SOT617-1 Search Results
SOT617-1 Datasheets (6)
NXP Semiconductors
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| SOT617-1 |
|
Footprint information for reflow soldering of HVQFN32 package | Original | 19.25KB | 1 | ||
| SOT617-1 |
|
Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm | Original | 227.7KB | 1 | ||
| SOT617-11 |
|
Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals | Original | 344.43KB | 1 | ||
| SOT617-1_115 |
|
HVQFN32; Reel pack; SMD, 7"; standard product orientationOrderable part number ending, 115 or XOrdering code (12NC) ending 115 | Original | 212.34KB | 4 | ||
| SOT617-1_118 |
|
HVQFN32; Standard product orientation 12NC ending 118 | Original | 212.35KB | 4 | ||
| SOT617-1_128 |
|
HVQFN24; Reel pack; SMD, 13", TurnedQ2/T3 Standard product orientationOrderable part number ending ,128 or HPOrdering code (12NC) ending 128 | Original | 206.86KB | 4 |