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SOT560-1
|
|
NXP Semiconductors
|
Plastic thermal enhanced bottom chip carrier; 32 terminals; body 5 x 5 x 0.65 mm |
Original |
PDF
|
231.93KB |
1 |
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SOT560-1
|
|
NXP Semiconductors
|
Footprint for reflow soldering SOT560-1 |
Original |
PDF
|
21.71KB |
1 |
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SOT-563
|
|
SYNC Power
|
OUTLINE |
Original |
PDF
|
25.9KB |
1 |
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SOT564-1
|
|
NXP Semiconductors
|
Footprint for reflow soldering SOT564-1 |
Original |
PDF
|
15.37KB |
1 |
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SOT564-1
|
|
NXP Semiconductors
|
Plastic thermal enhanced bottom chip carrier; 24 terminals; body 4 x 4 x 0.65 mm |
Original |
PDF
|
231.54KB |
1 |
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SOT566-1
|
|
NXP Semiconductors
|
Plastic, heatsink small outline package; 24 leads |
Original |
PDF
|
234.3KB |
1 |
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SOT566-2
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|
NXP Semiconductors
|
Plastic, heatsink small outline package; 24 leads; low stand-off height |
Original |
PDF
|
234.39KB |
1 |
|
SOT566-3
|
|
NXP Semiconductors
|
Plastic, heatsink small outline package; 24 leads; low stand-off height |
Original |
PDF
|
234.41KB |
1 |
|
SOT567a
|
|
NXP Semiconductors
|
leadless surface mounted package; plastic cap; 8 terminations |
Original |
PDF
|
235.24KB |
1 |
|
SOT569-1
|
|
NXP Semiconductors
|
Footprint for reflow soldering SOT569-1 |
Original |
PDF
|
11.56KB |
1 |
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SOT569-1
|
|
NXP Semiconductors
|
Plastic thin fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.8 mm |
Original |
PDF
|
243.82KB |
1 |
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SOT569-2
|
|
NXP Semiconductors
|
Footprint for reflow soldering SOT569-2 |
Original |
PDF
|
10.81KB |
1 |
|
SOT569-2
|
|
NXP Semiconductors
|
Plastic thin fine-pitch ball grid array package; 144 balls |
Original |
PDF
|
238.59KB |
1 |
