SOP16 PACKAGE Search Results

Contextual Info: SOP16-P-300-1.27-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 0.21 TYP. 3/Dec. 5, 1996

Contextual Info: Reliability Tests Report Product Name: TC74HC4040AF Package Name: SOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TC74HC139AF Package Name: SOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TC74HC191AF Package Name: SOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TC74HC161AF Package Name: SOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TC74VHC368F Package Name: SOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TC74VHC161F Package Name: SOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TC74VHC165F Package Name: SOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TC74HC40105AF Package Name: SOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TC74HC153AF Package Name: SOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TC74VHC4052AF Package Name: SOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TC74VHC138F Package Name: SOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TC74HC40103AF Package Name: SOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TC74HC193AF Package Name: SOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

SOP16

Abstract: DSA0049831 SOP16 package
Contextual Info: SOP16-P-300-1.27-K Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

BA6321

Abstract: FG servo motor control BA6301 single phase motor speed control motor speed motor servo application note motor speed control servo Speed servo Drum Capstan System
Contextual Info: FG system speed servo controls BA6301 BA6301F BA6321 The BA6301/F and the BA6321 are single package servo control ICs suitable for controlling the speed of a video cassette recorder motor. Dimensions Units : mm BA6301 and BA6321 (DIP16) Features • available in DIP16 and SOP16

bridge rectifier diode toshiba

Contextual Info: Photocouplers for DAA Circuits TLP270D/TLP270G 14-Pin SOP NEW PRODUCT GUIDE Toshiba's TLP270D and TLP270G represent a new type of photocoupler; they provide many required multi-functions in DAA circuits for communication modems and are conveniently integrated into one small 14-pin SOP (SOP16 package).

SOP16 Package

Abstract: sop16
Contextual Info: 16-Pin Small Outline Package SOP16 Package Outline Dimensions Outline Dimensions Unit: mm 1.27 8 0.43 +0.07 –0.04 10.8 max 0.1 Land Pattern Example 0.25 +0.075 0 ～10゜ 0.8 ±0.2 0.25 M Enlarged view of A A 0.1 +0.1 –0.05 1.5 ±0.2 10.3 ±0.2 1.9 max

076E07S

Contextual Info: ZMD-Standard March 1998 Package SOP16 150 mil MDS 752 Dimensions in millimetres Based on IEC 191-2Q: Type 076E07S 1 Dimensions View X 0,1 LP A1 Z HE E 16 1 D Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax 1,73 Amin 1,55 bPmin 0,35 A1min 0,127

Contextual Info: LY8221 Rev. 1.4 3.0W Stereo & 3D Enhancement Class D Audio Power Amplifier SOP16 FEATURES GENERAL DESCRIPTION „ 3.0W stereo into 4Ω from 5.5V power supply at THD+N = 10%. „ 2.5V~5.5V Power supply. „ Low shutdown Current. „ Low Quiescent Current.

for Push-Pull TL494

Abstract: TL494N TL494 tl494 pwm circuits TL494 pin diagram 5volt amplifier circuit diagram PMW TL494 tl494 adjustable tl494 application tl494 regulator
Contextual Info: Pulse-Width-Modulation Control Circuits TL494 SOP16/DIP16 FEATURES TOP VIEW ● Complete PWM Power Control Circuitry ● Uncommitted Outputs for 200 Ma Sink or Source Current ● Output Control Selects Single-Ended or Push-Pull Operation ● Internal Circuitry Prohibits Double Pulse at Either Output

Contextual Info: T O SH IB A TENTATIVE TLP270D TOSHIBA PHOTOCOUPLER M OBILE/NOTE PCs GaAs IRED & PHOTO-MOS FET/PHOTO-TRANSISTOR TLP270D PDAs MULTIMEDIA TVs MODEMS TLP270D has many multi-functions in DAA circuits for modems, which is a fully integrated design photocoupler in a 14pin SOP16

AQS221R2S

Abstract: AQS221N2S AQS221N2SX AQS221N2SZ AQS221R2SX AQS221R2SZ
Contextual Info: RF SOP 4 Form A CxR10 AQS221❍2S Space-saving low C×R type with 4 channels in a SOP16-pin package 10.37 .408 4.4 .173 2.1 .083 mm inch 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 Compliance with RoHS Directive RF SOP 4 Form A C×R10 (AQS221❍2S) FEATURES

Contextual Info: 16P2P-A Plastic 16pin 225mil SOP EIAJ Package Code SOP16-P-225-1.27 JEDEC Code MS–012AC Weight g 0.13 Lead Material Cu Alloy e E Recommended Mount Pad 1 F 8 Symbol A D A2 A1 b y L e L1 HE e1 I2 9 16 b2 c Detail F A A1 A2 b c D E e HE L L1 y b2 e1 I2 Dimension in Millimeters