY U .S . AND BORE IGN ALL INTERNATIONAL

Contextual Info: 3 DRAWING THIS 0 MADE DRAWING COPYRIG HT RESERVED. IN THIRD 15 U N P U B L I S H E D . 19 AMP ANGLE AMP BY PRODUCTS MAY BE 2 PROJECTION RELEASED FOR PUBLICATION ] N C O R P O R A T E D , HARR I S B U R G , PA . COVERED U .S. BY AND ALL BO RE IGN INTERNATIONAL

H131

Abstract: L100 L120 W133 BOS 401 BOS-400
Contextual Info: ROSE+BOPLA ENCLOSURES A PHOENIX MECANO COMPANY DATABOSS Handheld Enclosures Product Drawings Last Updated 6/5/2008 Rose+Bopla Enclosures 7330 Executive Way Frederick, MD 21704 301-696-9800 www.rose-bopla.com rbinfo@pm-usa.com For Secondary Services, Product Support, or To Order, Call 1-301-696-9800

DCJPRM094

Abstract: QQ-W-343 MIL-C-83513 connector MIL-C-55302 MIL-C-83513 DCDA-31
Contextual Info: DURA-CON All-Plastic Strip Connectors Metal Shell Mil-C-83513 Connectors Terminal Blocks Microedge .050" D-microminiature Dura-Con Introduction Cinch Dura-ConTM connectors are designed for applications that require a rugged, durable, and high-performance interconnect.

3 x 4 membrane keypad

Abstract: Digital Displays BOS 753 BOS 600 BOS 602 material abs 757
Contextual Info: n^ Nr D U j Handgehäuse-Serie. hand-held enclosure series mà B O PL A G E H Ä U S E SYSTEME Das Gehäuse für mobile Datenerfassung/-Übertragung The enclosure for mobile data acquisition/transmission BOS 500 Digital-Handgehäuse aus ABS mit Panoramascheibe

Contextual Info: Terminals PAN-TERM SPLICES L ISTED * BUTT SPLICES PARALLEL SPLICES CERTIFIED * * Except BSN22, PS12 and BS22 Insul. 26-22 Wire Sizes - AWG 20-16 14-12 22-18 16-14 12-10 BUTT SPLICES BSN22-C BSN18-C BSV18X-C BS22-C BS18-C Nylon Vinyl Non-Ins. BSN14-C BSV14X-C

HC20K1000

Abstract: HC20K1500 HC20K400 HC20K600
Contextual Info: 15. Introduction to HardCopy APEX Devices H51006-2.2 Introduction HardCopy APEXTM devices enable high-density APEX 20KE device technology to be used in high-volume applications where significant cost reduction is desired. HardCopy APEX devices are physically and

"Content Addressable Memory"

Abstract: HC20K1000 HC20K1500 HC20K400 HC20K600
Contextual Info: 7. Introduction to HardCopy APEX Devices H51006-2.3 Introduction HardCopy APEXTM devices enable high-density APEX 20KE device technology to be used in high-volume applications where significant cost reduction is desired. HardCopy APEX devices are physically and

Contextual Info: AMPMODU Interconnection System Mod IV Wire-Applied Contacts and Housings Mod IV Wire-Applied Contacts and Housings Product Facts • Terminates 32-20 AWG [0.03-0.6mm2] discrete wire ■ Contacts have insulation support ■ Choice of three contact mating pressures

479 SOCKET PINOUT

Abstract: 476 10k 615 EP610 ORDERING apex complex 478 SOCKET PINOUT ep20k200 PINOUT ALTERA+MAX+5000+programming
Contextual Info: Index 16 Numerics 2.5-V device support APEX 20K devices 71 FLEX 10K devices 128,138,273 FLEX 6000 devices 446 MAX® 7000 devices 616 MAX 3000A devices 683 3.3-V device support configuration devices 810 FLEX 10K devices 128,133,138,273 FLEX 8000 devices 376

Contextual Info: i DRAWING MADS IN AM ERICAN PRO JECTIO N 1 9 7 2 «V AM R INCORPORATED. A U RIG H TS R ESERV ED * AM R PRODUCT* COVERED BY P A T E N T S A N D /O R ^ P A T E N T S PENDING. ' R E V IS IO N S S M B MB M l HTIV MMMEL R HfFff II BE IM W s m mn m m tom mmm mans

Contextual Info: Series 75 Metal-Core Conduit 750-196 Flexible Metal-Core EMI/RFI Conduit with 3 External Braids and Jacket Triple braided shield and jacket for high dB shielding requirements, environmental How To Order Basic No. SYM B C N SYM B C T N S A L D M E F N H E V

750-196

Contextual Info: Series 75 Metal-Core Conduit 750-196 Flexible Metal-Core EMI/RFI Conduit with 3 External Braids and Jacket Triple braided shield and jacket for high dB shielding requirements, environmental How To Order Basic No. SYM B C N SYM B C T N S A L D M E F N H E V