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    SOT-86 Search Results

    SOT-86 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MKZ36V
    		Toshiba Electronic Devices & Storage Corporation Zener Diode, 36 V, SOT-23 Datasheet
    MUZ6V2
    		Toshiba Electronic Devices & Storage Corporation Zener Diode, 6.2 V, SOT-323 Datasheet
    MKZ30V
    		Toshiba Electronic Devices & Storage Corporation Zener Diode, 30 V, SOT-23 Datasheet
    MSZ36V
    		Toshiba Electronic Devices & Storage Corporation Zener Diode, 36 V, SOT-346 Datasheet
    MKZ5V6
    		Toshiba Electronic Devices & Storage Corporation Zener Diode, 5.6 V, SOT-23 Datasheet

    SOT-86 Datasheets (14)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    SOT860-1
    		NXP Semiconductors Plastic thermal enhanced ball grid array package; 624 balls; body 40 x 40 x 1.75 mm; heatsink Original PDF 302.19KB 1
    SOT861-1
    		NXP Semiconductors Plastic thin fine-pitch ball grid array package; 280 balls; body 14 x 14 x 0.7 mm Original PDF 311.63KB 1
    SOT862-1
    		NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 336 balls; body 12 x 12 x 1.05 mm Original PDF 265.27KB 1
    SOT862-2
    		NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 336 balls; body 12 x 12 x 1 mm Original PDF 265.28KB 1
    SOT863-1
    		NXP Semiconductors Plastic thermal enhanced low profile land grid array package; 48 lands; resin based; body 8 x 7 x 1.4 mm Original PDF 226.82KB 1
    SOT864-1
    		NXP Semiconductors Plastic thermal enhanced thin shrink small outline package; 24 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad Original PDF 229.91KB 1
    SOT865-1
    		NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm Original PDF 226.59KB 1
    SOT865-2
    		NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm Original PDF 233.8KB 1
    SOT865-2
    		NXP Semiconductors Footprint information for reflow soldering of HVQFN32 package Original PDF 243.34KB 1
    SOT865-3
    		NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm Original PDF 229.66KB 1
    SOT865-3
    		NXP Semiconductors Footprint for reflow soldering SOT865-3 Original PDF 243.37KB 1
    SOT866-1
    		NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 6 x 6 x 0.85 mm Original PDF 226.73KB 1
    SOT868-1
    		NXP Semiconductors Plastic thin fine-pitch ball grid array package; 240 balls; body 12 x 12 x 0.7 mm Original PDF 251.58KB 1
    SOT869-1
    		NXP Semiconductors Plastic ball grid array package; 288 balls; body 27 x 27 x 1.55 mm Original PDF 259.78KB 1