SOT93 |
|
STMicroelectronics
|
SOT93 - ASD & DISCRETES - TOURS |
Original |
PDF
|
14.58KB |
1 |
SOT930-1 |
|
NXP Semiconductors
|
Plastic thin fine-pitch ball grid array package; 208 balls; body 12 x 12 x 0.7 mm |
Original |
PDF
|
249.05KB |
1 |
SOT931-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced low profile small outline package; no leads; 10 terminals; resin based; body 4 x 4 x 1.1 mm |
Original |
PDF
|
220.51KB |
1 |
SOT932-1 |
|
NXP Semiconductors
|
Plastic thin fine-pitch ball grid array package; 176 balls; body 6 x 15 x 0.7 mm |
Original |
PDF
|
247.89KB |
1 |
SOT933-1 |
|
NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1 mm |
Original |
PDF
|
244.77KB |
1 |
SOT934-1 |
|
NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1 mm |
Original |
PDF
|
228.28KB |
1 |
SOT935-1 |
|
NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1 mm |
Original |
PDF
|
226.52KB |
1 |
SOT935-2 |
|
NXP Semiconductors
|
Plastic thermal enhanced low profile quad flat package; no leads; 56 terminals; resin based |
Original |
PDF
|
342.25KB |
1 |
SOT936-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced low profile quad flat package; no leads; 56 terminals; resin based |
Original |
PDF
|
225.96KB |
1 |
SOT936-2 |
|
NXP Semiconductors
|
Plastic thermal enhanced low profile quad flat package; no leads; 56 terminals; resin based |
Original |
PDF
|
227.03KB |
1 |
SOT938-1 |
|
NXP Semiconductors
|
Plastic, heatsink small outline package; 36 leads; low stand-off height |
Original |
PDF
|
224.25KB |
1 |
SOT939-1 |
|
NXP Semiconductors
|
Plastic, heatsink small outline package; 36 leads; low stand-off height |
Original |
PDF
|
224.8KB |
1 |