SOT111 Search Results

Contextual Info: Package outline XSON6: extremely thin small outline package; no leads; 6 terminals; body 0.9 x 1.0 x 0.35 mm 1 SOT1115 b 3 2 4x (2) L L1 e 6 5 4 e1 e1 (6×)(2) A1 A D E terminal 1 index area 0.5 Dimensions Unit mm 1 mm scale A(1) A1 b D E e max 0.35 0.04 0.20 0.95 1.05

Contextual Info: DF N2 020 -6 PBSS4160PANP 60 V, 1 A NPN/PNP low VCEsat BISS transistor 14 January 2013 Product data sheet 1. General description NPN/PNP low VCEsat Breakthrough In Small Signal (BISS) transistor in a leadless medium power DFN2020-6 (SOT1118) Surface-Mounted Device (SMD) plastic package.

SNW-FQ-611

Abstract: KKA6107Q
Contextual Info: KKA6107Q Triple video output amplifier GENERAL DESCRIPTION The KKA6107Q includes three video output amplifiers in one plastic DIL-bent-SIL 9-pin medium power DBS9MPF package (SOT111-1), using high-voltage DMOS technology, and is intended to drive the three

DFN2020-6

Contextual Info: 020 -6 PMDPB55XP DF N2 20 V, dual P-channel Trench MOSFET Rev. 3 — 4 June 2012 Product data sheet 1. Product profile 1.1 General description Dual P-channel enhancement mode Field-Effect Transistor FET in a small and leadless ultra thin DFN2020-6 (SOT1118) Surface-Mounted Device (SMD) plastic package using

marking code 2Q

Contextual Info: PBSS4260PANP 60 V, 2 A NPN/PNP low VCEsat BISS transistor 12 December 2012 Product data sheet 1. General description NPN/PNP low VCEsat Breakthrough In Small Signal (BISS) transistor in a leadless medium power DFN2020-6 (SOT1118) Surface-Mounted Device (SMD) plastic package.

NXP SMD TRANSISTOR MARKING CODE s1

Contextual Info: PMDPB55XP 20 V, dual P-channel Trench MOSFET Rev. 2 — 2 May 2012 Product data sheet 1. Product profile 1.1 General description Dual P-channel enhancement mode Field-Effect Transistor FET in a small and leadless ultra thin DFN2020-6 (SOT1118) Surface-Mounted Device (SMD) plastic package using

SMD TRANSISTOR MARKING 2e

Abstract: 2e SMD PNP TRANSISTOR
Contextual Info: PBSS5130PAP 30 V, 1 A PNP/PNP low VCEsat BISS transistor 12 December 2012 Product data sheet 1. General description PNP/PNP low VCEsat Breakthrough In Small Signal (BISS) transistor in a leadless medium power DFN2020-6 (SOT1118) Surface-Mounted Device (SMD) plastic package.

npn transistor footprint

Contextual Info: PBSS4260PAN 60 V, 2 A NPN/NPN low VCEsat BISS transistor 12 December 2012 Product data sheet 1. General description NPN/NPN low VCEsat Breakthrough In Small Signal (BISS) transistor in a leadless medium power DFN2020-6 (SOT1118) Surface-Mounted Device (SMD) plastic package.

smd diode marking 2U

Abstract: smd diode marking codes 2U smd diode code marking 2U marking 2U 28 diode DIODE smd marking 2U diode SMD marking code 2u 2U marking code diode smd smd diode marking 2U 40 marking 2U diode smd
Contextual Info: PMDPB95XNE 30 V dual N-channel Trench MOSFET 26 September 2012 Product data sheet 1. Product profile 1.1 General description Dual N-channel enhancement mode Field-Effect Transistor FET in a leadless medium power DFN2020-6 (SOT1118) Surface-Mounted Device (SMD) plastic package using

g1 TRANSISTOR SMD MARKING CODE

Abstract: PMDPB55XP
Contextual Info: PMDPB55XP 20 V, dual P-channel Trench MOSFET Rev. 1 — 9 March 2012 Product data sheet 1. Product profile 1.1 General description Dual P-channel enhancement mode Field-Effect Transistor FET in a small and leadless ultra thin SOT1118 Surface-Mounted Device (SMD) plastic package using Trench

SOT1118

Abstract: PMDPB70XP NXP SMD TRANSISTOR MARKING CODE s1
Contextual Info: PMDPB70XP 30 V, dual P-channel Trench MOSFET Rev. 1 — 9 March 2012 Product data sheet 1. Product profile 1.1 General description Dual P-channel enhancement mode Field-Effect Transistor FET in a small and leadless ultra thin SOT1118 Surface-Mounted Device (SMD) plastic package using Trench

NXP SMD ic MARKING CODE

Contextual Info: PBSM5240PF 40 V, 2 A PNP low VCEsat BISS transistor with N-channel Trench MOSFET Rev. 2 — 20 April 2011 Product data sheet 1. Product profile 1.1 General description Combination of PNP low VCEsat Breakthrough In Small Signal (BISS) transistor and N-channel Trench MOSFET. The device is housed in a leadless medium power SOT1118

PMDPB70EN

Contextual Info: PMDPB70EN 30 V, dual N-channel Trench MOSFET Rev. 1 — 25 April 2012 Product data sheet 1. Product profile 1.1 General description Dual N-channel enhancement mode Field-Effect Transistor FET in a small and leadless ultra thin DFN2020-6 (SOT1118) Surface-Mounted Device (SMD) plastic package using

p-channel mosfet with diode sot89

Abstract: PMFPB6532 PMFPB6545 AEC-Q101-qualified PMEG30 MOSFET455 PBSS304PX PMEG3020CPA PMEG4010CPA PMEG2020CPA
Contextual Info: NXP leadless, 2 x 2 mm SOT1061 and SOT1118 packages Fit more functions on a PCB with small, thin medium-power packages These leadless, medium-power SMD packages measure only 2 x 2 x 0.65 mm and provide excellent electrical and thermal performance. They enable high integration for a range of

Contextual Info: Package outline HBGA432: plastic thermal enhanced ball grid array package; 432 balls; heatsink SOT1119-1 B D A D1 ball A1 index area E1 j E A2 A A1 detail X e1 e 1/2 e ∅v ∅w b AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A C C A B C y y1 C e

Contextual Info: DF N2 020 -6 PBSS5160PAP 60 V, 1 A PNP/PNP low VCEsat BISS transistor 23 January 2013 Product data sheet 1. General description PNP/PNP low VCEsat Breakthrough In Small Signal (BISS) transistor in a leadless medium power DFN2020-6 (SOT1118) Surface-Mounted Device (SMD) plastic package.

Contextual Info: Package outline HUSON6: plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; body 2 x 2 x 0.65 mm bp 6x v A B A B D SOT1118 A E A1 terminal 1 index area detail X C terminal 1 index area Lp (6x) y y1 C e 1 3 (8x) E1 (2x) 6 X

Contextual Info: Package outline HWQFN56R: plastic thermal enhanced very very thin quad flat package; no leads; 56 terminals; resin based; body 7 x 7 x 0.7 mm B D SOT1114-1 A terminal A1 index area E A detail X e1 1/2 e e L1 v w b 15 28 C C A B C y1 C y L 14 29 e e2 Eh 1/2 e

Contextual Info: PBSM5240PF 40 V, 2 A PNP low VCEsat BISS transistor with N-channel Trench MOSFET Rev. 2 — 20 April 2011 Product data sheet 1. Product profile 1.1 General description Combination of PNP low VCEsat Breakthrough In Small Signal (BISS) transistor and N-channel Trench MOSFET. The device is housed in a leadless medium power SOT1118

Contextual Info: Package outline XSON8: extremely thin small outline package; no leads; 8 terminals; body 1.2 x 1.0 x 0.35 mm 1 2 SOT1116 b 4 3 4x (2) L L1 e 8 7 e1 6 e1 5 e1 (8×)(2) A1 A D E terminal 1 index area 0.5 Dimensions Unit mm 1 mm scale A(1) A1 b D E e max 0.35 0.04 0.20 1.25 1.05

Contextual Info: PBSS4130PANP 30 V, 1 A NPN/PNP low VCEsat BISS transistor 12 December 2012 Product data sheet 1. General description NPN/PNP low VCEsat Breakthrough In Small Signal (BISS) transistor in a leadless medium power DFN2020-6 (SOT1118) Surface-Mounted Device (SMD) plastic package.

NXP SMD TRANSISTOR MARKING CODE s1

Contextual Info: 020 -6 PMDPB58UPE DF N2 20 V dual P-channel Trench MOSFET Rev. 1 — 19 June 2012 Product data sheet 1. Product profile 1.1 General description Dual small-signal P-channel enhancement mode Field-Effect Transistor FET in a leadless medium power DFN2020-6 (SOT1118) Surface-Mounted Device (SMD) plastic

TRANSISTOR SMD MARKING CODE 2P

Abstract: DFN2020 transistor marking codes 2P transistor footprint
Contextual Info: PBSS5260PAP 60 V, 2 A PNP/PNP low VCEsat BISS transistor 12 December 2012 Product data sheet 1. General description PNP/PNP low VCEsat Breakthrough In Small Signal (BISS) transistor in a leadless medium power DFN2020-6 (SOT1118) Surface-Mounted Device (SMD) plastic package.

Contextual Info: NXP PNP low VCEsat BISS/Trench MOSFET module PBSM5240PF in SOT1118 Unique 2-in-1 solution in an ultra-small leadless SOT1118 package This groundbreaking solution enables slim mobile devices and delivers best-in-class thermal performance to support higher currents and longer lifetimes.