| SOT774-2 |
|
NXP Semiconductors
|
Plastic low profile ball grid array package; 208 balls; body 17 x 17 x 1 mm |
Original |
PDF
|
249.99KB |
1 |
| SOT775a |
|
NXP Semiconductors
|
leadless surface mounted package; plastic cap; 16 terminations |
Original |
PDF
|
235.92KB |
1 |
| SOT776-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced shrink small outline package; no leads; 14 terminals; body 12 x 12 x 2.1 mm |
Original |
PDF
|
236.39KB |
1 |
| SOT777-1 |
|
NXP Semiconductors
|
Plastic thin fine-pitch ball grid array package; 100 balls; body 6 x 6 x 0.8 mm |
Original |
PDF
|
247.95KB |
1 |
| SOT777-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT777-1 |
Original |
PDF
|
11.34KB |
1 |
| SOT778-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT778-1 |
Original |
PDF
|
19.24KB |
1 |
| SOT778-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm |
Original |
PDF
|
228.6KB |
1 |
| SOT778-2 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm |
Original |
PDF
|
228.08KB |
1 |
| SOT778-3 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm |
Original |
PDF
|
228.54KB |
1 |
| SOT778-4 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm |
Original |
PDF
|
227.38KB |
1 |
| SOT778-5 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm |
Original |
PDF
|
232.51KB |
1 |
| SOT779-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm |
Original |
PDF
|
267.67KB |
1 |
