SOT909-1 Search Results
SOT909-1 Datasheets (4)
NXP Semiconductors
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| SOT909-1 |
|
Footprint for reflow soldering SOT909-1 | Original | 327.25KB | 1 | ||
| SOT909-1 |
|
Plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 4 x 4 x 0.85 mm | Original | 226.21KB | 1 | ||
| SOT909-1_115 |
|
HVSON8; reel pack; standard product orientation;12NC ending 115 | Original | 324.91KB | 4 | ||
| SOT909-1_118 |
|
HVSON8; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 | Original | 183.06KB | 4 |