| SOT1050 |
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NXP Semiconductors
|
Plastic ultra thin small outline package; no leads; 6 terminals |
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Original |
PDF
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| SOT1051-1 |
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NXP Semiconductors
|
Plastic thin fine-pitch ball grid array package; 273 balls |
|
Original |
PDF
|
| SOT1051-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT1051-1 |
|
Original |
PDF
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| SOT1052-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 2 x 3 x 0.5 mm |
|
Original |
PDF
|
| SOT1054-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT1054-1 |
|
Original |
PDF
|
| SOT1054-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin small outline package; no leads; 14 terminals; body 3 x 4 x 0.85 mm |
|
Original |
PDF
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| SOT1055-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 41 terminals; body 7 x 7 x 0.85 mm |
|
Original |
PDF
|
| SOT1056-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 38 terminals; resin based; body 4 x 4 x 0.9 mm |
|
Original |
PDF
|
| SOT1058-1 |
|
NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 136 balls |
|
Original |
PDF
|
| SOT1059-1 |
|
NXP Semiconductors
|
Plastic extremely thin small outline package; no leads; 10 terminals; UTLP based; body 1 x 2.5 x 0.5 mm |
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Original |
PDF
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