SSOP 56 LAND PATTERN Search Results

land pattern for TSOP

Abstract: TSOP 86 land pattern land pattern for SOP land pattern PQFP 208 land pattern for TSOP 2 86 MA05A land pattern for TSOP 2 land pattern for SSOP land pattern PQFP 100
Contextual Info: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages,

land pattern for SSOP

Abstract: TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern PQFP 100
Contextual Info: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages, refer to land patterns shown in the Physical Dimensions for

land pattern for TSOP 2-44

Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
Contextual Info: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions

PHD64

Abstract: land pattern for vsop 8 pins land pattern for vsop DCA56 PFC80 PZT10 DED28 DFD64 DAP38 PWD14
Contextual Info: PowerPAD - A Method To Create Thermally Enhanced Plastic Package Solutions for Semiconductors Milton L. Buschbom, Mark Peterson, Shih-Fang Chuang, David Kee, and Buford Carter Texas Instruments, Incorporated Dallas, Texas f = switching frequency in Hz N = number of gates switched/clock cycle

ansi y14.5m-1982 decimal

Abstract: CD 4039 AE ansi y14.5m-1982 decimal .xxxx SSC 9500 MAA 723 pj 299 IC 4033 pin configuration IC CD 4033 pin configuration IC CD 4033 pin diagram tsop 48 PIN
Contextual Info: PACKAGE s o ie DIAGRAM O U T L IN E S PACKAGE SOIC DIAGRAM O U T L IN E S C o n tin u ed REVISIONS DWG § NOM N MAX T E S 0 18- -1 DWG § JEDEC VARIATION □ AA MIN DWG § S016- JEDEC VARIATION □ AB MIN NOM MAX S020- 2 JEDEC VARIATION T E NOM MAX T E

44-pin plcc pcb mount footprint

Abstract: PIC16C71SO pic16c57 PCB Circuit 27C64SO PIC16C74P adaptor 32 pin dil to 32 pin plcc pic16c57 codes data programmers DIP PLCC Enplas PIC17C76X
Contextual Info: 7 Logic Analyzers and Accessories 7 Logic Analyzers and Accessories Logic Analyzers and Accessories Logic Analyzers and Accessories DS00104F-page 7-1  2001 Microchip Technology Inc. Logic Analyzers and Accessories Section 7 Logic Analyzers and Accessories

MARKING T6C

Abstract: lga 1155 package Code T6S M33 TRANSISTOR 14SSOP QFN-36 LAND PATTERN 14LGA 36pin qfn marking 6-PIN PLASTIC TSON nec 44pin
Contextual Info: Technical Note PACKAGES LINE-UP FOR RF AND MICROWAVE DEVICES Document No. PX10051EJ35V0TN 35th edition Date Published March 2010 NS NEC Electronics Corporation 2001, 2010 Printed in Japan • The information in this document is current as of March, 2010. The information is subject to change

CHN 725 diode

Contextual Info: 20-BIT BUS SWITCH IDT7 4 FST32X L384 In te g r a te d D e v i z e T e c h n o lo g y , î i c . isolating two ports without providing any inherent current sink or source capability. Thus they generate little or no noise of their own while providing a low resistance path for an external

chn 810

Abstract: chn 825
Contextual Info: 20-BIT BUS SWITCH IDT74 FST32X L2384 In te g r a te d D e v i z e T e c h n o lo g y , î i c . isolating two ports without providing any inherent current sink or source capability. Thus they generate little or no noise of their own while providing a low resistance path for an external

91185A558

Abstract: 8c210 SSOP 56 land pattern NC10 NC11 NC12 NC13 NC15 NC16 connector male 6 pin 1.27mm
Contextual Info: 5 4 3 2 1 Revision History Rev 0.1 Original D D Proton POD Schematic 24MLF VCC J1 P0_1 SMP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 P0_7 P0_5 P0_3 P0_1 OCD_DE OCD_DO SMP P1_7 P1_5 C P1_3 P1_1 VDD P0_6 P0_4 P0_2 P0_0 P2_6

Contextual Info: 24-BIT BUS SWITCH IDT74FST163211 life In te g r a te d D e v i c e T e c h n o lo g y , î i c . FEATURES: lating two ports without providing any inherent current sink or source capability. They generate little or no noise of their own while providing a low resistance path for an external driver.

land pattern for TSOP 2 86 PIN

Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern ic packages TSOP 66 pin Package thermal resistance SOJ 44 PCB land ED730
Contextual Info: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1. PACKAGE CLASSIFICATIONS

Contextual Info: 20-BIT BUS SWITCH FEATURES: Bus switches provide zero delay paths Extended commercial range of -4 0 ° C to +85°C Low switch on-resistance: TTL-compatible input and output levels ESD >2000v per MIL-STD-883, Method 3015; > 200V using machine model C = 200pF, R = 0

Contextual Info: 18-BIT BUS SWITCH/ 4 PORT BUS EXCHANGER FEATURES: Bus switches provide zero delay paths Extended commercial range of -4 0 ° C to +85°C Low switch on-resistance: TTL-compatible input and output levels ESD >2000v per MIL-STD-883, Method 3015; > 200V using machine model C = 200pF, R = 0

Contextual Info: 3.3V CMOS 16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS, 5 VOLT TOLERANT I/O FEATURES: - Typical - ESD > 2000V per MIL-STD-883, Method 3015; tsK o (Output Skew) < 250ps > 200V using machine model (C = 200pF, R = 0) - 0.635mm pitch SSOP, 0.50mm pitch TSSOP and 0.40mm pitch TVSO P packages

c6822

Abstract: pdcr 22 91185A558 transistor c6822 land pattern for SSOP56 CY8C21002-24PVXI pdcr9 SSOP20 LAND PATTERN transistor c3845 J1-0603
Contextual Info: PROPRIETARY INFORMATION: Information contained in this drawing is confidential. Copying, distributing or use in any matter, other than that specified by IRONWOOD ELECTRONICS, INC., is strictly prohibited and may be unlawful. If you have received this drawing in

chn 627

Abstract: chn 810 CHN 725 diode chn 610 chn 630 b244a k 3511 CHN 420 CHN 727
Contextual Info: 16-BIT SYNCHRONOUS 2:1 MUX/DEMUX SWITCH IDT74FST163232 ADVANCE INFORMATION In te g ra te d D evice T echnology, Inc. driver. These devices connect input and output ports through an n-channel FET. When the gate-to-source junction of this FET is adequately forward-biased the device conducts and

marking 6-PIN PLASTIC TSON

Abstract: MARKING M53 MARKING CODE T5E RENESAS marking code 30SSOP Renesas 30SSOP marking code lga 1155 M33 TRANSISTOR Microwave Devices QFN-52 p5 6pin
Contextual Info: PACKAGES LINE-UP FOR RF AND MICROWAVE DEVICES Common Information www.renesas.com Rev.2.00 Oct 2010 Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please

Contextual Info: 3.3V CMOS 16-BIT TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS AND 5 VOLT TOLERANT I/O FEATURES: - Typical - ESD > 2000V per MIL-STD-883, Method 3015; - 0.635mm pitch SSOP, 0.50mm pitch TSSOP tsK o (Output Skew) < 250ps > 200V using machine model (C = 200pF, R = 0)

Contextual Info: 3.3V CMOS 18-BIT REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS, 5 VOLT TOLERANT I/O FEATURES: - power 18-bit registered bus transceiver combines D-type latches and D-type flip-flops to allow data flow in transparent, latched, and clocked modes. Data flow in each direction is

Contextual Info: 3.3V CMOS 20-BIT BUFFER WITH 5 VOLT TOLERANT I/O AND BUS-HOLD BE D E S C R IP TIO N FEATURES: - Typical - ESD > 2000V per MIL-STD-883, Method 3015; tsK o (Output Skew) < 250ps > 200V using machine model (C = 200pF, R = 0) - 0.635mm pitch SSOP, 0.50mm pitch TSSOP

Contextual Info: 3.3 V CMOS 18-BIT UNIVERSAL BUS DRIVER WITH 3-STATE OUTPUTS FEATURES: - 0.5 MICRON CMOS Technology Typical tsK o (Output Skew) < 250ps ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) - 0.635mm pitch SSOP, 0.50mm pitch TSSOP,

Contextual Info: 3.3V CMOS 20-BIT BUFFER WITH 5 VOLT TOLERANT I/O BE :888í:i8fí¡ FEATURES: - Typical tsK o (Output Skew) < 250ps ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) 0.635mm pitch SSOP, 0.50mm pitch TSSOP and 0.40mm pitch TVSOP packages

Contextual Info: 24-BIT BUS EXCHANGE SWITCH IDT74FST163212 life Integrated D evice Technology, î ic . FEATURES: source capability. They generate little or no noise of their own while providing a low resistance path for an external driver. These devices connect input and output ports through an nchannel FET. When the gate-to-source junction of this FET