| SOT617-1 |
|
NXP Semiconductors
|
Footprint information for reflow soldering of HVQFN32 package |
Original |
PDF
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19.25KB |
1 |
| SOT617-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm |
Original |
PDF
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227.7KB |
1 |
| SOT617-11 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals |
Original |
PDF
|
344.43KB |
1 |
| SOT617-1_115 |
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NXP Semiconductors
|
HVQFN32; Reel pack; SMD, 7"; standard product orientationOrderable part number ending, 115 or XOrdering code (12NC) ending 115 |
Original |
PDF
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212.34KB |
4 |
| SOT617-1_118 |
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NXP Semiconductors
|
HVQFN32; Standard product orientation 12NC ending 118 |
Original |
PDF
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212.35KB |
4 |
| SOT617-1_128 |
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NXP Semiconductors
|
HVQFN24; Reel pack; SMD, 13", TurnedQ2/T3 Standard product orientationOrderable part number ending ,128 or HPOrdering code (12NC) ending 128 |
Original |
PDF
|
206.86KB |
4 |
