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    SOT56 Price and Stock

    Bourns Inc CDSOT563-T05C

    TVS DIODE 5VWM 12VC SOT563
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey CDSOT563-T05C Reel
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    Bourns Inc CDSOT563-0502

    TVS DIODE 5VWM 9VC SOT563
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey CDSOT563-0502 Reel
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    Onlinecomponents.com CDSOT563-0502
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    Master Electronics CDSOT563-0502
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    • 10000 $0.266
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    Littelfuse Inc SP3006-02XTG

    ESD Suppressors / TVS Diodes 2 CH 8KV 0.5pF
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI SP3006-02XTG Reel 15,000 3,000
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    ROHM Semiconductor EM6K6T2R

    MOSFET Small Signal Dual N-CH 20V .3A .15W
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI EM6K6T2R Reel 8,000 8,000
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    Vishay Intertechnologies SI1024X-T1-GE3

    MOSFET Dual N-Ch MOSFET 20V 700 mohms @ 4.5V
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI SI1024X-T1-GE3 Reel 63,000 3,000
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    Find more SOT56 price and stock on Findchips.com

    SOT56 Datasheets (13)

    Part ECAD Model Manufacturer Description Curated Type PDF
    SOT560-1 NXP Semiconductors Plastic thermal enhanced bottom chip carrier; 32 terminals; body 5 x 5 x 0.65 mm Original PDF
    SOT560-1 NXP Semiconductors Footprint for reflow soldering SOT560-1 Original PDF
    SOT-563 SYNC Power OUTLINE Original PDF
    SOT564-1 NXP Semiconductors Footprint for reflow soldering SOT564-1 Original PDF
    SOT564-1 NXP Semiconductors Plastic thermal enhanced bottom chip carrier; 24 terminals; body 4 x 4 x 0.65 mm Original PDF
    SOT566-1 NXP Semiconductors Plastic, heatsink small outline package; 24 leads Original PDF
    SOT566-2 NXP Semiconductors Plastic, heatsink small outline package; 24 leads; low stand-off height Original PDF
    SOT566-3 NXP Semiconductors Plastic, heatsink small outline package; 24 leads; low stand-off height Original PDF
    SOT567a NXP Semiconductors leadless surface mounted package; plastic cap; 8 terminations Original PDF
    SOT569-1 NXP Semiconductors Footprint for reflow soldering SOT569-1 Original PDF
    SOT569-1 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.8 mm Original PDF
    SOT569-2 NXP Semiconductors Footprint for reflow soldering SOT569-2 Original PDF
    SOT569-2 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 144 balls Original PDF