| SOT909-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT909-1 |
Original |
PDF
|
327.25KB |
1 |
| SOT909-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 4 x 4 x 0.85 mm |
Original |
PDF
|
226.21KB |
1 |
| SOT909-1_115 |
|
NXP Semiconductors
|
HVSON8; reel pack; standard product orientation;12NC ending 115 |
Original |
PDF
|
324.91KB |
4 |
| SOT909-1_118 |
|
NXP Semiconductors
|
HVSON8; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 |
Original |
PDF
|
183.06KB |
4 |
