SOT600-1 |
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NXP Semiconductors
|
Plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.8 mm |
Original |
PDF
|
251.58KB |
1 |
SOT601-1 |
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NXP Semiconductors
|
Plastic thin fine-pitch ball grid array package; 280 balls; body 16 x 16 x 0.8 mm |
Original |
PDF
|
259.8KB |
1 |
SOT602-1 |
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NXP Semiconductors
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Plastic thermal enhanced ball grid array package; 256 balls; body 27 x 27 x 0.9 mm; heatsink |
Original |
PDF
|
259.46KB |
1 |
SOT603-1 |
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NXP Semiconductors
|
Plastic thermal enhanced ball grid array package; 420 balls; body 35 x 35 x 0.9 mm; heatsink |
Original |
PDF
|
281.46KB |
1 |
SOT604-1 |
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NXP Semiconductors
|
Plastic thermal enhanced ball grid array package; 504 balls; body 35 x 35 x 0.9 mm; heatsink |
Original |
PDF
|
288.15KB |
1 |
SOT605-1 |
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NXP Semiconductors
|
Plastic thermal enhanced ball grid array package; 600 balls; body 40 x 40 x 0.9 mm; heatsink |
Original |
PDF
|
296.16KB |
1 |
SOT607-1 |
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NXP Semiconductors
|
Plastic thin shrink small outline package; 30 leads; body width 4.4 mm; lead pitch 0.5 mm |
Original |
PDF
|
230.63KB |
1 |
SOT608a |
|
NXP Semiconductors
|
Flanged ceramic package; 2 mounting holes; 2 leads |
Original |
PDF
|
336.49KB |
1 |
SOT608A_112 |
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NXP Semiconductors
|
CDFM2; blister pack; standard product orientation 12NC ending 112 |
Original |
PDF
|
121.29KB |
2 |
SOT608B |
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NXP Semiconductors
|
ceramic earless flanged package; 2 leads |
Original |
PDF
|
327.99KB |
1 |
SOT610-1 |
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NXP Semiconductors
|
Plastic thermal enhanced ball grid array package; 456 balls; body 35 x 35 x 1.8 mm; heatsink |
Original |
PDF
|
281.84KB |
1 |
SOT611-1 |
|
NXP Semiconductors
|
Plastic ball grid array package; 329 balls; body 31 x 31 x 1.75 mm |
Original |
PDF
|
265.89KB |
1 |
SOT611-2 |
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NXP Semiconductors
|
Plastic ball grid array package; 329 balls; body 31 x 31 x 1.75 mm |
Original |
PDF
|
265.93KB |
1 |
SOT612-2 |
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NXP Semiconductors
|
Plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad |
Original |
PDF
|
249.91KB |
1 |
|
SOT612-3 |
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NXP Semiconductors
|
Plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad |
Original |
PDF
|
250.72KB |
1 |
SOT612-4 |
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NXP Semiconductors
|
Plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad |
Original |
PDF
|
252.05KB |
1 |
SOT616-1_115 |
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NXP Semiconductors
|
HVQFN24; Reel pack; SMD, 7"Q1/T1 Standard product orientationOrderable part number ending ,115 or XOrdering code (12NC) ending 115 |
Original |
PDF
|
206.15KB |
4 |
SOT616-3 |
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NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm |
Original |
PDF
|
226.72KB |
1 |
SOT616-3_118 |
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NXP Semiconductors
|
HVQFN24; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 |
Original |
PDF
|
269.55KB |
4 |
SOT616-3_128 |
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NXP Semiconductors
|
HVQFN24; Reel pack; SMD, 13", Turned Q2/T3 Standard product orientation Orderable part number ending ,128 or HP Ordering code (12NC) ending 128 |
Original |
PDF
|
269.76KB |
4 |