| SOT890-1 |
|
NXP Semiconductors
|
Plastic very thin fine-pitch ball grid array package; 353 balls; top 152 lands; stackable; body 14 x 14 x 0.6 mm |
Original |
PDF
|
323.33KB |
1 |
| SOT891 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT891 |
Original |
PDF
|
202.88KB |
1 |
| SOT891 |
|
NXP Semiconductors
|
Plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm |
Original |
PDF
|
218.76KB |
1 |
| SOT89_135 |
|
NXP Semiconductors
|
Tape reel SMD; standard product orientation 12NC ending 135 |
Original |
PDF
|
180.67KB |
2 |
| SOT893-1 |
|
NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 240 balls; body 11 x 11 x 1 mm |
Original |
PDF
|
256.35KB |
1 |
| SOT89-3EV-VREG |
|
Microchip Technology
|
Evaluation Boards - Linear Voltage Regulators (LDOs), Programmers, Development Systems, BOARD EVAL SOT89-3 VOLTAGE REG |
Original |
PDF
|
|
22 |
| SOT-89-3L |
|
Unknown
|
|
Scan |
PDF
|
165.79KB |
1 |
| SOT894-1 |
|
NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 280 balls; body 11 x 11 x 1 mm |
Original |
PDF
|
261.68KB |
1 |
| SOT895-1 |
|
NXP Semiconductors
|
Plastic flanged cavity package; 2 mounting slots; 2 leads |
Original |
PDF
|
222.83KB |
1 |
| SOT895a |
|
NXP Semiconductors
|
Plastic flanged cavity package; 2 mounting slots; 2 leads |
Original |
PDF
|
222.79KB |
1 |
| SOT896B |
|
NXP Semiconductors
|
Plastic earless flanged cavity package; 2 leads |
Original |
PDF
|
218.19KB |
1 |
| SOT898-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced thin quad flat package; no leads; 48 terminals; body 7 x 7 x 1 mm |
Original |
PDF
|
229.5KB |
1 |
| SOT899-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin small outline package; no leads; 2 terminals; body 3 x 2 x 0.85 mm |
Original |
PDF
|
224.49KB |
1 |
| SOT89 Package |
|
Zetex Semiconductors
|
Package Dimensions |
Original |
PDF
|
26.93KB |
1 |
