SSOP20 PACKAGE Search Results

SOL24

Abstract: SOL-24 SSOP20 SOL20
Contextual Info: TD74ABT Series A4 Type No. Package TD74ABT 240F/FS/FW Octal Bus Buffer/lnvertlng/3-state SOP20/SSOP20/SOL20 TD74ABT 241F/FW Octal Bus Buffer/Non-lnverting/3-state SOP20/SOL20 TD74ABT 244F/FS/FW Octal Bus Bufler/Non-lnverting/3-state SOP20/SSOP20/SOL20 TD74ABT 245F/FS/FW

ISO-11898

Abstract: iso11898 ISO 11898-2 ISO-11898-2 TJA1051 ISO 11898-3 reliability report of nxp ISO11898-2 ISO11898-3 J2602
Contextual Info: NXP Automotive networking solutions FlexRay TJA1080A production development 10000 Normal, Standby, Sleep SSOP20 FlexRay V2.1 Rev. A 10000 Normal, Standby, Sleep SSOP20 V V uA 6.5 … +60 4.75…5.25 50 6.5 … +60 4.75…5.25 50 V -60 … +60 kV kV V ±8 Status

SSOP20

Abstract: SKDIP28 DIP18 SOP18 Package SOP28 package DIP40 SN8P1602 SN8P1603 SN8P1604 MCU DIP18
Contextual Info: 8-Bit MCU◆ PWM CHIP ROM RAM I/O A/D D/A Interrupt Wake-up SIO LCD Buzzer Int Ext Pin No. Stack Package SN8P1602 1K*16 48 14 - - - - - 1 1 6 4 DIP18/SOP18/SSOP20 SN8P1603 1K*16 48 14 - - - - - 1 1 6 4 DIP18/SOP18/SSOP20 SN8P1604 4K*16 128 22 - - 1 - - 1 1

SSOP20-C3

Contextual Info: PACKAGE DIMENSIONS SSOP20-C3 Ｇ Ｄ － Ｖ ０ ２ ０ ０ ３ Ａ － ０ UNIT : mm Ver.2008-08-28

SSOP20

Abstract: SSOP20 package
Contextual Info: PACKAGE DIMENSIONS SSOP20-F1 0 ~ 10º 8.9±0.3 20 0.5±0.2 7.8±0.3 5.4±0.2 11 1 10 0.8 +0.1 0.15 -0.05 0.10 0.36±0.1 0.12 M +0.1 0.05 - 0.05 1.8±0.1 0.85TYP UNIT : mm

SSOP20

Abstract: SSOP20 package
Contextual Info: PACKAGE DIMENSIONS SSOP20-B2 5.0 +0.3 -0.1 0 ~ 10º 0.5±0.2 6.4±0.3 11 4.4±0.2 20 10 1 0.5 0.15±0.1 0.1±0.1 1.15±0.1 0.4MAX 0.1 0.20±0.1 0.1 M UNIT : mm

SSOP20

Abstract: SSOP20 package
Contextual Info: PACKAGE DIMENSIONS SSOP20 +0.3 6.5 -0.1 1 10 0.5±0.2 11 4.4±0.2 20 6.4±0.3 0 ~ 10º 0.65 +0.1 0.15 -0.05 0.1±0.1 1.15±0.1 0.45MAX 0.1 0.22±0.1 0.1 M UNIT : mm

ESDA6V1FU6

Contextual Info: ESDA6V1Q6-18RL Application Specific Discretes A.S.D.TM ESD PROTECTION MONOLITHIC 9-BIT WIDE TRANSILTM ARRAY MAIN APPLICATIONS Where protection in ESD sensitive equipment is required, such as : - Computers - Printers - Communication systems DESCRIPTION SSOP20

LC72122V

Abstract: SSOP20 D2598
Contextual Info: Ordering number : ENN6113A CMOS IC LC72122V PLL Frequency Synthesizer for Portable Equipment Electronic Tuning Package Dimensions unit: mm 3179A-SSOP20 1.0 [LC72122V] 20 11 6.4 0.5 • High-speed programmable frequency divider — FMIN: 10 to 250 MHz .Pulse swallower

20P2F-A

Abstract: SSOP20-P 20P2F
Contextual Info: Under development Preliminary specification Specifications in this manual are tentative and subject to change. R8C/14, R8C/15 Group Appendix 1. Package Dimensions 20P2F-A Recommended EIAJ Package Code SSOP20-P-255-0.65 Plastic 20pin 255mil SSOP Weight g –

Contextual Info: Ordering number: EN5386 Monolithic Linear 1C LA5312V No. 5386 i SAiYO Variable Divided Voltage Generator for LCDs J Overview Package Dimensions The LA5312V is a variable divided voltage generator IC for multiple drive of LC D matrix. unit : mm 3179-SSOP20

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of SSOP20 package SOT339-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of SSOP20 package SOT266-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Murata grm40

Abstract: CRG16G 2SC4713K GRM36 GRM40 NJG1701V NJU7663R SSOP20 MURATA GRM36 GRM40 murata
Contextual Info: NJG1701V PHS MULTI-FUNCTION GaAs MMIC •GENERAL DESCRIPTION NJG1701V is a GaAs multi-function MMIC composed of a power amplifier, a SPDT switch and a LNA for Japanese PHS or WLL application. The SSOP20 package is adopted, and this package helps downsizing of handsets.

ESDA14V2L

Abstract: TRANSILS 47B SOT23 ESDA14V2SC5 ESDA14V2SC6 ITA10B1 ITA10B3 ITA18B1 ITA18B3 ITA25B1
Contextual Info: PROTECTION CIRCUITS ASDTM FOR COMPUTER SOT-23 SOT-23-5L SOT-23-6L DIL8 SO-8 SSOP20 SO20 DATALINE PROTECTION AGAINST ELECTRICAL OVERSTRESS EOS Max ratings Array Function UL 497 B 4 Bidirectional Transils 8 Bidirectional Transils 6 Unidirectional Transils

SSOP20

Contextual Info: SANYO Semiconductor Shrink Small Outline Package 20Pin Plastic SSOP20 225mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

JEP95

Abstract: MO-137 SSOP20 marx
Contextual Info: ZMD-Standard August 2003 Package SSOP20 3,9 mm MDS 767 Dimensions in millimetres Based on JEDEC JEP95: MO-137 1 Dimensions View X bp A A2 X 1 10 e D Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax 1,73 Amin 1,54 bPmin 0,20 A1min 0,10 bPmax 0,30

JEP95

Abstract: MO-150 SSOP20 QS-000757-HD-02 marx
Contextual Info: ZMD-Standard February 2000 Package SSOP20 5,3 mm MDS 757 Supersedes Edition 11.99 Dimensions in millimetres Based on JEDEC JEP95: MO-150 1 Dimensions A A2 X View X k x 45° 0,1 1 Z bp e 0,15 M D Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax

Contextual Info: ST3384 3 TO 3.6V, LOW POWER, UP TO 400KBPS, RS-232 DRIVERS AND RECEIVERS • ■ ■ ■ ■ 300µA SUPPLY CURRENT 250Kbps MINIMUM GUARENTEED DATA RATE 6V/ms MINIMUM GUARANTEED SLEW RATE MEET EIA/TIA-232 SPECIFICATIONS DOWN TO 3V AVAILABLE IN SO-18 AND SSOP20

Contextual Info: Package outline SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm D SOT266-1 E A X c y HE v M A Z 11 20 Q A2 pin 1 index A A 3 A1 θ Lp L 1 10 e detail X w M bp 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max.

Contextual Info: Package outline SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm D SOT339-1 E A X c HE y v M A Z 20 11 Q A2 pin 1 index A A 3 A1 θ Lp L 1 10 w M bp e detail X 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max.

Contextual Info: Package outline SSOP20: plastic shrink small outline package; 20 leads; body width 3.9 mm; lead pitch 0.635 mm D E SOT724-1 A X c y HE v M A Z 11 20 A2 A A3 A1 θ Lp L 10 1 1/2 e e bp detail X w M 2.5 5 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)

SSOP20

Abstract: v020 diode M1 SSOP20-M1
Contextual Info: PACKAGE DIMENSIONS SSOP20-M1 0 ~1 0 ﾟ +0.2 6 . 5 - 0.1 20 0.6 ± 0.1 6 .4 ±0 . 2 4. 4 ±0 . 2 11 1 0 .3 2 5 T Y P 10 0.65 +0.05 1.1MAX 0.9 ± 0.05 0 . 1 5 -0.06 0 . 1 ±0 . 0 5 Mold Base 0.08 0 .2 2 ±0 . 0 5 GD-V02001G-1 Ver.2005-11-24 0.10 M UNIT : mm

FET Drivers

Abstract: soic28 hdd spindle motor driver SSOP20 hdd servo controller hdd motor DRIVER hdd motor controller ML8464C "read channel" PCC-32
Contextual Info: 3^ Micro Linear Mass Storage Selection Guide READ/WRITE AMPLIFIERS Part Number Numbers of Channels 4, 6 or 8 ML511 Head Type ' Max Input Write Current Noise nV/VHz Range (mA) Key Features Package Options Ferrite 1.5 10 to 40 Improved Write Stability SO-24; PCC-28,44