SSOP20 PACKAGE Search Results

SOL24

Abstract: SOL-24 SSOP20 SOL20
Contextual Info: TD74ABT Series A4 Type No. Package TD74ABT 240F/FS/FW Octal Bus Buffer/lnvertlng/3-state SOP20/SSOP20/SOL20 TD74ABT 241F/FW Octal Bus Buffer/Non-lnverting/3-state SOP20/SOL20 TD74ABT 244F/FS/FW Octal Bus Bufler/Non-lnverting/3-state SOP20/SSOP20/SOL20 TD74ABT 245F/FS/FW

ISO-11898

Abstract: iso11898 ISO 11898-2 ISO-11898-2 TJA1051 ISO 11898-3 reliability report of nxp ISO11898-2 ISO11898-3 J2602
Contextual Info: NXP Automotive networking solutions FlexRay TJA1080A production development 10000 Normal, Standby, Sleep SSOP20 FlexRay V2.1 Rev. A 10000 Normal, Standby, Sleep SSOP20 V V uA 6.5 … +60 4.75…5.25 50 6.5 … +60 4.75…5.25 50 V -60 … +60 kV kV V ±8 Status

SSOP20

Abstract: SKDIP28 DIP18 SOP18 Package SOP28 package DIP40 SN8P1602 SN8P1603 SN8P1604 MCU DIP18
Contextual Info: 8-Bit MCU◆ PWM CHIP ROM RAM I/O A/D D/A Interrupt Wake-up SIO LCD Buzzer Int Ext Pin No. Stack Package SN8P1602 1K*16 48 14 - - - - - 1 1 6 4 DIP18/SOP18/SSOP20 SN8P1603 1K*16 48 14 - - - - - 1 1 6 4 DIP18/SOP18/SSOP20 SN8P1604 4K*16 128 22 - - 1 - - 1 1

SSOP20-C3

Contextual Info: PACKAGE DIMENSIONS SSOP20-C3 Ｇ Ｄ － Ｖ ０ ２ ０ ０ ３ Ａ － ０ UNIT : mm Ver.2008-08-28

SSOP20-P

Abstract: ssop-20p SSOP20-P-250-0
Contextual Info: SSOP20-P-250-0.95-K Mirror finish Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating( 5 m) 0.18 TYP. 5/Oct.13,1998

SSOP20

Abstract: SSOP20 package
Contextual Info: PACKAGE DIMENSIONS SSOP20-F1 0 ~ 10º 8.9±0.3 20 0.5±0.2 7.8±0.3 5.4±0.2 11 1 10 0.8 +0.1 0.15 -0.05 0.10 0.36±0.1 0.12 M +0.1 0.05 - 0.05 1.8±0.1 0.85TYP UNIT : mm

SSOP20-P

Contextual Info: SSOP20-P-44-0.65-K Mirror Finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.088 TYP. 1/Jan. 22, 1999

SSOP20-P-250-0

Contextual Info: SSOP20-P-250-0.95-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.18 TYP. 5/Oct. 13, 1998

SSOP20

Abstract: SSOP20 package
Contextual Info: PACKAGE DIMENSIONS SSOP20-B2 5.0 +0.3 -0.1 0 ~ 10º 0.5±0.2 6.4±0.3 11 4.4±0.2 20 10 1 0.5 0.15±0.1 0.1±0.1 1.15±0.1 0.4MAX 0.1 0.20±0.1 0.1 M UNIT : mm

SSOP20

Abstract: SSOP20 package
Contextual Info: PACKAGE DIMENSIONS SSOP20 +0.3 6.5 -0.1 1 10 0.5±0.2 11 4.4±0.2 20 6.4±0.3 0 ~ 10º 0.65 +0.1 0.15 -0.05 0.1±0.1 1.15±0.1 0.45MAX 0.1 0.22±0.1 0.1 M UNIT : mm

ESDA6V1FU6

Contextual Info: ESDA6V1Q6-18RL Application Specific Discretes A.S.D.TM ESD PROTECTION MONOLITHIC 9-BIT WIDE TRANSILTM ARRAY MAIN APPLICATIONS Where protection in ESD sensitive equipment is required, such as : - Computers - Printers - Communication systems DESCRIPTION SSOP20

LC72122V

Abstract: SSOP20 D2598
Contextual Info: Ordering number : ENN6113A CMOS IC LC72122V PLL Frequency Synthesizer for Portable Equipment Electronic Tuning Package Dimensions unit: mm 3179A-SSOP20 1.0 [LC72122V] 20 11 6.4 0.5 • High-speed programmable frequency divider — FMIN: 10 to 250 MHz .Pulse swallower

20P2F-A

Abstract: SSOP20-P 20P2F
Contextual Info: Under development Preliminary specification Specifications in this manual are tentative and subject to change. R8C/14, R8C/15 Group Appendix 1. Package Dimensions 20P2F-A Recommended EIAJ Package Code SSOP20-P-255-0.65 Plastic 20pin 255mil SSOP Weight g –

2 ic 4440 amplifier input output

Contextual Info: Ordering number : ENN6113A CMOS IC LC72122V PLL Frequency Synthesizer for Portable Equipment Electronic Tuning Package Dimensions unit: mm 3179A-SSOP20 1.0 [LC72122V] 20 11 6.4 0.5 • High-speed programmable frequency divider — FMIN: 10 to 250 MHz .Pulse swallower

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of SSOP20 package SOT339-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of SSOP20 package SOT266-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Murata grm40

Abstract: CRG16G GRM40 MURATA grm40 SW SPDT 2SC4713K GRM36 NJG1701V NJU7663R SSOP20
Contextual Info: NJG1701V PHS MULTI-FUNCTION GaAs MMIC nGENERAL DESCRIPTION NJG1701V is a GaAs multi-function MMIC composed of a power amplifier, a SPDT switch and a LNA for Japanese PHS or WLL application. The SSOP20 package is adopted and effective for downsizing of handsets.

Murata grm40

Abstract: CRG16G 2SC4713K GRM36 GRM40 NJG1701V NJU7663R SSOP20 MURATA GRM36 GRM40 murata
Contextual Info: NJG1701V PHS MULTI-FUNCTION GaAs MMIC •GENERAL DESCRIPTION NJG1701V is a GaAs multi-function MMIC composed of a power amplifier, a SPDT switch and a LNA for Japanese PHS or WLL application. The SSOP20 package is adopted, and this package helps downsizing of handsets.

C 5386

Abstract: 2SA984-E like str 2SA984 2SC2274 LA5312V SSOP20 STR IC la5312 EN5386
Contextual Info: Ordering number: EN5386 Monolithic Linear IC LA5312V Variable Divided Voltage Generator for LCDs Overview Package Dimensions unit : mm The LA5312V is a variable divided voltage generator IC for multiple drive of LCD matrix. 3179-SSOP20 [LA5312V] Features . Power supply for variable bias LCD drive

Contextual Info: SSOP20-P-250-0.95-K Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

SSOP20

Abstract: SSOP20 package
Contextual Info: SSOP20 Adapter shrink small outline package RE931-03 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU (pth) - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0,65 (208 mil) - pins: 20 - hole dia 1.00 mm - pitch 0.65 mm

ESDA14V2L

Abstract: TRANSILS 47B SOT23 ESDA14V2SC5 ESDA14V2SC6 ITA10B1 ITA10B3 ITA18B1 ITA18B3 ITA25B1
Contextual Info: PROTECTION CIRCUITS ASDTM FOR COMPUTER SOT-23 SOT-23-5L SOT-23-6L DIL8 SO-8 SSOP20 SO20 DATALINE PROTECTION AGAINST ELECTRICAL OVERSTRESS EOS Max ratings Array Function UL 497 B 4 Bidirectional Transils 8 Bidirectional Transils 6 Unidirectional Transils

TRANSILS

Abstract: SSOP20 max5252 ESDA6V1U1
Contextual Info: PROTECTION CIRCUITS ASDTM FOR COMPUTER SO8 SSOP20 SO20 DATALINE PROTECTION AGAINST ELECTRICAL OVERSTRESS EOS Max ratings Array Function (UL) 4 Bidirectional Transils 8 Bidirectional Transils 6 Unidirectional Transils Type IRM @ VRM VBR @ IR VCL @ IPP 8/20 µs expo

SSOP20

Contextual Info: SANYO Semiconductor Shrink Small Outline Package 20Pin Plastic SSOP20 225mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the