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10127721-183LF
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Amphenol Communications Solutions
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Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 18 Position, 3.2mm Kink Tail (15u\\ Gold) plating, Non GW Compatible LCP, Black Color,Tray Packing. |
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68602-118HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 18 Positions, 2.54 mm (0.100in)Pitch. |
PDF
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86832-118HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 18 Positions, 2.54 mm Pitch, Vertical, 8.26 mm (0.325 in.) Mating, 2.54 mm (0.1 in.) Tail. |
PDF
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68692-118HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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98426-S03-22-118LF
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Amphenol Communications Solutions
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Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 44 Positions, 2.00mm (0.079in) Pitch. |
PDF
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